Bibliography of Heat Transfer in Electronic Equipment
IBM1
01 Jun 1985-IEEE Transactions on Components, Hybrids, and Manufacturing Technology (IEEE)-Vol. 8, Iss: 2, pp 289-295
TL;DR: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented in this paper, covering the period from 1970-1984, although a majority of the papers listed were published in the last three years.
Abstract: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented. The papers are arranged in twelve categories, and cover the period from 1970-1984, although a majority of the papers listed were published in the last three years.
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229 citations
Patent•
Cray1
TL;DR: In this paper, a liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid.
Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.
69 citations
Patent•
Cray1
TL;DR: A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery devices as mentioned in this paper, which form an asymmetric non-uniform density full-cone spray pattern.
Abstract: A spray cooling system includes a spray delivery device and a cooling liquid delivered to the spray delivery device. The spray delivery device includes one or more inlet apertures and one or more corresponding outlet apertures, at least one pair of inlet aperture and corresponding outlet aperture being positioned relative to each so as to form an asymmetric non-uniform density full-cone spray pattern.
69 citations
TL;DR: In this article, a physical model is presented that describes mechanisms for operating-equipment junction-to-ambient thermal resistance in excess of a typical component manufacturer's data-sheet value by as much as a factor of four under constant cooling conditions.
Abstract: A physical model is presented that describes mechanisms for operating-equipment junction-to-ambient thermal resistance in excess of a typical component manufacturer's data-sheet value by as much as a factor of four under constant cooling conditions. The model accounts for the discrepancy between system thermal performance of a package and data-sheet thermal resistance value which are not accompanied by qualifying data in the form of junction-to-header thermal resistance, board temperature rise over ambient, convection coefficient, mounting sensitivity, and power dissipation. The eight constants used to predict inherent increases in package thermal resistance when going from the data-sheet-specified operating conditions to the excess-value conditions are described. These constants and procedures for obtaining them are given for dual in-line packages (DIPs), pin-grid arrays (PGAs), small-outline transistors (SOTs), and plastic leaded chip carriers (PLCCs). >
60 citations
TL;DR: In this paper, selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years and the emphasis is on the past 50 years, where the technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems.
Abstract: Selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years. The emphasis is on the past 50 years. The technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems.
58 citations
Cites background from "Bibliography of Heat Transfer in El..."
...Antonetti and Simons [ 2 ] compiled a bibliography listing 237 publications, most of which appeared in the early 1980s....
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References
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TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.
4,214 citations
01 Jan 1981
TL;DR: In this article, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Abstract: While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.
481 citations
Book•
01 Jan 1983
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ
Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی
339 citations
TL;DR: In this article, a multi-faceted experimental investigation has been carried out to study heat transfer and pressure drop for airflow in arrays of heat generating rectangular modules deployed along one wall of a flat rectangular duct.
213 citations
TL;DR: In this article, the authors used a 15.8 mm o.d. plain copper tube and three copper enhanced surfaces: a Union Carbide High Flux surface, a Hitachi Thermoexcell-E surface and a Wieland Gewa-T surface.
Abstract: Pool boiling heat-transfer measurements were made using a 15.8 mm o.d. plain copper tube and three copper enhanced surfaces: a Union Carbide High Flux surface, a Hitachi Thermoexcell-E surface and a Wieland Gewa-T surface. The dielectric fluids were Freon-113 and Fluorinert FC-72, a perfluorinated organic compound manufactured to cool electronic equipment. Data were taken at atmospheric pressure, and at heat fluxes from 100 W/m/sup 2/ to 200,000 W/m/sup 2/. Prior to operation, each test surface was subjected to one of three aging procedures to observe the effect of surface past history upon boiling incipience. For Freon-113 the enhanced surfaces showed a two to tenfold increase in the heat-transfer coefficient when compared to a plain tube, whereas for FC-72 an increase of two to five was measured. The High Flux surface gave the best performance over the range of heat fluxes. The Gewa-T surface did not show as much of an enhancement at low fluxes as the other two surfaces, but at high fluxes its performance improved. In fact, it was the only surface tested which delayed the onset of film boiling with FC-72. The degree of superheat required to activate the enhanced surfaces was sensitive to both past history ofmore » the surface and to fluid properties.« less
183 citations