Journal ArticleDOI
A single-mask substrate transfer technique for the fabrication of high-aspect-ratio micromachined structures
Reads0
Chats0
TLDR
In this paper, a single-mask substrate transfer process for the fabrication of high-aspect-ratio (HAR) suspended structures is presented, where the HAR silicon structures are fabricated using a deep reactive ion etching (DRIE) technique and then transferred to a glass wafer using silicon/thin film/glass anodic bonding and silicon thinning techniques.Abstract:
In this paper, a single-mask substrate transfer process for the fabrication of high-aspect-ratio (HAR) suspended structures is presented. The HAR silicon structures are fabricated using a deep reactive ion etching (DRIE) technique and then transferred to a glass wafer using silicon/thin film/glass anodic bonding and silicon thinning techniques. The HAR structures are released using self-aligned wet etching of the glass. Two key processes are discussed. One is the silicon/thin film/glass anodic bonding, with special emphasis on the effect of the bonding material on the bonding shear strength. The other is the silicon backside thinning via aqueous solution of potassium hydroxide (KOH). A lateral RF MEMS switch has been fabricated and demonstrates low loss up to 25 GHz. This substrate transfer process has the advantages of high-aspect ratio, low loss and high flexibility.read more
Citations
More filters
Journal ArticleDOI
Experiments of mass transfer with liquid-liquid slug flow in square microchannels
N. Di Miceli Raimondi,N. Di Miceli Raimondi,Laurent E. Prat,Laurent E. Prat,Christophe Gourdon,Christophe Gourdon,J. Tasselli +6 more
TL;DR: In this paper, a liquid-liquid mass transfer mechanism with slug flow in microreactor is investigated by means of experiments in square microchannels of 0.2 and 0.3 mm width.
Book
RF MEMS Switches and Integrated Switching Circuits
TL;DR: In this paper, the authors present a review of RF MEMS switches and switching circuits in the past five years, focusing on the development of lateral DC-contact switches and capacitive shunt switches.
Journal ArticleDOI
Slow invasion of a fluid from multiple inlet sources in a thin porous layer: influence of trapping and wettability.
Loic Ceballos,Marc Prat +1 more
TL;DR: Numerically the process of quasistatic invasion of a fluid in thin porous layers from multiple inlet injection sources focusing on the effect of trapping or mixed wettability, that is, when hydrophobic and hydrophilic pores coexist in the system is studied.
A High Yield Rate MEMS Gyroscope with a Packaged SiOG Process
TL;DR: In this article, the authors proposed a SiOG (Silicon On Glass) technology to improve the yield rate of a vibratory gyroscope by using a silicon wafer and two glass wafers to minimize the wafer bowing and a metallic membrane to avoid the notching effect.
Journal ArticleDOI
A silicon-on-glass single-pole-double- throw (SPDT) switching circuit integrated with a silicon-core metal-coated transmission line
TL;DR: In this paper, a low-loss single-pole-double-throw (SPDT) switching circuit was designed and fabricated using high-resistivity silicon (HRSi) as the core material and Pyrex 7740 glass as the substrate.
References
More filters
Proceedings ArticleDOI
Area-changed capacitive accelerometer using 3-mask fabrication process
TL;DR: In this article, an area-changed capacitive accelerometer using a 3-mask fabrication process is presented, where the accelerometer is designed as finger structures connected in parallel that have a differential capacitor arrangement.