Binary group III-nitride based heterostructures: band offsets and transport properties
TL;DR: In this paper, the growth of non-polar III-nitrides has been an important subject due to its potential improvement on the efficiency of III-nodes-based opto-electronic devices.
Abstract: In the last few years, there has been remarkable progress in the development of group III-nitride based materials because of their potential application in fabricating various optoelectronic devices such as light emitting diodes, laser diodes, tandem solar cells and field effect transistors. In order to realize these devices, growth of device quality heterostructures are required. One of the most interesting properties of a semiconductor heterostructure interface is its Schottky barrier height, which is a measure of the mismatch of the energy levels for the majority carriers across the heterojunction interface. Recently, the growth of non-polar III-nitrides has been an important subject due to its potential improvement on the efficiency of III-nitride-based opto-electronic devices. It is well known that the c-axis oriented optoelectronic devices are strongly affected by the intrinsic spontaneous and piezoelectric polarization fields, which results in the low electron-hole recombination efficiency. One of the useful approaches for eliminating the piezoelectric polarization effects is to fabricate nitride-based devices along non-polar and semi-polar directions. Heterostructures grown on these orientations are receiving a lot of focus due to enhanced behaviour. In the present review article discussion has been carried out on the growth of III-nitride binary alloys and properties of GaN/Si, InN/Si, polar InN/GaN, and nonpolar InN/GaN heterostructures followed by studies on band offsets of III-nitride semiconductor heterostructures using the x-ray photoelectron spectroscopy technique. Current transport mechanisms of these heterostructures are also discussed.
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01 Mar 1997
TL;DR: In this article, first principles electronic structure calculations on wurtzite AlN, GaN, and InN reveal crystal field splitting parameters ΔCF of −217, 42, and 41 meV, respectively.
Abstract: First‐principles electronic structure calculations on wurtzite AlN, GaN, and InN reveal crystal‐field splitting parameters ΔCF of −217, 42, and 41 meV, respectively, and spin–orbit splitting parameters Δ0 of 19, 13, and 1 meV, respectively. In the zinc blende structure ΔCF≡0 and Δ0 are 19, 15, and 6 meV, respectively. The unstrained AlN/GaN, GaN/InN, and AlN/InN valence band offsets for the wurtzite (zinc blende) materials are 0.81 (0.84), 0.48 (0.26), and 1.25 (1.04) eV, respectively. The trends in these spectroscopic quantities are discussed and recent experimental findings are analyzed in light of these predictions.
274 citations
TL;DR: In this paper, the fundamental mechanism and interfacial charge transfer dynamics in TiO2/graphene nanocomposites are reviewed and the design strategies of various graphene-based hybrids are highlighted along with some specialized synthetic routes adopted to attain preferred properties.
103 citations
TL;DR: In this article, a general overview of the semiconductor materials applied as photoelectrodes in the treatment of various pollutants is presented, with a particular focus on the main experimental conditions employed in the photo-electrocatalytic degradation of various contaminants.
Abstract: Industrial sources of environmental pollution generate huge amounts of industrial wastewater containing various recalcitrant organic and inorganic pollutants that are hazardous to the environment. On the other hand, industrial wastewater can be regarded as a prospective source of fresh water, energy, and valuable raw materials. Conventional sewage treatment systems are often not efficient enough for the complete degradation of pollutants and they are characterized by high energy consumption. Moreover, the chemical energy that is stored in the wastewater is wasted. A solution to these problems is an application of photoelectrocatalytic treatment methods, especially when they are coupled with energy generation. The paper presents a general overview of the semiconductor materials applied as photoelectrodes in the treatment of various pollutants. The fundamentals of photoelectrocatalytic reactions and the mechanism of pollutants treatment as well as parameters affecting the treatment process are presented. Examples of different semiconductor photoelectrodes that are applied in treatment processes are described in order to present the strengths and weaknesses of the photoelectrocatalytic treatment of industrial wastewater. This overview is an addition to the existing knowledge with a particular focus on the main experimental conditions employed in the photoelectrocatalytic degradation of various pollutants with the application of semiconductor photoelectrodes.
53 citations
TL;DR: In this article, a novel nanowire structure adopting a graded-index separate confinement heterostructure (GRINSCH) in which the active region is sandwiched between two compositionally graded AlGaN layers, namely, a GRINSCH diode, is proposed.
Abstract: High-density dislocations in materials and poor electrical conductivity of p-type AlGaN layers constrain the performance of the ultraviolet light emitting diodes and lasers at shorter wavelengths. To address those technical challenges, we design, grow, and fabricate a novel nanowire structure adopting a graded-index separate confinement heterostructure (GRINSCH) in which the active region is sandwiched between two compositionally graded AlGaN layers, namely, a GRINSCH diode. Calculated electronic band diagram and carrier concentrations show an automatic formation of a p–n junction with electron and hole concentrations of ∼1018 /cm3 in the graded AlGaN layers without intentional doping. The transmission electron microscopy experiment confirms the composition variation in the axial direction of the graded AlGaN nanowires. Significantly lower turn-on voltage of 6.5 V (reduced by 2.5 V) and smaller series resistance of 16.7 Ω (reduced by nearly four times) are achieved in the GRINSCH diode, compared with the ...
48 citations
TL;DR: In this paper , the morphology and structure of these materials influence on the sensor response, and challenges and future perspectives for ZnO chemiresistive sensors are also discussed, focusing on how the morphology of the materials can influence on sensor response.
Abstract: Chemiresistive gas sensors have been widely applied to monitor analytes of environmental, food and health importance. Among the plethora of materials that can be used for designing chemiresistive sensors, ZnO is one of the most explored for gas sensing, as this material has a low-cost, is non-toxic and can be easily obtained through standard chemical synthesis. Adding to this, ZnO can form heterostructures capable to improve sensor performance regarding sensitivity, selectivity and stability. Moreover, ZnO heterostructures also contribute to lower operating temperature of gas sensors, since the synergistic effects contribute to amplify the sensor signal. In this review, we survey recent advances on different types of chemiresistive ZnO-based gas sensors, focusing on how the morphology and structure of these materials influence on the sensor response. Challenges and future perspectives for ZnO chemiresistive sensors are also discussed.
47 citations
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TL;DR: A nested interface band alignment with ΔEv=1.36±0.07 eV was obtained in this paper. But the alignment was not applied to the AlN/GaN (0001) heterojunction interface.
Abstract: X‐ray photoemission spectroscopy has been used to measure the valence band offset ΔEv for the AlN/GaN (0001) heterojunction interface. The heterojunction samples were grown by reactive molecular beam epitaxy on 6H–SiC (0001) substrates. A nested interface band alignment with ΔEv=1.36±0.07 eV is obtained (ΔEc/ΔEv=52/48).
222 citations
TL;DR: In this paper, the growth of hexagonal GaN on Si(111) by gas source molecular beam epitaxy with ammonia was described, where the initial deposition of Al, at 1130-1190 K, resulted in a very rapid transition to a two-dimensional growth mode of AlN.
Abstract: We describe the growth of hexagonal GaN on Si(111) by gas source molecular beam epitaxy with ammonia. The initial deposition of Al, at 1130–1190 K, resulted in a very rapid transition to a two-dimensional growth mode of AlN. The rapid transition is essential for the subsequent growth of high quality GaN and AlGaN. This procedure also resulted in complete elimination of cracking in thick (>2 μm) GaN layers. For layers thicker than 1.5 μm, the full width at half maximum of the (0002) GaN diffraction peak was less than 14 arc sec. We show that a short period superlattice of AlGaN/GaN grown on the AlN buffer can be used to block defects propagating through GaN, resulting in good crystal and luminescence quality. At room temperature, the linewidth of the GaN exciton recombination peak was less than 40 meV, typical of the best samples grown on sapphire.
215 citations
TL;DR: In this article, the core level binding energies with respect to the valence-band maximum in both GaN and AlN bulk films were measured by x-ray photoemission spectroscopy.
Abstract: The valence‐band discontinuity at a wurtzite GaN/AlN(0001) heterojunction is measured by x‐ray photoemission spectroscopy. The method first measures the core level binding energies with respect to the valence‐band maximum in both GaN and AlN bulk films. The precise location of the valence‐band maximum is determined by aligning prominent features in the valence‐band spectrum with calculated densities of states. Tables of core level binding energies relative to the valence‐band maximum are reported for both GaN and AlN. Subsequent measurements of separations between Ga and Al core levels for thin overlayers of GaN film grown on AlN and vice versa yield a valence‐band discontinuity of ΔEV=0.8±0.3 eV in the standard type I heterojunction alignment.
213 citations
TL;DR: In this paper, two Schottky diodes were fabricated by evaporation of nickel on to an n-type CdF2:YF3 semiconductor and the characteristics of the interface states (energy position, density, time constant and capture cross-section) were obtained for the values of the forward bias in the range 0.0 V ≦V ≦ 0.2 V.
Abstract: Two Schottky diodes were fabricated by evaporation of nickel on to an n-type CdF2:YF3 semiconductor. Diode A was prepared on a slightly etched polished surface and diode B on an unpolished strongly etched surface. The current-voltage (I-V), capacitance-voltage (C-V), and conductance-voltage (G-V) characteristics were determined at room temperature. Both diodes showed non-ideal I-V behaviour with ideality factors 1.5 and 2.0, respectively and are thought to have a metal-interface layer-semiconductor configuration. Under forward bias, the admittance showed large frequency dispersion possibly caused by the interface states in thermal equilibrium with the semiconductor. Analysis of the C-V data in terms of Lehovec's model of an interface state continuum required the supposition of two time constants differing by 2 to 3 orders of magnitude. The characteristic parameters of the interface states (energy position, density, time constant and capture cross-section) were obtained for the values of the forward bias in the range 0.0 V ≦ V ≦ 0.2 V. The diode B is found to have the interface state densities about two orders of magnitude higher than the diode A which may be attributed to the different surface treatments. The C-V measurements at 100 kHz also indicated the presence of a deep donor trap about 0.6 eV below the conduction band edge in diode A.
191 citations
TL;DR: In this paper, the growth of GaN films on Si (111) substrates has been studied and 3C-SiC is found to be an effective intermediate layer for growth of single crystalline GaN film with flat surfaces.
185 citations