scispace - formally typeset
Search or ask a question
Journal ArticleDOI

Academic and industry research progress in germanium nanodevices

Ravi Pillarisetty1
17 Nov 2011-Nature (Nature Publishing Group)-Vol. 479, Iss: 7373, pp 324-328
TL;DR: Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.
Abstract: Silicon has enabled the rise of the semiconductor electronics industry, but it was not the first material used in such devices. During the 1950s, just after the birth of the transistor, solid-state devices were almost exclusively manufactured from germanium. Today, one of the key ways to improve transistor performance is to increase charge-carrier mobility within the device channel. Motivated by this, the solid-state device research community is returning to investigating the high-mobility material germanium. Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.
Citations
More filters
Journal Article
TL;DR: In this article, the complexation conditions and complex characteristics of 1,2,3,4,6-O-galloyl-β-D-glucose (PGG), a typical hydrolyzable tannin, and Ge4+ were studied.
Abstract: The complexation conditions and complex characteristics of 1,2,3,4,6-O-galloyl-β-D-glucose (PGG), a typical hydrolyzable tannin, and Ge4+ were studied. Species of the PGG-Al3+ complex formed in various water-methanol systems (20% to 100%, v/v) were investigated. The results showed that the amount of PGG and Ge in the precipitate was substantially influenced by the initial Ge/PGG molar ratio. The highest amount of the precipitate was obtained at the initial Ge/PGG molar ratio of 1:2 and the stoichiometric ratio (Ge/PGG molar ratio) of the precipitates gradually decreased from 0.72 to 0.30 concomitant to a decrease in the initial Ge/PGG molar ratio from 1:1 to 1:4. Precipitation experiments of Ge4+ by four hydrolyzable tannins from Chinese gallnut (TA), chestnut shell (CT), Platycarya strobilacea infructescence (PT), and Valonia (VT) were compared. The results indicated that the amount of the precipitate was substantially influenced by the initial tannin/Ge ratio and pH and was slightly influenced by the reaction time. The highest amount of the precipitate was obtained at the initial tannin/Ge mass ratio of 2.3:1 and pH 7.2. Stability of the TA-Ge, CT-Ge, VT-Ge, and PT-Ge precipitates in several solutions was determined. The TA-Ge precipitates showed relatively high stability in the test solvents compared to that of other tannins.

4 citations


Cites background from "Academic and industry research prog..."

  • ...Similar to silicon, Ge is an excellent semiconductor, and it is widely used in rectifiers and transistors (Ravi 2011; Coteli et al. 2017)....

    [...]

Journal ArticleDOI
30 Mar 2017
TL;DR: In this paper, the influence of acid concentration on the InP fin recess in nanoscale trenches was explored using bulk InP as a reference and it was found that aqueous HCl solution was most suitable for revealing defects.
Abstract: In this work, we report on wet-chemical defect revealing in InP fin structures relevant for device manufacturing. Both HCl and HBr solutions were explored using bulk InP as a reference. A distinct difference in pit morphology was observed between the two acids, attributed to an anisotropy in step edge reactivity. The morphology of the etch pits in bulk InP suggests that the dislocations are oriented mainly perpendicular to the surface. By studying the influence of the acid concentration on the InP fin recess in nanoscale trenches, it was found that aqueous HCl solution was most suitable for revealing defects. Planar defects in InP fin structures grown by the aspect ratio trapping technique could be visualized as characteristic shallow grooves approximately one nanometer deep. It is challenging to reveal defects in wide-field InP fins. In these structures, dislocations also reach the surface next to stack faults or twinning planes. Due to the inclined nature, dislocation-related pits are only a few atomic layers deep. Extending the pits is limited by the high reactivity of the fin sides and the strong surface roughening during etching. The process window for revealing wet-chemical defects in InP fins is limited.

4 citations

Dissertation
01 Jun 2017
TL;DR: In this article, a thorough characterisation of high mobility 2DHGs in 0.8% and 1.3% compressively strained germanium quantum wells (sGe-QWs) grown on SiGe virtual substrates is presented.
Abstract: Terahertz time-domain spectroscopy (THz-TDS) allows the investigation, in a noncontact fashion and in the meV range (1 THz = 4.14 meV), of the coherent motion of particles close to their equilibrium position. In contrast with other optical spectroscopy techniques, THz-TDS gives the chance to perform phase-resolved measurements and to investigate quantum coherent phenomena within different materials or systems such as two dimensional hole or electron gases (2DHGs, 2DEGs). This thesis presents a thorough characterisation - by means of THz-TD magneto-spectroscopy (THz-TDMS) and polarisation resolved (PR)-THz-TDMS – of high mobility 2DHGs in 0.8% and 1.3% compressively strained germanium quantum wells (sGe-QWs) grown on SiGe virtual substrates. These are attractive systems for electronic and spintronic devices due to the compatibility of Ge with CMOS technology as well as their finite spin-orbit interaction (SOI). The SOI, driven by structural inversion asymmetry (SIA) in modulation doped SiGe heterostructures, can lift the spin degeneracy and provide spin-split states separated by the Rashba energy Δ even at zero external magnetic field. Results presented in the following thesis proved the strain-dependence of the Rashba spin-splitting as well as a non-contact determination of the g-factor, effective mass, transport lifetime and mobility. In addition to THz-TDMS, PR-measurements determined the off-diagonal conductivity σxy(ω,B). This was obtained by analysing the Faraday effect, which was seen as a change in the polarisation of the incident THz-pulse due to the presence of carriers within the QWs, under the application of a magnetic field. Determining σxy revealed, for the first time in a 2DHG, features of the optical quantum Hall effect (OQHE), i.e. the QHE driven by an a electric field (ac THz-field). The thesis ends with introducing rotatable polarisation THz-TDS experiments to study anisotropic materials. As an outlook of the presented work, this experimental technique can be exploited in order to evaluate the anisotropic mobility in sGeQWs.

4 citations


Cites background or methods from "Academic and industry research prog..."

  • ...This can be overcome by implementing lowdimensional structures, such as quantum wells (QWs) for FET (QW-FET) where enhanced carrier mobility at high carrier density can be obtained [20, 21]....

    [...]

  • ...Two dimensional systems are introduced in Section 2.2 where MOSFET and QW-FET are presented together with the description, by means of the effective mass approximation, of the quantum confinement....

    [...]

  • ...Contributed talk: “Split cyclotron resonances in strained Ge quantum well probed by THz time-domain spectroscopy”, ICOOPMA 2014, Leeds, UK (July 2014) vii List of abbreviations 2DEG/2DHG Two dimensional electron/hole gas AFM atomic force microscopy BIA bulk inversion asymmetry CB conduction band CES constant energy surface CMOS complementary metal oxide semiconductor CR cyclotron resonance CRA/CRI cyclotron active/inactive modes CVD chemical vapour deposition DOS density of states DP Dyakonov-Perel mechanism EFA envelope function approximation EMA effective mass approximation EOS electro-optic sampling EPP empirical pseudopotential method EY Elliott-Yafet mechanism FET field effect transistor FB Fabry-Perot HH heavy hole HWP half wave plate iPCE interdigitated photoconductive emitter IQHE integer quantum Hall effect ITRS International Technology Roadmap for Semiconductors JDOS joint density of states LL Landau level MOD modulation doping MOS metal-oxide-semiconductor MOSFET metal-oxide-semiconductor field effect transistor MT magnetotransport NPP nonlocal pseudopotential method OQHE optical quantum Hall effect PC photoconductive PD photodiode PP pseudopotential method viii PR-THz-TDMS polarisation-resolved THz-TDMS QHE quantum Hall effect QW quantum well QW-FET quantum well field effect transistor QWP quarter wave plate RMS root mean square RP-CVD reduced-pressure chemical vapour deposition RP-THz-TDS rotatable polarisation THz-TDS SC semiconductor SdH Shubnikov-de Haas sGe-QWs strained germanium quantum wells SIA structural inversion asymmetry SOI spin-orbit interaction THz-TDS THz time-domain spectroscopy THz-TDMS THz time-domain magneto-spectroscopy VB valence band WAL weak anti-localisation WL weak localisation XTEM cross-sectional transmission electron microscopy ix List of symbols a lattice constant a‖ in-plane lattice constant a0 unstrained lattice constant a†, a creation and annihilation operators A = A(r) vector potential α Rashba coefficient for electrons α(ω) absorption coefficient bij BIA coefficient B applied magnetic field Beff effective magnetic field BBIA(k‖) effective magnetic field from BIA BSIA(k‖) effective magnetic field from SIA β Rashba coefficient for HHs and LHs βMT Rashba coefficient for HHs and LHs from MT measurements βp Rashba coefficient from the spin-split density obtained from THz-TDMS c speed of light ∆ Rashba splitting energy ∆p Rashba splitting energy obtained from THz-TDMS ∆MT Rashba splitting energy from MT measurements ∆− momentum matrix element ∆0,∆ ′ 0 SO-energies Γ Landau level linewidth (broadening) g density of states gB density of states for Landau levels at B g0 electron g-factor g∗ effective g-factor x E energy Eg energy gap E(k↓), E(k↑) energy for spin-down and spin-up states E±(k‖) energy for spin-down and spin-up states in 2D-systems Emn energy for the n-th subband and m bulk band (see m) E±mnN (B) spin-split energy for the band m, n-th subband and Landau level index N E± = √ 1/2(Ex ± iEy) cyclotron resonance active and inactive mode E±CR = E ↑↓ CR = ~ωc,↑↓ cyclotron resonance energies: transition energies from spin-up to spin-up states and from spin-down to spin-down states η ellipticity E0, E ′ 0 energy gaps E(k) energy dispersion EF Fermi energy ETHz THz-pulse Et(ω) THz-pulse transmitted through the sample Er(ω) reference THz-pulse E electric field ‖ in-plane element of the strain tensor (ω) complex dielectric function L lattice dielectric function f(E,µF, T ) Fermi-Dirac distribution f occupation factor γ1, γ2, γ3 Luttinger parameters γ′1, γ ′ 2, γ ′ 3 reduced Luttinger parameters H Hamiltonian H ′ij perturbed component of the Hamiltonian HSO spin-orbit Hamiltonian I ijl invariants j total angular momentum J current density k wavevector k‖ in-plane wavevector kF Fermi wavevector k± = kx ± iky κ′ reduced Luttinger paramater L quantum well thickness l orbital angular momentum λ spin-orbit coupling factor xi λc magnetic length m index for conduction, light hole or heavy hole band m0 electron mass m∗b effective mass at the band-edge (i.e. k = 0) m∗THz effective mass obtained from magnetic field dependence of the cyclotron frequency mj projection of total angular momentum m∗HH effective mass for heavy holse m∗LH effective mass for light holes mij matrix tensor element of the effective mass m∗MT effective mass obtained from MT experiments µB = e~/(2m0) Bohr magneton µF chemical potential µ mobility n subband index in quantum wells nB number of states (per unit area) for Landau levels ñ = n(ω) + iκ(ω) complex refractive index N volume carrier density N± spin-split density (+: up, −: down) Ns sheet carrier density N Landau level index ωc cyclotron frequency Ωdir volume of the primitive cell in real space Ωrec volume of the primitive cell in reciprocal space P, P ′ momentum matrix element p = −i~∇ momentum operator p = ~k kinetic momentum pMT↑,↓ spin-split sheet density from MT measurements pTHz↑,↓ spin-split sheet density from THz-TDMS pTHz2D total sheet density from fits of THz-TDMS psum2D total sheet density from sum rule pHall2D total sheet density from classical Hall conductivity ψ wavefunction Ψ(r) wavefunction expansion in terms of band-edge Bloch functions Q momentum matrix element rij SIA coefficient ρ resistivity tensor σ conductivity tensor σ(ω) optical conductivity σ0 DC sheet conductivity σ vector of Pauli spin matrices s spin angular momentum τ lifetime xii τs spin lifetime τtr transport lifetime τTHz cyclotron resonance lifetime from THz-TDMS τq quantum lifetime θF Faraday angle ΘF (ω,B) complex Faraday angle v speed, drift velocity ν Landau levels filling factor V0(r) periodic crystal potential Vg pseudopotential form factor VG gate voltage x element content χ2 residual xiii Abstract Terahertz time-domain spectroscopy (THz-TDS) allows the investigation, in a noncontact fashion and in the meV range (1 THz = 4.14 meV), of the coherent motion of particles close to their equilibrium position....

    [...]

  • ...In Section 1.1.1 the quantum well FET (QW-FET)[21] has been introduced as an alternative device to maintain Moore’s law....

    [...]

  • ...22 Moreover, characterising QWs gives an estimation of their intrinsic mobility, i.e. not affected by other mechanisms related to the realisation of the QW-FET....

    [...]

Journal ArticleDOI
Lian Wei1, Yi Miao1, Yuanfeng Ding1, Chen Li1, Hong Lu1, Yan-Feng Chen1 
TL;DR: In this article, the authors demonstrated an effective method to achieve ultra high mobility in the Ge films grown directly on Si (1.0.0) using molecular beam epitaxy (MBE).

4 citations

Journal ArticleDOI
TL;DR: In this paper, a nonuniform reaction at the GeO2/Ge interface is observed on the initially flat Ge surface (rms: 0.3 nm) and crystalline Ge islands are demonstrated to form on Si.
Abstract: Despite a renewed interest in germanium (Ge) as a material for beyond the silicon (Si) era for electronic and photonic applications, the GeO2/Ge interface remains to be controlled for making the best of Ge's advantages. Not only electrical challenges but also structural challenges must be considered. The crystallization of GeO2 on Ge without the desorption of GeO is clearly demonstrated. This demonstration means that the desorption of GeO observed in a GeO2/Ge stack is not the sole indicator of deterioration of the GeO2/Ge gate stack. Moreover, a study using atomic force microscopy demonstrates that a nonuniform reaction at the GeO2/Ge interface [with root mean square (rms) roughness of 2.3 nm] is observed on the initially flat Ge surface (rms: 0.3 nm). Furthermore, a reaction at the GeO2/Si interface is experimentally investigated in comparison with the GeO2/Ge case, and crystalline Ge islands are demonstrated to form on Si. These findings are of fundamental interest as well as of technical importance from the viewpoint of Ge-based electronics and photonics.

4 citations

References
More filters
Proceedings ArticleDOI
01 Dec 2007
TL;DR: In this paper, a 45 nm logic technology is described that for the first time incorporates high-k + metal gate transistors in a high volume manufacturing process, resulting in the highest drive currents yet reported for NMOS and PMOS.
Abstract: A 45 nm logic technology is described that for the first time incorporates high-k + metal gate transistors in a high volume manufacturing process. The transistors feature 1.0 nm EOT high-k gate dielectric, dual band edge workfunction metal gates and third generation strained silicon, resulting in the highest drive currents yet reported for NMOS and PMOS. The technology also features trench contact based local routing, 9 layers of copper interconnect with low-k ILD, low cost 193 nm dry patterning, and 100% Pb-free packaging. Process yield, performance and reliability are demonstrated on 153 Mb SRAM arrays with SRAM cell size of 0.346 mum2, and on multiple microprocessors.

973 citations

Proceedings ArticleDOI
08 Dec 2003
TL;DR: In this article, the authors describe a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers, which features an epitaxially grown strained SiGe film embedded in the source drain regions.
Abstract: This paper describes the details of a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers The unique strained PMOS transistor structure features an epitaxially grown strained SiGe film embedded in the source drain regions Dramatic performance enhancement relative to unstrained devices are reported These transistors have gate length of 45nm and 50nm for NMOS and PMOS respectively, 12nm physical gate oxide and Ni salicide World record PMOS drive currents of 700/spl mu/A//spl mu/m (high V/sub T/) and 800/spl mu/A//spl mu/m (low V/sub T/) at 12V are demonstrated NMOS devices exercise a highly tensile silicon nitride capping layer to induce tensile strain in the NMOS channel region High NMOS drive currents of 126mA//spl mu/m (high VT) and 145mA//spl mu/m (low VT) at 12V are reported The technology is mature and is being ramped into high volume manufacturing to fabricate next generation Pentium/spl reg/ and Intel/spl reg/ Centrino/spl trade/ processor families

729 citations

Journal ArticleDOI
TL;DR: In this paper, a method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented.
Abstract: A method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented. This method has allowed us to grow a relaxed graded buffer to 100% Ge without the increase in threading dislocation density normally observed in thick graded structures. This sample has been characterized by transmission electron microscopy, etch-pit density, atomic force microscopy, Nomarski optical microscopy, and triple-axis x-ray diffraction. Compared to other relaxed graded buffers in which CMP was not implemented, this sample exhibits improvements in threading dislocation density and surface roughness. We have also made process modifications in order to eliminate particles due to gas-phase nucleation and cracks due to thermal mismatch strain. We have achieved relaxed Ge on Si with a threading dislocation density of 2.1×106 cm−2, and we expect that further process refinements will lead to lower threading dislocation densities on the order of bulk Ge su...

620 citations

Journal ArticleDOI
Yoshiki Kamata1
TL;DR: In this article, the opportunities and challenges of high-k/Ge MOSFETs are discussed on the basis of the material properties of Ge oxide to provide insights for future progress.

443 citations