Advanced Flip Chip Packaging
01 Jan 2013-
About: The article was published on 2013-01-01. It has received 86 citations till now. The article focuses on the topics: Thermal copper pillar bump & Flip chip.
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TL;DR: In this paper, the future prospective of epoxy resin in the field of conductive adhesives is presented, mainly focusing on the categories, conduction mechanisms, applications of conductives along with various types of conductively fillers, inherent conductive polymers and future prospective.
79 citations
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56 citations
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Cites background from "Advanced Flip Chip Packaging"
...Proper heat transfer prevents the occurrence of excessive temperatures thereby increasing the lifetime and reliability of electronic components [1]....
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28 Jun 2021
TL;DR: This Tutorial provides an overview of the motivation behind the integration of different photonic and material platforms, and reviews common hybrid and heterogeneous integration methods and discusses the advantages and shortcomings.
Abstract: Increasing demand for every faster information throughput is driving the emergence of integrated photonic technology. The traditional silicon platform used for integrated electronics cannot provide all of the functionality required for fully integrated photonic circuits, and thus, the last decade has seen a strong increase in research and development of hybrid and heterogeneous photonic integrated circuits. These approaches have enabled record breaking experimental demonstrations, harnessing the most favorable properties of multiple material platforms, while the robustness and reliability of these technologies are suggesting entirely new approaches for precise mass manufacture of integrated circuits with unprecedented variety and flexibility. This Tutorial provides an overview of the motivation behind the integration of different photonic and material platforms. It reviews common hybrid and heterogeneous integration methods and discusses the advantages and shortcomings. This Tutorial also provides an overview of common photonic elements that are integrated in photonic circuits. Finally, an outlook is provided about the future directions of the hybrid/heterogeneous photonic integrated circuits and their applications.
38 citations
26 May 2015
TL;DR: In this article, two methods to form all-copper flip chip interconnects at an annealing temperature of 250 °C are presented, and the interconnect in the contact region between Cu pillars and Cu pads with a pitch down to 150 µm are formed by Cu nanoparticle self-assembly and sintering.
Abstract: The current feed capability of typical flip chip electrical interconnects is constrained by the solder alloy, as it is more susceptible to electromigration than the copper used for the pads and wires. Hence, interconnects formed by copper only mitigate the electromigration risk and/or allow to increase the current limit of the all-copper interconnect. In this work, two methods to form all-copper flip chip interconnects at an annealing temperature of 250 °C are presented. The interconnects in the contact region between Cu pillars and Cu pads with a pitch down to 150 µm are formed by Cu nanoparticle self-assembly and sintering. In the first method, the entire gap between a Cu pillar chip and a substrate was filled with a Cu nano-suspension. The formation of capillary bridges during the evaporation of the dispersant directed the self-assembly of the nanoparticles towards the contact region between Cu pillars and Cu pad. In the second method, the Cu pillar chip was dipped into a film of the Cu nano-suspension, followed by a transfer, placement and release with a die bonder onto pads on a substrate. The annealing of the Cu nanoparticles is performed in both cases in a reducing formic acid atmosphere. The first method was more susceptible to the formation of shorts between pillars, whereas the second method resulted in electrical functional chip to substrate assemblies. Interconnects with a mean electrical resistance of 26 ± 3 mΩ and a shear strength ranging from 4.6 to 12.3 MPa were achieved. The sintered Cu nanoparticles bridged gaps up to 10 µm between copper pillars and pads, demonstrating the potential to apply the joint also on non-planar substrates. Nevertheless, imperfections such as voids and cracks are still present in the joints and need further process development, to improve the quality and process robustness further.
36 citations