Journal ArticleDOI
An overview to integrated power module design for high power electronics packaging
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TLDR
The concept of Integrated Power Modules (IPMs) was introduced in this article, in which the electronic control circuitry and the high power electronics of the converter are integrated into a single compact standardized module.About:
This article is published in Microelectronics Reliability.The article was published on 2000-03-17. It has received 77 citations till now. The article focuses on the topics: Power module & Power optimization.read more
Citations
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Journal ArticleDOI
Thermal Management on IGBT Power Electronic Devices and Modules
TL;DR: A quick and efficient evaluation judgment for the thermal management of the IGBTs depended on the requirements on the junction-to-case thermal resistance and equivalent heat transfer coefficient of the test samples is proposed.
Journal ArticleDOI
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
Proceedings ArticleDOI
Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments
TL;DR: In this article, the current state of SiC electronics research at Arkansas Power Electronics International, Inc. (APEI) with regard to high-temperature environments and applications is discussed, and the current application of these devices to the specific harsh environments of deep Earth drilling and combat electric vehicles, as well as outline APEI's research work into developing operational SiC motor drives for these systems.
Journal ArticleDOI
Technology trends toward a system-in-a-module in power electronics
TL;DR: The paper addresses the improvement of power processing technology through advanced integration of power electronics through the concept of integrated power electronics modules (IPEMs), and the technology underpinning such an IPEM approach is discussed.
Journal ArticleDOI
Integrating active, passive and EMI-filter functions in power electronics systems:a case study of some technologies
TL;DR: In this paper, the authors address the improvement of power processing technology through advanced integration of power electronics, incorporating active switching stages, electromagnetic interference (EMI) filters, and electromagnetic power passives into modules by integration technology.
References
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Book
Introduction to Heat Transfer
TL;DR: In this article, the physical concepts and methodologies of heat and mass transfer are explained for advanced undergraduate engineering majors, using a systematic method for problem solving and discusses the relationship of heat transfer to many important practical applications through examples and problems.
Journal ArticleDOI
A comparison of half-bridge resonant converter topologies
TL;DR: In this paper, the half-bridge series-resonant, parallel-reonant and combination series-parallel resonant converters are compared for low-output-voltage power supply applications.
Book
Principles of power electronics
TL;DR: In this paper, the authors present a review of semiconductor devices and their properties, including gate and base drives, and power transistors, as well as feedback control design and an overview of ancillary issues.
Journal ArticleDOI
Modeling PWM DC/DC converters out of basic converter units
Tasi-Fu Wu,Yu-Kai Chen +1 more
TL;DR: An alternative approach to modeling pulsewidth-modulated (PWM) DC/DC converters out of basic converter units (BCUs) is presented and can yield the same small-signal models as those derived from the direct state-space averaging method.
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