Analysis of enhanced light emission from highly strained germanium microbridges
TL;DR: In this paper, high-strained germanium on silicon samples with up to 3.1% uniaxial strain is fabricated and then investigated by Raman spectroscopy.
Abstract: Highly strained germanium on silicon samples with up to 3.1% uniaxial strain are fabricated and then investigated by Raman spectroscopy. During optical pumping, changes in both the emission wavelength and output power are observed, indicating that bandgap modification and optical gain are occurring.
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TL;DR: In this paper, a direct bandgap GeSn alloy, grown directly onto Si(001), was used for experimentally demonstrating lasing threshold and linewidth narrowing at low temperatures.
Abstract: Lasing is experimentally demonstrated in a direct bandgap GeSn alloy, grown directly onto Si(001). The authors observe a clear lasing threshold as well as linewidth narrowing at low temperatures.
1,027 citations
Cites background from "Analysis of enhanced light emission..."
...Very recently, Süess et al.(10) presented a stressor-free technique which enables the introduction of more than 5....
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TL;DR: Zhou et al. as discussed by the authors assess the three main contenders for on-chip light sources: erbium-based light sources, germanium-on-silicon lasers and III-V-based silicon lasers.
Abstract: Hybrid silicon lasers based on bonded III–V layers on silicon are currently the best contenders for on-chip lasers for silicon photonics. On-chip silicon light sources are highly desired for use as electrical-to-optical converters in silicon-based photonics. Zhiping Zhou and Bing Yin of Peking University in China and Jurgen Michel of Massachusetts Institute of Technology assess the three main contenders for such light sources: erbium-based light sources, germanium-on-silicon lasers and III-V-based silicon lasers. They consider operating wavelength, pumping conditions, power consumption, thermal stability and fabrication process. The scientists regard the power efficiencies of electrically pumped erbium-based lasers as being too low and the threshold currents of germanium lasers as being too high. They conclude that III–V quantum dot lasers monolithically grown on silicon show the most promise for realizing on-chip lasers.
448 citations
Book•
01 Mar 2015TL;DR: In this article, the authors present the state-of-the-art in the field of fabless silicon photonic systems, including the following: 1.1 Optical Waveguide Mode Solver 2.2 Wave Propagation 2.3 Optoelectronic models 2.4 Microwave Modelling 2.5 Thermal Modeling 2.6 Photonic Circuit Modelling 3.7 Physical Layout 2.8 Software Tools Integration 3.4 Code Listings 4.5 Problems 4.7 Problems 5.4 Polarization 5.5 Problem 5.6 Code List
Abstract: Part I. Silicon Photonics - Introduction: 1. Fabless Silicon Photonics: 1.1 Introduction 1.2 Silicon photonics - the next fabless semiconductor industry 1.3 Applications 1.4 Technical challenges and the state of the art 1.5 Opportunities 2. Modelling and Design Approaches: 2.1 Optical Waveguide Mode Solver 2.2 Wave Propagation 2.3 Optoelectronic models 2.4 Microwave Modelling 2.5 Thermal Modelling 2.6 Photonic Circuit Modelling 2.7 Physical Layout 2.8 Software Tools Integration Part II. Silicon Photonics - Passive Components: 3. Optical Materials and Waveguides: 3.1 Silicon-on-Insulator 3.2 Waveguides 3.3 Bent waveguides 3.4 Code Listings 3.5 Problems 4. Fundamental Building Blocks: 4.1 Directional couplers 4.2 Y-Branch 4.3 Mach-Zehnder Interferometer 4.4 Ring resonators 4.5 Waveguide Bragg Grating Filters 4.6 Code Listings 4.7 Problems 5. Optical I/O: 5.1 The challenge of optical coupling to silicon photonic chips 5.2 Grating Coupler 5.3 Edge Coupler 5.4 Polarization 5.5 Code Listings 5.6 Problems Part III. Silicon Photonics - Active Components: 6. Modulators: 6.1 Plasma Dispersion E 6.2 PN Junction Phase Shifter 6.3 Micro-ring Modulators 6.4 Forward-biased PIN Junction 6.5 Active Tuning 6.6 Thermo-Optic Switch 6.7 Code Listings 6.8 Problems 7. Detectors: 7.1 Performance Parameters 7.2 Fabrication 7.3 Types of detectors 7.4 Design Considerations 7.5 Detector modelling 7.5.2 Electronic Simulations 7.6 Code Listings 7.7 Problems 8. Lasers: 8.1 External Lasers 8.2 Laser Modelling 8.3 Co-Packaging 8.4 Hybrid Silicon Lasers 8.5 Monolithic Lasers 8.6 Alternative Light Sources 8.7 Problems Part IV. Silicon Photonics - System Design: 9. Photonic Circuit Modelling: 9.1 Need for photonic circuit modelling 9.2 Components for System Design 9.3 Compact Models 9.4 Directional Coupler - Compact Model 9.5 Ring Modulator - Circuit Model 9.6 Grating Coupler - S Parameters 9.7 Code Listings 10. Tools and Techniques: 10.1 Process Design Kit (PDK) 10.2 Mask Layout 11. Fabrication: 11.1 Fabrication Non-Uniformity 11.2 Problems 12. Testing and Packaging: 12.1 Electrical and Optical Interfacing 12.2 Automated Optical Probe Stations 12.3 Design for Test 13. Silicon Photonic System Example: 13.1 Wavelength Division Multiplexed Transmitter.
355 citations
TL;DR: It is shown how nanoscale stress can be used to realize exceptionally low mechanical dissipation when combined with “soft-clamping”—a form of phononic engineering.
Abstract: Extreme stresses can be produced in nanoscale structures; this feature has been used to realize enhanced materials properties, such as the high mobility of silicon in modern transistors. We show how nanoscale stress can be used to realize exceptionally low mechanical dissipation when combined with “soft-clamping”—a form of phononic engineering. Specifically, using a nonuniform phononic crystal pattern, we colocalize the strain and flexural motion of a free-standing silicon nitride nanobeam. Ringdown measurements at room temperature reveal string-like vibrational modes with quality ( Q ) factors as high as 800 million and Q × frequency exceeding 10 15 hertz. These results illustrate a promising route for engineering ultracoherent nanomechanical devices.
261 citations
TL;DR: In this article, the elastic strain field is controlled statically or dynamically by varying the six-dimensional elastic strain as continuous variables, which gives new meaning to Richard Feynman's 1959 statement, "There is plenty of room at the bottom".
Abstract: “Smaller is stronger.” Nanostructured materials such as thin films, nanowires, nanoparticles, bulk nanocomposites, and atomic sheets can withstand non-hydrostatic (e.g., tensile or shear) stresses up to a significant fraction of their ideal strength without inelastic relaxation by plasticity or fracture. Large elastic strains, up to ∼10%, can be generated by epitaxy or by external loading on small-volume or bulk-scale nanomaterials and can be spatially homogeneous or inhomogeneous. This leads to new possibilities for tuning the physical and chemical properties of a material, such as electronic, optical, magnetic, phononic, and catalytic properties, by varying the six-dimensional elastic strain as continuous variables. By controlling the elastic strain field statically or dynamically, a much larger parameter space opens up for optimizing the functional properties of materials, which gives new meaning to Richard Feynman’s 1959 statement, “there’s plenty of room at the bottom.”
230 citations
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TL;DR: The techniques that have, and will, be used to implement silicon optical modulators, as well as the outlook for these devices, and the candidate solutions of the future are discussed.
Abstract: Optical technology is poised to revolutionize short-reach interconnects. The leading candidate technology is silicon photonics, and the workhorse of such an interconnect is the optical modulator. Modulators have been improved dramatically in recent years, with a notable increase in bandwidth from the megahertz to the multigigahertz regime in just over half a decade. However, the demands of optical interconnects are significant, and many questions remain unanswered as to whether silicon can meet the required performance metrics. Minimizing metrics such as the device footprint and energy requirement per bit, while also maximizing bandwidth and modulation depth, is non-trivial. All of this must be achieved within an acceptable thermal tolerance and optical spectral width using CMOS-compatible fabrication processes. This Review discusses the techniques that have been (and will continue to be) used to implement silicon optical modulators, as well as providing an outlook for these devices and the candidate solutions of the future.
2,110 citations
TL;DR: In this article, the authors summarized the major developments in Ge-on-Si photodetectors, including epitaxial growth and strain engineering, free-space and waveguide-integrated devices, as well as recent progress in Geon-On-Si avalanche photodets.
Abstract: The past decade has seen rapid progress in research into high-performance Ge-on-Si photodetectors. Owing to their excellent optoelectronic properties, which include high responsivity from visible to near-infrared wavelengths, high bandwidths and compatibility with silicon complementary metal–oxide–semiconductor circuits, these devices can be monolithically integrated with silicon-based read-out circuits for applications such as high-performance photonic data links and infrared imaging at low cost and low power consumption. This Review summarizes the major developments in Ge-on-Si photodetectors, including epitaxial growth and strain engineering, free-space and waveguide-integrated devices, as well as recent progress in Ge-on-Si avalanche photodetectors. Owing to their excellent optoelectronic properties, Ge-on-Si photodetector can be monolithically integrated with silicon-based read-out circuits for applications such as high-performance photonic data links and low-cost infrared imaging at low power consumption. This Review covers the major developments in Ge-on-Si photodetectors, including epitaxial growth and strain engineering, free-space and waveguide-integrated devices, as well as recent progress in Ge-on-Si avalanche photodetectors.
1,259 citations
TL;DR: An electrically pumped AlGaInAs-silicon evanescent laser architecture where the laser cavity is defined solely by the silicon waveguide and needs no critical alignment to the III-V active material during fabrication via wafer bonding is reported.
Abstract: An electrically pumped light source on silicon is a key element needed for photonic integrated circuits on silicon. Here we report an electrically pumped AlGaInAs-silicon evanescent laser architecture where the laser cavity is defined solely by the silicon waveguide and needs no critical alignment to the III-V active material during fabrication via wafer bonding. This laser runs continuous-wave (c.w.) with a threshold of 65 mA, a maximum output power of 1.8 mW with a differential quantum efficiency of 12.7 % and a maximum operating temperature of 40 degrees C. This approach allows for 100's of lasers to be fabricated in one bonding step, making it suitable for high volume, low-cost, integration. By varying the silicon waveguide dimensions and the composition of the III-V layer, this architecture can be extended to fabricate other active devices on silicon such as optical amplifiers, modulators and photo-detectors.
1,257 citations
TL;DR: In this article, a review of nonlinear effects in silicon and highlights the important applications and technological solutions in nonlinear silicon photonics is presented. But the authors do not discuss the nonlinearities in silicon.
Abstract: The nonlinearities in silicon are diverse. This Review covers the wealth of nonlinear effects in silicon and highlights the important applications and technological solutions in nonlinear silicon photonics. The increasing capability for manufacturing a wide variety of optoelectronic devices from polymer and polymer–silicon hybrids, including transmission fibre, modulators, detectors and light sources, suggests that organic photonics has a promising future in communications and other applications.
1,123 citations
TL;DR: A review of the history and current progress in highmobility strained Si, SiGe, and Ge channel metal-oxide-semiconductor field effect transistors (MOSFETs) can be found in this article.
Abstract: This article reviews the history and current progress in high-mobility strained Si, SiGe, and Ge channel metal-oxide-semiconductor field-effect transistors (MOSFETs). We start by providing a chronological overview of important milestones and discoveries that have allowed heterostructures grown on Si substrates to transition from purely academic research in the 1980’s and 1990’s to the commercial development that is taking place today. We next provide a topical review of the various types of strain-engineered MOSFETs that can be integrated onto relaxed Si1−xGex, including surface-channel strained Si n- and p-MOSFETs, as well as double-heterostructure MOSFETs which combine a strained Si surface channel with a Ge-rich buried channel. In all cases, we will focus on the connections between layer structure, band structure, and MOS mobility characteristics. Although the surface and starting substrate are composed of pure Si, the use of strained Si still creates new challenges, and we shall also review the litera...
918 citations