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A Trapezoidal Cross-Section Stacked Gate FinFET with Gate Extension for Improved Gate Control

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TLDR
The simulation study proves the suitability of the improved trapezoidal pile gate bulk FinFET device for low power applications with improved on/off current ratio, subthreshold swing (SS), drain induced barrier lowering (DIBL), Gate Induced Drain Leakage (GIDL) uniform distribution of electron charge density along the channel and effects of Augur recombination within the channel.
Abstract
An improved trapezoidal pile gate bulk FinFET device is implemented with an extension in the gate for enhancing the performance. The novelty in the design is trapezoidal cross-section FinFET with stacked metal gate along with extension on both sides. Such improved device structure with additional process cost exhibits significant enhancement in the performance metrics specially in terms of leakage current behavior. The simulation study proves the suitability of the device for low power applications with improved on/off current ratio, subthreshold swing (SS), drain induced barrier lowering (DIBL), Gate Induced Drain Leakage (GIDL) uniform distribution of electron charge density along the channel and effects of Augur recombination within the channel.

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Performance Analysis of Double Gate Junctionless Tunnel Field Effect Transistor: RF Stability Perspective

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Characterization of silicon nanowire transistor

TL;DR: In this article, the authors analyzed the temperature sensitivity of Silicon Nanowire Transistor (SiNWT) depends on the diameter (D.ch) of channel and investigated the possibility of utilizing SiNWT as a nano- temperature sensor.
References
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Journal ArticleDOI

Extremely scaled silicon nano-CMOS devices

TL;DR: Key elements of silicon-based CMOS technologies are described, including sublithographic patterning, the effects of crystal orientation and roughness on carrier mobility, gate work function engineering, circuit performance, and sensitivity to process-induced variations.
Journal ArticleDOI

Multi-gate SOI MOSFETs

TL;DR: In this paper, the authors describe the evolution of the SOI MOSFET from single-gate structures to multigate (double-gate, trigate, p-gate and gate-all-around) structures.
Book

Low-Power CMOS Circuits: Technology, Logic Design and CAD Tools

TL;DR: This chapter discusses the evolution of Deep Submicron Bulk and SOI Technologies, low-Power Circuits, and circuit techniques for leakage reduction in CMOS Nanometric Technologies.
Journal ArticleDOI

Effect of Fin Angle on Electrical Characteristics of Nanoscale Round-Top-Gate Bulk FinFETs

TL;DR: In this paper, the electrical characteristics of 25-nm round-top-gate fin-typed field effect transistors (FinFETs) on silicon wafers are numerically explored.
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