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Proceedings ArticleDOI

An overview of corrosion analysis of solder joints

07 Dec 2020-Vol. 2311, Iss: 1, pp 080003
TL;DR: One of the main issues faced by a solder joint is corrosion and variety of procedures are taken up to reduce corrosion in solder joint.
Abstract: The unstoppable need and fast paced progress in the field of science and technology related trades has unlocked the door and set in new frontiers for researchers across the world, specifically those in the field of electronics. Out of many areas the one with a huge impact is the soldering technology.Ever since the birth of electronic era, soldering is seen as an important assembly having interconnectedness with technological and electronic products and this particular field is known to have a bright future over time. These solder joints have been seen as feeble associates of electronic products and the consistency of every single joint can be in charge of an electronic product's entire lifetime. To define soldering in simple terms, it encompasses the reaction of chemicals between the solder and the couple of surfaces combined together and subsequently the vitality of getting to know about the chemical reactions between the solders and bonding surfaces. Certain limitations towards the usage of hazardous substances (RoHs) that prohibits using lead-based solder because of safety and health issues have been important factors to uplift and develop new solder technology from lead-free solder. Trials are to overcome when the newly formed solder holds exactly analogous features with Sn-Pb solders. But then, these new solder alloys are said to have concerns with corrosion behavior. One of the main issues faced by a solder joint is corrosion and variety of procedures are taken up to reduce corrosion in solder joint. For this purpose, popularly SST (Salt Spray Test) is executed on the solder joints to check its corrosion effect. This study discusses the overview of corrosion in solder joints.
Citations
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Journal ArticleDOI
TL;DR: In this paper, concentrated solar energy soldering (CSES) technique is applied for soldering newly developed Gallium added Sn-0.7Cu Lead-Free solder and evaluated with CSI (Conventional Soldering Iron) solder joints.
Abstract: Concentrated Solar Energy Soldering (CSES) technique is applied for soldering newly developed Gallium added Sn–0.7Cu Lead-Free solder and evaluated with CSI (Conventional Soldering Iron) solder joints. Tensile strength, bending/flexural strength, microhardness, optical microstructures, SEM microstructures and EDS analysis were utilized to relate CSES solder joints with CSI solder joints. Salt spray test (SST) was employed for corrosion analysis of CSES and CSI solder joints. Experimental findings disclose that the tensile response, bending strength and microhardness of the CSES solder joints were very nearly identical to that of the CSI solder joints. It was witnessed that post-corrosion, the tensile strength, bending strength and microhardness for CSES and CSI solder joints lowered. Further, with Gallium add-on, microstructure and mechanical properties enhanced. The results establish CSES technique as a green technology and a prospective alternative to CSI method.

2 citations

References
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Journal ArticleDOI
TL;DR: In this paper, phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method.
Abstract: Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.

665 citations

Journal ArticleDOI
TL;DR: This review discusses fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems, and first explains the reactions between common base materials, coatings, and metallisations, and then proceed to more complex systems with additional alloying elements.

351 citations

Journal ArticleDOI
TL;DR: New lead-free solder alternatives and the trends in the industry are reviewed, including SnCu-based solders, SnAgCu solders with Ag content, and Sn3.0Ag0.5Cu (SAC305) solders.

288 citations

Journal ArticleDOI
TL;DR: A review of recent research on suitable replacement alloys as well as traditional Pb–Sn alloys, collating relevant properties and identifying areas where further development is required is concluded.

228 citations

Journal ArticleDOI
TL;DR: In this paper, a limited number of alloying systems are available for lead-free solders in the high-temperature regime, but none of them can fulfill all the requirements to replace the current high-lead content solders.

164 citations