Analytical Development and Computer Modeling of a Bellows-Type Heat Pipe for the Cooling of Electronic Components
TL;DR: A parametic study of the relationships that govern the operation of a bellows heat pipe for use in the cooling of electronic components and formulates the governing equations through the development of a computer model.
Abstract: Presented here is a parametic study of the relationships that govern the operation of a bellows heat pipe for use in the cooling of electronic components. The defining equations are combined with the proper similarity relations to develop a mathematical model that can be used to describe the operational characteristics and performance limitations of such a heat pipe. The paper starts with a review of the recent experimental work done in the area of bellows heat pipes, formulates the governing equations, and proceeds through the development of a computer model. Preliminary testing of the computer model was carried out using experimental data obtained from previous investigations, to ensure that it accurately reflected the heat pipe performance. Once the model had been verified, it was used to develop an optimum design for a small bellows heat pipe.
Citations
More filters
TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Abstract: Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.
285 citations
TL;DR: A review of the recent heat pipe research and development efforts in the Americas is presented in this article, where a variety of heat pipes that also include variable conductance heat pipes and thermosyphons are reviewed.
Abstract: The purpose of this paper is to present a review of the recent heat pipe research and development efforts in the Americas. After discussing the research and development of high performance monogroove, tapered artery, trapezoidally grooved, dual-slot, double wall artery, ceramic and other specially designed heat pipes, the transient modeling and testing efforts are reviewed for a variety of heat pipes that also includes variable conductance heat pipes and thermosyphons. The application of heat pipes to terrestrial systems is discussed for the heat recovery systems, Rankine and solar systems, fusion reactor core cooling and the thermal control of electronic equipment. The application of heat pipes to space systems includes the thermal control of space station and satellites, and the radiator design of large space power systems. Although many advances have been made in the past few years in the development of high heat transfer performance heat pipes, the heat pipe modeling efforts are not in step with the technological requirements.
24 citations
Dissertation•
15 Aug 2005
5 citations
Cites background or methods from "Analytical Development and Computer..."
...Peterson [24] 5 layer 100 mesh stainless steel screen Ammonia Flexible 45 W 313 K...
[...]
...Peterson [24] developed a bellows heat pipe using analytical and computer modeling for cooling of electronic components....
[...]
01 Jan 2007
TL;DR: In this article, the authors present detailed accounts on variable conductance heat pipes, which have the ability to maintain a device mounted at the evaporator at a near constant temperature, independent of the amount of power being generated by the device.
Abstract: The aim of this chapter is to elucidate the special types of heat pipes. The variety of heat pipes, in terms of their geometry, function and/or the methods used to transport the liquid from the condenser to the evaporator, is remarkable. Some types of heat pipe have become less popular over the decades or have ceased to be regarded as special. Other types have seen a re-awakening of interest, brought about by demands for increasing miniaturization and the need to enhance performance, in particular liquid return flow rates. This chapter presents detailed accounts on variable conductance heat pipes, which have the ability to maintain a device mounted at the evaporator at a near constant temperature, independent of the amount of power being generated by the device; thermal diodes, which are crucial components of renewable energy systems; pulsating heat pipes, which is used in electronic cooling systems; micro-heat pipes, which are used in medical fields. This chapter also describes the use of electrokinetic forces. Some electric field effects that could be used to assist heat pipe performance include electroosmosis, electrohydrodynamics (EHD), and ultrasonics.
4 citations
TL;DR: In this paper, the effect of various parameters on the heat transfer rates of HOHP were used to establish a correlation equation for use in the heat flux prediction, the dimensionless parameters studied were r v / r l, Bo, Nu, We, Ja, Pr, Fr, Co, Ga, Bi, Wo, Oh, and Ku.
Abstract: The helical oscillating heat pipe (HOHP) is a high heat transfer heat exchanger with high flexibility in its installation and can therefore be used in a wide variety of applications. In this study, the effect of various parameters on the heat transfer rates of HOHP were used to establish a correlation equation for use in the heat flux prediction, the dimensionless parameters studied were r v / r l , Bo , Nu , We , Ja , Pr , Fr , Co , Ga , Bi , Wo , Oh , and Ku . Experiments were conducted to find out their effects on the heat transfer rates of copper HOHP with internal diameters were 2.03, 3.5, and 4.5 mm. The lengths of evaporator and condenser sections were equal at 1500, 2000, and 2500 mm. The pitch coils were 10, 15, and 20 mm. The working fluids used were R134a, ethanol, and water with the filling ratios were 30%, 50%, and 80% of the total internal volume. The temperature of evaporator section were varied between 60, 70, and 80°C within normal operating conditions in a vertical position. The results of the experiment showed that the internal diameter, lengths of evaporator/condenser sections, pitch coil, type of working fluid, filling ratio and temperature of evaporator section affected the heat transfer rates of the HOHP. The results of dimensionless parameters can establish the correlation equation to predict the heat flux for the HOHP as shown in this paper. In addition, the results of this research can be applied in the designing and construction of HOHP heat exchangers.
2 citations
Cites background from "Analytical Development and Computer..."
...This feature makes the use of heat pipes desirable by many researchers: (Zhao et al. 2016, Tiari et al. 2015, Tiari et al. 2016, Mahdavi et al. 2018) and electronic cooling by many researchers: (Hassan and Harmand 2013, Adami and Yimer 1990, Peterson 1988, Mozumder et al. 2011)....
[...]
References
More filters
Book•
01 Jan 1983
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ
Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی
339 citations