A Semi-Analytical and Computationally Efficient Method to Calculate the Touch-Point Pressure and Pull-In Voltage of a MEMS Pressure Sensor With a Circular Diaphragm
15 Jan 2021-IEEE Sensors Journal (Institute of Electrical and Electronics Engineers (IEEE))-Vol. 21, Iss: 2, pp 1332-1339
TL;DR: In this paper, a semi-analytical approach is presented for evaluating pull-in voltage and touch-point pressure along with the mechanical and capacitive sensitivity for a circular diaphragm based capacitive pressure transducer.
Abstract: Micro-Electromechanical Systems (MEMS) based capacitive pressure transducers have a pivotal role in transducer devices for real-world applications. Thus, the efficient analysis for modelling these transducers is increasingly becoming important. These transducers use diaphragms of various geometries, however for the same active area, circular diaphragms are more sensitive as compared to square diaphragms. Pull-in voltage and touch-point pressure are two parameters which determine the performance of a micro- electromechanical systems device. In this work a complete analysis is presented for evaluating these parameters along with the mechanical and capacitive sensitivity for a circular diaphragm based capacitive pressure transducer. The effect of thickness and radius of the diaphragm has been illustrated, as they form the essential design parameters for fabricating the micro-electromechanical systems devices. Literature review suggests that relatively less work has been reported for this analysis and more complicated and computationally complex methods have been used. The semi-analytical approach presented in this research is less complex and computationally efficient, in comparison to finite element method (FEM). Critical differentiator of this formulation is related to its applicability for analysing sensor parameters with or without considering the effect of electrostatic pressure on diaphragm deflection. Furthermore, this analysis eliminates the need for determining spring constant k which is used in lumped element methods. MATLAB has been used to compute and simulate the results. The mathematical model developed is verified with a standard Finite Element Analysis (FEM) using COMSOL v5.5.
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01 Jan 2016
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TL;DR: In this paper, the pull-in phenomenon associated with the capacitive sensing mechanism of artificial hair flow-sensor (HFS), as an important design parameter to improve reliability, robustness, and sensitivity of the sensor, is investigated theoretically and verified experimentally.
Abstract: In capacitive MEMS sensors, the excitation voltage is necessary for operating the device and increasing the sensitivity. For reliable operation, the amplitude of the excitation voltage is restricted by the pull-in voltage of the sensor. This paper investigates the pull-in phenomenon associated with the capacitive sensing mechanism of artificial hair flow-sensor (HFS), as an important design parameter to improve reliability, robustness, and sensitivity of the sensor. The pull-in voltage of the HFS is investigated theoretically and verified experimentally. The electrostatic force acting on the membrane, the pull-in voltage, and the deflection of the membrane for different excitation voltages are considered. The theoretical model together with the HFS design parameters is used to inspect the possible origin for the deviation between the theory and the experiments. Furthermore, we pointed out and stated the applicable conditions of the HFS based on the experimental results and theoretical analysis. Such a study forms a step further to improve the reliability of the HFS to be a suitable candidate for the utilization at different conditions and in various applications.
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References
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Book•
01 Jan 1959
TL;DR: In this article, the authors describe the bending of long RECTANGULAR PLATES to a cycloidal surface, and the resulting deformation of shels without bending the plates.
Abstract: CONTENTS: BENDING OF LONG RECTANGULAR PLATES TO A CYLINDRICAL SURFACE PURE BENDING OF PLATES SYMMETRICAL BENDING OF CIRCULAR PLATES SMALL DEFLECTIONS OF LATERALLY LOADED PLATES SIMPLY SUPPORTED RECTANGULAR PLATES RECTANGULAR PLATES WITH VARIOUS EDGE CONDITIONS CONTINUOUS RECTANGULAR PLATES PLATES ON ELASTIC FOUNDATION PLATES OF VARIOUS SHAPES SPECIAL AND APPROXIMATE METHODS IN THEORY OF PLATES BENDING OF ANISTROPIC PLATES BENDING OF PLATES UNDER THE COMBINED ACTION OF LATERAL LOADS AND FORCES IN THE MIDDLE PLANE OF THE PLATE LARGE DEFLECTIONS OF PLATES DEFORMATION OF SHELLS WITHOUT BENDING GENERAL THEORY OF CYLINDRICAL SHELLS SHELLS HAVING THE FORM OF A SURFACE OF REVOLUTION AND LOADED SYMMETRICALLY WITH RESPECT TO THEIR AXIS.
10,200 citations
01 May 1982
TL;DR: This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures.
Abstract: Single-crystal silicon is being increasingly employed in a variety of new commercial products not because of its well-established electronic properties, but rather because of its excellent mechanical properties. In addition, recent trends in the engineering literature indicate a growing interest in the use of silicon as a mechanical material with the ultimate goal of developing a broad range of inexpensive, batch-fabricated, high-performance sensors and transducers which are easily interfaced with the rapidly proliferating microprocessor. This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures. Finally, the potentials of this new technology are illustrated by numerous detailed examples from the literature. It is clear that silicon will continue to be aggressively exploited in a wide variety of mechanical applications complementary to its traditional role as an electronic material. Furthermore, these multidisciplinary uses of silicon will significantly alter the way we think about all types of miniature mechanical devices and components.
2,723 citations
Journal Article•
TL;DR: In this article, the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures are discussed.
Abstract: Single-crystal silicon is being increasingly employed in a variety of new commercial products not because of its well-established electronic properties, but rather because of its excellent mechanical properties. In addition, recent trends in the engineering literature indicate a growing interest in the use of silicon as a mechanical material with the ultimate goal of developing a broad range of inexpensive, batch-fabricated, high-performance sensors and transducers which are easily interfaced with the rapidly proliferating microprocessor. This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures. Finally, the potentials of this new technology are illustrated by numerous detailed examples from the literature. It is clear that silicon will continue to be aggressively exploited in a wide variety of mechanical applications complementary to its traditional role as an electronic material. Furthermore, these multidisciplinary uses of silicon will significantly alter the way we think about all types of miniature mechanical devices and components.
2,707 citations
Book•
[...]
01 Jan 2001
TL;DR: In this article, a minor numerical error in going from Eq. 16.39 to eq.16.40 is found, which has an obvious effect on the calculations that follow, increasing the minimum detectable temperature change to about 2 mK.
Abstract: p. 445 There is a minor numerical error in going from Eq. 16.39 to Eq. 16.40. The factor of 2 in the 1/f term was omitted, so the correct numerator for the second term in Eq. 16.40 is 1.44 x 10 -7 . This error has an obvious effect on the calculations that follow, increasing the minimum detectable temperature change to about 2 mK (Eq. 16.44) and, correspondingly, increasing the RMS noise calculated from Eq. 16.49 by sqrt(2).
1,917 citations
"A Semi-Analytical and Computational..." refers background in this paper
...An exact determination of these parameters is necessary for determining the frequency response, errors and sensitivity of these MEMS devices [9], [10]....
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...They make use of diaphragms to vary the capacitance with applied pressure, force or acceleration [8]–[10]....
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TL;DR: Timoshenko as mentioned in this paper is one of the outstanding exponents of the mathematical theory of elasticity and of the application of this theory to a variety of practical problems, and has written on these topics for thirty years, and his books have become indispensable to every engineer who has to apply mathematical principles and methods to such problems.
Abstract: PROF. TIMOSHENKO is one of the outstanding exponents of the mathematical theory of elasticity and of the application of this theory to a variety of practical problems. He has written on these topics for thirty years, and his books have become indispensable to every engineer who has to apply mathematical principles and methods to such problems. Theory of Plates and Shells By Prof. S. Timoshenko. (Engineering Societies Monographs.) Pp. xii + 492. (New York and London: McGraw–Hill Book Co., Inc., 1940.) 42s.
1,097 citations
"A Semi-Analytical and Computational..." refers background in this paper
...For a given area, the circular diaphragm is much more sensitive than a square diaphragm [11], [17]–[19]....
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...The theory of small deflection for plate bending assumes that diaphragm deflections are small in comparison with the plate thickness [11]....
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...When the diaphragm deflection is smaller than the gap between the two electrodes, the sensor is said to operate in normal mode [7], [11]–[13]....
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