Open AccessDissertation
Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules
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TLDR
In this article, the authors presented an in-depth understanding on the thermal behavior of the embedded power modules and summarized a few thermal design guidelines for the Embedded Power modules, including thermal modeling and thermal testing.Abstract:
With the increase dependency on electricity to provide correct form of electricity for lightning, machines, and home and office appliances, the need for the introduction of high reliability power electronics in converting the raw form of electricity into efficient electricity for these applications is uprising. One of the most common failures in power electronics is temperature related failure such as overheating. To address the issue of overheating, thermal management becomes an important mission in the design of the power electronics to ensure the functional power electronics. Different approaches are taken by academia and industry researchers to provide efficient power electronics. In particular, the Center for Power Electronics System (CPES) at Virginia Tech and four other universities presented the IPEM approach by introducing integrated power electronics modules (IPEM) as standardized units that will enable greater integration within power electronics systems and their end-use application. The IPEM approach increases the integration in the components that make up a power electronics system through novel a packaging technique known as Embedded Power technology. While the thermal behavior of commonly used packages such as pin grid arrays (PGA), ball grid array (BGA), or quad flat pack (QFP) are well-studied, the influence of the Embedded Power packaging architecture on the overall thermal performance of the IPEMs is not well known. This motivates the presentation of this dissertation in developing an in-depth understanding on the thermal behavior of the Embedded Power modules. In addition, this dissertation outlines some general guidelines for the thermal modeling and thermal testing for the Embedded Power modules. Finally, this dissertation summarizes a few thermal design guidelines for the Embedded Power modules. Hence,read more
Citations
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Book ChapterDOI
Thermal Management Fundamentals and Design Guides in Electronic Packaging
TL;DR: In this article, the authors provide an outline of thermal challenges in advanced electronic packaging, heat transfer theory, and its application in thermal design, development of thermal management solutions, advanced thermal management materials selection and component design guideline, as well as environmental compatibility requirements in thermal management of electronic packaging.
Dissertation
Planar Metallization Failure Modes in Integrated Power Electronics Modules
TL;DR: In this paper, the authors proposed a planar metallization-based integrated power module for high frequency and high power density applications, which can realize the conventional discrete inductors, capacitors and switch circuits with planar modules.
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