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Advances in Thermal Modeling of Electronic Components and Systems. Volume 1
01 Jul 1988-
TL;DR: In this article, the authors present a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.
Abstract: This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.
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TL;DR: This paper provides the groundwork for an understanding of the reliability issues of LEDs across the supply chain and identifies the relationships between failure causes and their associated mechanisms, issues in thermal standardization, and critical areas of investigation and development in LED technology and reliability.
648 citations
TL;DR: In this paper, the authors measured and predicted saturated flow boiling heat transfer in a water-cooled micro-channel heat sink and found that the dominant heat transfer mechanism is forced convective boiling corresponding to annular flow.
556 citations
TL;DR: In this article, the equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow.
Abstract: The equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow. A scheme presented for solving these equations permits the determination of heat sink dimensions that display the lowest thermal resistance between the hottest portion of the heat sink and the incoming fluid. Results from the present method are applied to heat sinks reported by previous investigators to study effects of their restrictions regarding the nature of the flow (laminar or turbulent), the ratio of fin thickness to channel width, or the aspect ratio of the fluid channel. Results indicate that when the pressure drop through the channels is small, laminar solutions yield lower thermal resistance than turbulent solutions. Conversely, when the pressure drop is large, the optimal thermal resistance is found in the turbulent region. With the relaxation of these constraints, configurations and dimensions found using the present procedure produce significant improvement in thermal resistance over those presented by all three previous studies. >
407 citations
TL;DR: In this article, the effects of the EDL at the solid-liquid interface on liquid flow and heat transfer through a microchannel between two parallel plates at constant and equal temperatures were investigated.
353 citations
TL;DR: In this paper, the authors provide a historical perspective of the progress made in understanding the underlying mechanisms in single-phase liquid flow and two-phase flow boiling processes and their use in high heat flux removal applications.
Abstract: As the scale of devices becomes small, thermal control and heat dissipation from these devices can be effectively accomplished through the implementation of microchannel passages. The small passages provide a high surface area to volume ratio that enables higher heat transfer rates. High performance microchannel heat exchangers are also attractive in applications where space and/or weight constraints dictate the size of a heat exchanger or where performance enhancement is desired. This survey article provides a historical perspective of the progress made in understanding the underlying mechanisms in single-phase liquid flow and two-phase flow boiling processes and their use in high heat flux removal applications. Future research directions for (i) further enhancing the single-phase heat transfer performance and (ii) enabling practical implementation of flow boiling in microchannel heat exchangers are outlined.
310 citations