Proceedings ArticleDOI
A review of thermal management in power converters with thermal vias
Deepak Gautam,Dale Wager,Fariborz Musavi,Murray Edington,Wilson Eberle,William G. Dunford +5 more
- pp 627-632
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TLDR
In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of devices in power electronics converters is presented, based on the conclusions drawn from the available literature and practical manufacturing guidelines, four different via patterns for a single power device are selected and their thermal performances are studied.Abstract:
One important challenge in power electronics design is removing the heat cost effectively from the power devices. A thermal via is a small diameter hole plated with copper and is used to transfer the heat from one side of the printed circuit board (PCB) to the other side. In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of devices in power electronics converters are presented. Key advantages of using PCB's for thermal management are also presented. Based on the conclusions drawn from the available literature and practical manufacturing guidelines, four different via patterns for a single power device are selected and their thermal performances are studied. Each of the four via patterns is laid out multiple times on the same PCB. A power component in a D2PAK is soldered to each of the patterns. The PCB is attached to a liquid cooled cold plate. The devices are powered up and a thermal imaging camera is used to record the temperature of the device. The experimental results presented closely matches with the theoretical prediction and helps in identifying the most efficient thermal via pattern.read more
Citations
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Proceedings ArticleDOI
Silicon carbide power chip on chip module based on embedded die technology with paralleled dies
Guillaume Regnat,Pierre-Olivier Jeannin,Guillaume Lefèvre,Jeffrey Ewanchuk,David Frey,Stefan Mollov,Jean-Paul Ferrieux +6 more
TL;DR: A parallelization technique enabling impedance balancing is developed for the layout and validated using four parallel Silicon Carbide (SiC) MOSFETs and the thermal management of the module is studied and die attach with direct copper filled vias is validated.
Proceedings ArticleDOI
A comparison of thermal vias patterns used for thermal management in power converter
TL;DR: In this article, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of power electronics devices is presented based on the results from available literature and practical manufacturing guidelines, four different via patterns for single power devices are selected.
Proceedings ArticleDOI
Thermal Management Strategies for a High-Frequency, Bi-Directional, On-Board Electric Vehicle Charger
Kshitij Gupta,Carlos Da Silva,Miad Nasr,Amir Assadi,Hirokazu Matsumoto,Olivier Trescases,Cristina H. Amon +6 more
TL;DR: In this article, the authors investigated thermal management strategies for a high-density on-board SiC-based 6.6 kW charger with grid-to-vehicle (G2V), V2H, V2G and V2V power transfer capabilities, and showed that adding thermal vias below the MOSFET drain and attaching a heat sink on the other side of the printed circuit board (PCB) is the most effective method to maintain their temperature.
Proceedings ArticleDOI
Performance comparison of thermal interface materials for power electronics applications
TL;DR: In this article, a detailed comparison of the properties of various off-the-shelf available TIMs to be specifically used between PCB with thermal vias and heat sink is presented, and experimental results are presented to determine the thermal performance of various TIMs.
Proceedings ArticleDOI
Thermal analysis of a magnetic packaged power module
TL;DR: The thermal analysis of the proposed integrated power module packaged with magnetic component is presented, which has better thermal performance than conventional plastic packaged power modules and two other commercial products.
References
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Proceedings ArticleDOI
An automotive on-board 3.3 kW battery charger for PHEV application
TL;DR: In this article, a 3.3kW two-stage battery charger design is presented for a plug-in hybrid electric vehicle (PHEV) application to achieve high efficiency, which is critical to minimize the charger size, charging time and the amount and cost of electricity drawn from the utility.
Proceedings ArticleDOI
Optimization of thermal via design parameters based on an analytical thermal resistance model
TL;DR: In this paper, a simple analytical model that provides an efficient approach for analysis of thermal via pads is presented, where small vias close to one another form a cluster with a relatively large dimension.
Proceedings ArticleDOI
PCB Thermal Via Optimization using Design of Experiments
TL;DR: In this paper, a fractional factorial designed experiment (DOE) was developed using MINITABtrade statistical software for the following thermal via and PCB factors, evaluated at two levels: via diameter, pitch, and barrel thickness as well as PCB top Cu pad area and number of metalized layers.
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PCB thermal design improvement through thermal vias
TL;DR: An approach based on design of different experiments for improvement the thermal paths in PCB through thermal vias is offered in this article, where an efficient thermal via placed on the PCB decreases the junction temperature of the package.
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A zero voltage switching full-bridge DC-DC converter for an on-board PHEV battery charger
TL;DR: In this article, a DC-DC converter for a plug-in hybrid electric vehicle (PHEV) is presented, which achieves a peak efficiency of 96% at a full load of 3.3 kW at 400V output with a 400V input and a switching frequency of 200 kHz.