Patent•
Bendable high flux led array
07 Jan 2003-
TL;DR: A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreadingers and electrically insulated from these heat spreadsers by the dielectrics material as mentioned in this paper.
Abstract: A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.
Citations
More filters
TL;DR: In this article, the authors present stretchable and printable semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed, or otherwise deformed.
Abstract: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
1,673 citations
Patent•
02 Jun 2005TL;DR: In this article, the authors present methods and devices for fabricating printable semiconductor elements and assembling them onto substrate surfaces, which are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on polymeric materials.
Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
558 citations
Patent•
28 Mar 2008
TL;DR: In this paper, a light-emitting diode package is described, consisting of a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in serial with each other, and a fluorescent body for converting the wavelength of light emitted by the light emitting diodes.
Abstract: Disclosed is a light-emitting diode package, comprising: a package body having a cavity; a light-emitting diode chip having a plurality of light-emitting cells connected in serial with each other; a fluorescent body for converting the wavelength of light emitted by the light-emitting diode chip; and a pair of lead electrodes. The light-emitting cells are connected together in series between the pair of lead electrodes.
553 citations
Patent•
31 Oct 2007TL;DR: In this article, the authors describe a range of useful physical and mechanical properties including flexibility, shapeability, conformability, and stretchablity of printed optical devices and devices, such as light emitting devices, light collecting systems, light sensing systems and photovoltaic systems.
Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
532 citations
Patent•
12 May 2010TL;DR: In this article, a number of printable structures and methods for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components.
Abstract: Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
444 citations
References
More filters
Patent•
28 Aug 2002TL;DR: In this paper, a light emitting device (10) using an LED, comprising a mounting substrate (1), a light-emitting element (2) mounted on the mounting substrate with its face down, a fluorescent member (3) disposed to face the light-outgoing surface (S) of the light emitting element in non-contact with the element, and an optical member (4) that distributes to the outside of the device a light beam shone thereinto from the element via the member(3).
Abstract: A light emitting device (10) using an LED, comprising a mounting substrate (1), a light emitting element (2) mounted on the mounting substrate (1) with its face down, a fluorescent member (3) disposed to face the light-outgoing surface (S) of the light emitting element (2) in non-contact with the element (2), and an optical member (4) that distributes to the outside of the device a light beam shone thereinto from the element (2) via the member (3). A light beam from the element (2) is shone into the member (3) to excite a phosphor, and the phosphor emits a light beam having a wavelength different from that of the incident light. A light beam from the element (2) that has passed through the member (3) without being absorbed by the member and a light beam emitted from the phosphor are incident into the optical member (4) and distributed. The fluorescent member (3), being not in contact with the element (2), never receive the heat of the element (2) through heat conduction and is protected against deterioration by heat. A face-down mounting allows the fluorescent member (3) and the optical member (4) to approach the element (2) as long as they are kept out of contact with the element (2). As a result, light can be efficiently picked up whole prolonging the life of an easy-to-deteriorate phosphor or phosphor-containing resin, and light can be distributed in a specified direction.
493 citations
Patent•
22 Feb 2001
TL;DR: In this paper, an electrically driven light emitting diode (LED) assembly comprising a light emitter (12), first ( 14 ) and second ( 16 ) electrical leads for conducting electricity to and from the light emitting dode (12 ), and a heat sink (18 ).
Abstract: An electrically driven light emitting diode (LED) assembly comprising a light emitting diode ( 12 ), first ( 14 ) and second ( 16 ) electrical leads for conducting electricity to and from the light emitting diode ( 12 ), and a heat sink ( 18 ). The assembly is characterized by the first lead ( 14 ) including the heat sink ( 18 ) for conducting electricity and heat from the light emitting diode ( 12 ) through the heat sink ( 18 ). In other words, the diode ( 12 ) conducts electricity through a heat sink ( 18 ) allowing the diode ( 12 ) to be in electrical conductivity with the heat sink ( 18 ).
417 citations
Patent•
20 Oct 1997
TL;DR: In this paper, an electrically driven L.E.D. lamp assembly is characterized by a non-conductive spacer for preventing contact between the conductive plating (50) and the heat sink to prevent electrical shorting between the plating and heat sink while maximizing heat transfer.
Abstract: An electrically driven L.E.D. lamp assembly (14) comprising an electrically insulating circuit board (26) having opposed first and second surfaces with light emitting diodes (28) having positive and negative leads (30, 32) mounted on the first surface. A plurality of holes extend through the board (26) and a plurality of pads (50) of thermally conductive plating are disposed on the second side with each pad (50) associated with the leads to conduct heat from each of the leads to one of the pads (50) while maintaining electrical isolation between the pads. A heat sink includes a base (36) overlying the second surface and an adhesive layer (58) of thermally conductive adhesive is disposed between the conductive plating and the heat sink (36) to secure the conductive plating and the circuit board (26) to the heat sink (36). The assembly is characterized by an electrically non-conductive spacer (56, 156) for preventing contact between the conductive plating (50) and the heat sink to prevent electrical shorting between the conductive plating (50) and the heat sink (36) while maximizing heat transfer. The spacer may comprise a pre-cured coating of the same material as the adhesive (58) or discrete elements (156).
362 citations
Patent•
[...]
09 Oct 2001
TL;DR: In this article, a light emitting diode array with a metal substrate, a dielectric layer disposed above the metal substrate and a plurality of electrically conductive traces disposed on the layer is described.
Abstract: A light emitting diode array in accordance with the present invention includes a metal substrate, a dielectric layer disposed above the metal substrate, and a plurality of electrically conductive traces disposed on the dielectric layer. A plurality of vias pass through the dielectric layer. The light emitting diode array also includes a plurality of light emitting diodes, each of which is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact electrically coupled to separate ones of the electrically conductive traces. Each of the vias contains a thermally conductive material in thermal contact with the metal substrate and in thermal contact with the corresponding light emitting diode.
300 citations
Patent•
16 Sep 1994TL;DR: In this paper, the bus bars and the leads of each LED lamp may be integral with each other, connected by an interlocking interaction or interference fit between approximately complementary portions of each lead and bus bar.
Abstract: A LED module for providing a source of illumination comprises a plurality of LED lamps each having an anode lead and a cathode lead for providing electrical and mechanical connection. The anode lead of each LED lamp is connected to an anode bus bar and the cathode lead of each LED lamp is connected to a cathode bus bar by solderless connection. The bus bars and the leads of each LED lamp may be integral with each other. Alternatively, the bus bars and leads may be non-integral with each other, connected by an interlocking interaction or interference fit between approximately complementary portions of each lead and bus bar. The LED module may accommodate serial electrical interconnection with other LED modules, it may be shaped according to the particular contour or design of an accommodating light assembly, and it may comprise LED lamps placed at arbitrary positions to achieve a predetermined degree of illumination.
269 citations