Journal ArticleDOI
A novel pulsed magnetron sputter technique utilizing very high target power densities
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TLDR
In this paper, the potential for high-aspect-ratio trench filling applications by high power pulsed magnetron sputtering is demonstrated by deposition in via-structures.Abstract:
Using a novel pulsed power supply in combination with a standard circular flat magnetron source, operated with a Cu target, a peak power density of 2800 W cm -2 was achieved. This results in a very intense plasma with peak ion current densities of up to 3.4 A cm −2 at the substrate situated 10 cm from the target. The ionized fraction of the deposited Cu flux was estimated to be approximately 70% from deposition rate measurements. The potential for high-aspect-ratio trench filling applications by high power pulsed magnetron sputtering is demonstrated by deposition in via-structures. The high power pulsed technique also results in a higher degree of target utilization and an improved thickness uniformity of the deposited films compared with conventional d.c. magnetron sputtering.read more
Citations
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Ionized physical vapor deposition (IPVD): A review of technology and applications
TL;DR: In this article, the development and application of magnetron sputtering systems for ionized physical vapor deposition (IPVD) is reviewed, and the application of a secondary discharge, inductively coupled plasma magnetron (ICP-MS), microwave amplified magnetron, and self-sustained sputtering (SSS) is discussed as well as the hollow cathode magnetron discharges.
Journal ArticleDOI
The Mn+1AXn phases: Materials science and thin-film processing
TL;DR: A critical review of the M(n + 1)AX(n) phases from a materials science perspective is given in this article, where the authors discuss the potential for low-temperature synthesis, which is essential for deposition of MAX phases onto technologically important substrates.
Journal ArticleDOI
High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
TL;DR: High power pulsed magnetron sputtering (HPPMS) is an emerging technology that has gained substantial interest among academics and industrials alike as discussed by the authors, also known as HIPIMS (high power impulse...
Book
Handbook of physical vapor deposition (PVD) processing
TL;DR: Physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing is discussed in this paper.
Journal ArticleDOI
A structure zone diagram including plasma-based deposition and ion etching
TL;DR: In this article, an extended structure zone diagram is proposed that includes energetic deposition, characterized by a large flux of ions typical for deposition by filtered cathodic arcs and high power impulse magnetron sputtering.
References
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Journal ArticleDOI
Metal ion deposition from ionized mangetron sputtering discharge
TL;DR: In this article, a technique was developed for highly efficient postionization of sputtered metal atoms from a magnetron cathode, based on conventional magnetron sputtering with the addition of a high density, inductively coupled rf (RFI) plasma in the region between the sputtering cathode and the sample.
Journal ArticleDOI
Unbalanced dc magnetrons as sources of high ion fluxes
B. Window,Nick Savvides +1 more
TL;DR: In this article, the characteristics of a new design of magnetron sputter source (a UM‐gun), based on the principle of an unbalanced magnetic design, and capable of giving ion fluxes at the substrate greater than the flux of depositing atoms, were reported.
Journal ArticleDOI
Mass and energy resolved detection of ions and neutral sputtered species incident at the substrate during reactive magnetron sputtering of Ti in mixed Ar+N2 mixtures
TL;DR: In this article, the flux of ions and neutral sputtered particles incident at the growth surface during the deposition of TiN by reactive magnetron sputtering from a Ti target in mixed Ar+N2 discharges were determined using a combination of in situ double-modulation mass spectrometry, Langmuir probe, discharge, deposition rate, and film composition measurements.
Patent
Process and apparatus for coating conducting pieces using a pulsed glow discharge
TL;DR: In this article, a process and apparatus for coating conductive workpieces by ionized vapors with the assistance of a glow discharge includes providing a periodically pulsed input of energy for the discharge so that stress on the parts is reduced and a smooth coating results.
Journal ArticleDOI
Sustained self sputtering of different materials using dc magnetron
TL;DR: In this paper, a relation between the minimum values of the target current, (target current density, target power density) and the working gas (argon) pressure, at which the discharge still exists, was proposed as an instrument of the self-sputtering effect.