A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
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"A Practical Implementation of Silic..." refers background in this paper
...Tuckerman and Pease [1] where the silicon substrate below the channels was only 0....
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...This compares favorable to the 9.0 C-mm W thermal resistance reported in the work of Tuckerman and Pease [1] where the silicon substrate below the channels was only 0.1-mm thick and the pressure drop was much higher....
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...I. INTRODUCTION MORE than 20 years ago, Tuckerman and Pease first de-scribed the use of microchannel cooling for very high power densities [1]....
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207 citations
"A Practical Implementation of Silic..." refers background in this paper
...Recent progress in high-rate reactive ion etching (DRIE) of Si [2] has greatly...
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165 citations
"A Practical Implementation of Silic..." refers background in this paper
...exchanger zones with shorter channel lengths [3] and manifold designs with large cross-sectional area (i....
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154 citations
Additional excerpts
...have been proposed for microchannel coolers [6]....
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59 citations
"A Practical Implementation of Silic..." refers background in this paper
...fins in microchannel coolers have been found to increase the heat transfer coefficient compared to continuous fins [5]....
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