Air Cooling Technology for Electronic Equipment
01 Jan 1996-
About: The article was published on 1996-01-01. It has received 120 citations till now. The article focuses on the topics: Air cooling & Airflow.
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TL;DR: In this paper, the authors developed a solution to the fundamental problem of how to collect and "channel" to one point the heat generated volumetrically in a low conductivity volume of given size.
771 citations
TL;DR: In this article, an air-cooled heat sink considering heat conduction plus side-surface convection is presented, and a postprocessing procedure is described to synthesize manifold or "watertight" solid model computer-aided design (CAD) geometry from 3D point cloud data extracted from the optimization result.
Abstract: Topology optimization of an air-cooled heat sink considering heat conduction plus side-surface convection is presented. The optimization formulation is explained along with multiple design examples. A postprocessing procedure is described to synthesize manifold or “water-tight” solid model computer-aided design (CAD) geometry from three-dimensional (3D) point-cloud data extracted from the optimization result. Using this process, a heat sink is optimized for confined jet impingement air cooling. A prototype structure is fabricated out of AlSi12 using additive layer manufacturing (ALM). The heat transfer and fluid flow performance of the optimized heat sink are experimentally evaluated, and the results are compared with benchmark plate and pin-fin heat sink geometries that are conventionally machined out of aluminum and copper. In two separate test cases, the experimental results indicate that the optimized ALM heat sink design has a higher coefficient of performance (COP) relative to the benchmark heat sink designs.
243 citations
TL;DR: In this paper, a two-dimensional, rectangular enclosure with localized heating from below and symmetrical cooling from the sides has been numerically investigated and the results showed that the average Nusselt number at the heated part of the lower wall, \overline Nu, was shown to increase with an increase the Rayleigh number, Ra, or of the non-dimensional heat source thickness.
Abstract: Natural convection of air in a two‐dimensional, rectangular enclosure with localized heating from below and symmetrical cooling from the sides has been numerically investigated Localized heating is simulated by a centrally located heat source on the bottom wall, and four different values of the dimensionless heat source length, 1/5, 2/5, 3/5 and 4/5 are considered Solutions are obtained for Rayleigh number values from 103 to 106 Local results are presented in the form of streamline and isotherm plots as well as the variation of local Nusselt number on the heated wall Finally, the average Nusselt number at the heated part of the lower wall, \overline Nu, was shown to increase with an increase the Rayleigh number, Ra, or of the nondimensional heat source thickness, e
201 citations
TL;DR: Critical enabling thermal management technologies covered include microchannel transport and micropumps, jet impingement, miniature flat heat pipes, transient phase change energy storage systems, piezoelectric fans, and prediction of interface contact conductance.
191 citations
TL;DR: In this paper, a large number of optimized dendritic flow structures that occupy a disc-shaped area of radius R are presented, where the flow is laminar and fully developed in every tube.
168 citations