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Journal ArticleDOI

Analysis of Copper Dissolution in Glutamic Acid and Hydrogen Peroxide Using EIS

21 Mar 2011-Vol. 33, Iss: 15, pp 37-50
TL;DR: In this paper, the dissolution of copper in solutions containing Glu and hydrogen peroxide was analyzed using EIS, showing that Glu-based slurries have a more robust removal rate.
Abstract: Copper chemical mechanical polishing (CMP) is a key step in microelectronic interconnect fabrication [1]. Slurries containing glycine and hydrogen peroxide have been widely studied as suitable candidates for Cu CMP[2,3]. Glycine based slurries show drastic changes in removal rate with changes in hydrogen peroxide concentration. Slurries based on glutamic acid (Glu) as complexing agent present a more robust removal rate trend. The dissolution of copper in solutions containing Glu and hydrogen peroxide is analyzed using EIS.
Citations
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Journal ArticleDOI
TL;DR: In this article, the electrochemical behavior of a metal-rubber composite is studied in NaCl-based solutions and the role as inhibitors of some species (released from the rubber or added in the solution) was evaluated by determining polarisation curves and electrochemical impedance diagrams.

3 citations

References
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Book
01 Jan 2008
TL;DR: In this paper, the authors provide guidelines for experimental design, discuss the relevance of accuracy contour plots to wiring and instrumentation selection, and emphasize the importance of the Kramers-Kronig relations to data validation and analysis.
Abstract: Electrochemical impedance spectroscopy (EIS) is a powerful tool to investigate properties of materials and electrode reactions. This Primer provides a guide to the use of EIS with a comparison to other electrochemical techniques. The analysis of impedance data for reduction of ferricyanide in a KCl supporting electrolyte is used to demonstrate the error structure for impedance measurements, the use of measurement and process models, as well as the sensitivity of impedance to the evolution of electrode properties. This Primer provides guidelines for experimental design, discusses the relevance of accuracy contour plots to wiring and instrumentation selection, and emphasizes the importance of the Kramers-Kronig relations to data validation and analysis. Applications of EIS to battery performance, metal and alloy corrosion, and electrochemical biosensors are highlighted. Electrochemical impedance measurements depend on both the mechanism under investigation and extrinsic parameters, such as the electrode geometry. Experimental complications are discussed, including the influence of nonstationary behaviour at low frequencies and the need for reference electrodes. Finally, emerging trends in experimental and interpretation approaches are also described.

1,497 citations

Book
31 Jan 1997
TL;DR: In this article, historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP of other materials post CMP cleaning, and a discussion of the relationship between CMP and manipulation.
Abstract: Historical perspective CMP: variables and manipulations electrochemical and mechanical concepts for CMP processes copper CMP CMP of other materials post CMP cleaning.

714 citations

BookDOI
01 Jan 2004
TL;DR: In this paper, the authors present a detailed overview of CMP technology and its application in metal CMP processes, as well as equipment used in CMP process and tools used to clean CMP slurry.
Abstract: 1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.

258 citations


"Analysis of Copper Dissolution in G..." refers background in this paper

  • ...Copper chemical mechanical polishing (CMP) is a key step in microelectronic interconnect fabrication [1]....

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