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Journal ArticleDOI

Academic and industry research progress in germanium nanodevices

Ravi Pillarisetty
- 17 Nov 2011 - 
- Vol. 479, Iss: 7373, pp 324-328
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TLDR
Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.
Abstract
Silicon has enabled the rise of the semiconductor electronics industry, but it was not the first material used in such devices. During the 1950s, just after the birth of the transistor, solid-state devices were almost exclusively manufactured from germanium. Today, one of the key ways to improve transistor performance is to increase charge-carrier mobility within the device channel. Motivated by this, the solid-state device research community is returning to investigating the high-mobility material germanium. Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.

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Citations
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Journal ArticleDOI

Materials Science Challenges to Graphene Nanoribbon Electronics.

TL;DR: Graphene nanoribbons (GNRs) have recently emerged as promising candidates for channel materials in future nanoelectronic devices due to their exceptional electronic, thermal, and mechanical properties and chemical inertness.
Journal ArticleDOI

Carrier density modulation in a germanium heterostructure by ferroelectric switching

TL;DR: A true ferro electric field effect-carrier density modulation in an underlying Ge(001) substrate is reported by switching of the ferroelectric polarization in epitaxial c-axis-oriented BaTiO3 grown by molecular beam epitaxy.
Journal ArticleDOI

Germanium p-Channel FinFET Fabricated by Aspect Ratio Trapping

TL;DR: In this article, scaled Ge p-channel FinFETs fabricated on a 300mm Si wafer using the aspect-ratio-trapping technique were reported. But, the performance of the Ge pFET was limited by the fact that the trap-assisted tunneling and a band-to-band tunneling leakage mechanism is responsible for an elevated bulk current limiting the OFF-state drain current.
Journal ArticleDOI

High-hole mobility polycrystalline Ge on an insulator formed by controlling precursor atomic density for solid-phase crystallization.

TL;DR: This study investigates the low-temperature solid-phase crystallization (SPC) of Ge on a glass substrate, focusing on the precursor conditions, to form SPC-Ge with a hole mobility of 340 cm2/Vs, the highest value among semiconductor thin films grown on insulators at low temperature (<900 °C).
Journal ArticleDOI

Recent advances in germanium nanocrystals: Synthesis, optical properties and applications

TL;DR: Germanium nanocrystals (Ge NCs) have recently attracted renewed scientific interest as environmentally friendlier alternatives to classical II-VI and IV-VI QDs containing toxic elements such as Hg, Cd and Pb.
References
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Proceedings ArticleDOI

A 90nm high volume manufacturing logic technology featuring novel 45nm gate length strained silicon CMOS transistors

TL;DR: In this article, the authors describe a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers, which features an epitaxially grown strained SiGe film embedded in the source drain regions.
Journal ArticleDOI

Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing

TL;DR: In this paper, a method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented.
Journal ArticleDOI

High-k/Ge MOSFETs for future nanoelectronics

TL;DR: In this article, the opportunities and challenges of high-k/Ge MOSFETs are discussed on the basis of the material properties of Ge oxide to provide insights for future progress.
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