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Dissertation

Boiling and condensation in a liquid-filled enclosure,

01 Jan 1971-
TL;DR: Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971 as discussed by the authors, Massachusetts State University, Boston, Massachusetts, U.S.
Abstract: Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971.
Citations
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Patent
Andreas C. Pfahnl1
30 Sep 2004
TL;DR: In this article, an electronic system includes an array of electronic assemblies at a first location within a system, and liquid cooling assemblies are placed at a second location within the system, for cooling the electronic assemblies.
Abstract: An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.

54 citations

Journal ArticleDOI
TL;DR: In this paper, the authors look at the entire cooling approach from the chip level all the way to the plenum level, and propose a solution with dimensions of $150~{rm mm} \times 300~{\rm mm] \times 38$ mm ( $H \times L \times W$ ).
Abstract: As the demand grows for electronics to become faster and more compact, the expectation for tomorrow’s data center is no different. Like many of the current high performance data center installations, design considerations on all scales must be taken into account. The proposed solution does just this by looking at the entire cooling approach from the chip level all the way to the plenum level. The solution’s enclosure, where all the heated elements are immersed in either FC-72 or Novec 649, has dimensions of $150~{\rm mm} \times 300~{\rm mm} \times 38$ mm ( $H \times L \times W$ ). The design is versatile allowing for either flow or pool boiling heat transfer. Under pool boiling conditions, heat transfer coefficients as high as 11.5 kW/ $\text{m}^{2}\,\cdot \,\text{K}$ were achieved with surface enhancements and maximum power dissipations as high as 320 W were yielded as chip temperatures were roughly 58 °C, well below typical operating conditions. With the introduction of dielectric fluid flow within the enclosure, maximum power dissipations achieved increased substantially, reaching 605 W, which corresponds to a volumetric power dissipation of 0.354 W/cm3.

24 citations


Cites background from "Boiling and condensation in a liqui..."

  • ...area, although there are certainly a number of other factors at play [10]....

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  • ...The concept of condensation limited heat transfer proposed in [10] was also found to be a factor with this paper and will be discussed in greater detail at the point that the pertinent data are presented....

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  • ...In accordance with [10], the slope of the maximum heat dissipations achieved follows a linear trend as facility water temperature is decreased, suggesting a constant system level thermal resistance....

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  • ...In [10], it was clear that the reason for this has to be what was referred to as condensive limitations....

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  • ...paper is that done in [10], where, similar to the proposed...

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Book ChapterDOI
01 Jan 1994
TL;DR: In this paper, the theory and practice of direct liquid cooling of microelectronic components is discussed, and a morphological analysis is suggested for the classification of liquid-cooling concepts.
Abstract: The present work reviews the theory and practice of direct liquid cooling of microelectronic components. A morphological analysis is suggested for the classification of liquid-cooling concepts. While both immersion and microgroove cooling of chips are discussed, the emphasis is on immersion cooling. The performance of individual chips and liquid incapsulated modules, including the submerged condenser, is reviewed in detail, with data presented. Flow-through modules and falling-film techniques are also discussed. Finally, figures-of-merit for coolants are noted.

20 citations

Journal ArticleDOI
TL;DR: In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.
Abstract: Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.

19 citations

Journal ArticleDOI
TL;DR: In this paper, the authors explored the possibilities of developing a passive LWR design concept which could ensure sufficient decay heat removal in the absence of emergency primary coolant supply without exceeding the safe temperature limit on cladding, and which could achieve large nominal operating power output in the range 600-1000 MWe.

15 citations

References
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Journal ArticleDOI
M. Mark, M. Stephenson1, C. Goltsos1
TL;DR: In this article, the development and design of an evaporative system utilizing gravity return flow is discussed, and the test results of such a system are compared with those obtained utilizing a conventional metallic conductive paths technique.
Abstract: In airborne electronic packages, for either thermal or electrical reasons cooling air often is not ducted directly over the components but is passed through a heat exchanger. Consequently, the thermal path between the heat exchanger and the components must be of low impedance to result in efficient heat transfer. The high heat transfer coefficients obtainable as a liquid boils and condenses permit an effective reduction of the temperature drop between the electronic components and the heat exchanger. In this paper the development and design of an evaporative system utilizing gravity return flow is discussed, and the test results of such a system are compared with those obtained utilizing a conventional metallic conductive paths technique. Where heat dissipation or cooling air inlet temperature is high, the evaporative-gravity (ev-grav) system is shown to be the most effective.

9 citations

Journal ArticleDOI
C. Goltsos1, m. Mark
TL;DR: In this paper, a flexible container is proposed for electronic packages where high voltages exist, and a simple, novel, weight-saving technique for accomplishing this consists essentially of replacing the conventional container with a flexible one (for example, fabric-reinforced rubber).
Abstract: In electronic packages where high voltages exist, a high dielectric strength environment surrounding the components is necessary. Liquid-filled units have used various oils which in addition to dielectric strength provide good thermal paths for cooling; evaporative-cooled units often use refrigerants. In either case allowance, volume-wise, must be made for thermal expansion of the fluid. A simple, novel, weight-saving technique for accomplishing this consists essentially of replacing the conventional container with a flexible one (for example, fabric-reinforced rubber). The flexible container then expands and contracts accomodating volume variations in the fluid. Design details, test results, and a general evaluation illustrating the adaptability of the flexible container as a practical design tool are discussed.

5 citations