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Proceedings ArticleDOI

Challenges of power electronic packaging and modeling

TL;DR: In this article, the authors present a state-of-the-art and in-depth overview of recent advances, challenges and opportunities in power electronic packaging design and modeling and discuss the challenges of power semiconductor packaging and modeling.
Abstract: Power electronic packaging is one of the fastest changing areas of technology in the power electronic industry due to the rapid advances in power integrated circuit (IC) fabrication and the demands of a growing market in almost all areas of power electronic application such as portable electronics, consumer electronics, home electronics, computing electronics, automotive, railway and high/strong power industry. However, due to the intrinsic high power dissipation, the performance requirement for power products are extremely high, especially in handling harsh thermal and electrical environments. The design rules and material and structure layout of power packaging are quite different from regular IC packaging. This talk will present a state-of-art and in-depth overview of recent advances, challenges and opportunities in power electronic packaging design and modeling. A review of recent advances in power electronic packaging is presented based on the development of power device integration. The talk will cover in more detail how challenges in both semiconductor content and advanced power package design and materials have co-enabled significant advances in power device capability during recent years. Extrapolating the same trends in representative areas for the remainder of the decade serves to highlight where further improvement in materials and techniques can drive continued enhancements in usability, efficiency, reliability and overall cost of power semiconductor solutions. Along with new power packaging development, modeling is a key to assure successful package design. An overview of the power package modeling is presented. Challenges of power semiconductor packaging and modeling in both next generation design and assembly processes are presented and discussed.
Citations
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Journal ArticleDOI
10 Mar 2017-Energies
TL;DR: In this article, the authors present a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules, and discuss the major technology barriers preventing SiC power devices from performing to their fullest ability.
Abstract: This paper presents a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered these advancements, the major technology barriers preventing SiC power devices from performing to their fullest ability were identified. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were described, and the concept for a novel SiC power module was discussed.

58 citations


Cites background from "Challenges of power electronic pack..."

  • ...However, like with most copper wire bonding approaches, this has the risk of damaging the die due to excessive bonding force/energy [36]....

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  • ...In their 2011 paper summarizing the challenges in power packaging, Liu and Kinzer [36] from Fairchild Semiconductor hailed SiC as a foreseeable future replacement for silicon power devices....

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Journal ArticleDOI
TL;DR: In this article, an artificial neural network using back-propagation as training (using 1440 bonding samples) was used; 2200 bonding test samples were then used to verify the performance of the bonding strength prediction system.
Abstract: Heavy aluminum wire wedge bonding is commonly used in the packages of power electronic devices. In this paper, a heavy aluminum wire wedge bonding strength prediction system was developed. In this system, the driving current of the transducer system was recorded by a data acquisition system, decomposed, and analyzed using a wavelet model. The fundamental frequency component was extracted, and seven characteristics (five in the time domain and two in the frequency domain) were obtained from the experimental observations. An artificial neural network using back-propagation as training (using 1440 bonding samples) was used; 2200 bonding test samples were then used to verify the performance of the bonding strength prediction system. Experimental results show that this method can be used to accurately predict the shear strength of heavy aluminum wire wedge bonding.

11 citations


Cites methods from "Challenges of power electronic pack..."

  • ...This bonding method is widely used to connect the chip and substrate within the package of the power electronic device using aluminum wires [2]....

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Proceedings ArticleDOI
28 May 2013
TL;DR: In this paper, the warpage after molding process of a power module is investigated, and an improvement method is introduced to balance off the convex warpage issue and flash issue.
Abstract: Comparing with the single-chip power packages, the power modules usually have a much larger size due to multiple die built inside. This may induce quite a big package warpage in the assembly process, especially after molding, which makes the package warpage big impact on the DBC substrate, as well as on the silicon die when mounting the power module to an external heat sink during application. Therefore, in this paper, the warpage after molding process of a power module is investigated, and an improvement method is introduced. After molding, the DBC side of the power module may have convex warpage. To reduce the convex warpage, the pre-concave warpage of the DBC substrate is generated during molding process, to balance off part of the convex warpage. However, the concave profile at the DBC side may cause some flash issue around the DBC area during transferring molding process. Both FEA modeling and practical measurement of the package warpage of the power module are conducted thoroughly. It is found that the trends of FEA simulation results are consistent with the measurement data for the package warpage. By balancing off the warpage issue and flash issue, a better option of the preconcave warpage of the DBC substrate is presented for mass production.

7 citations


Cites methods from "Challenges of power electronic pack..."

  • ...Both ceramic and organic polymer substrates have been successfully used as the carrier to integrate semiconductor chips in order to realize the power module packaging [1-4]....

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Proceedings ArticleDOI
01 Mar 2017
TL;DR: In this paper, a 3D integrated power module with a fixed inductor with a cavity is used to envelop the 3D power module, and the high thermal conductivity of the magnetic core significantly enhances heat dissipation.
Abstract: This paper presents a 3D integrated power module design to effectively save footprint and improve thermal performance The design reduces the footprint by 40% using a 3D structure in which the inductor is over the top of the regulator A fixed inductor with a cavity is used to envelop the 3D power module, and the high thermal conductivity of the magnetic core significantly enhances heat dissipation An efficiency-wise design is applied to the proposed power module and there is a reduction in inductor DC resistance, which can in turn further improve the thermal performance An analytical thermal model is built to calculate the temperature, 3D FEA (Finite Element Analysis) simulation is also utilized to estimate the improvement in temperature field A prototype is built to test the electrical and thermal performances as well The DCR is reduced by more than 30% and the thermal performance is improved by 8–10°C compared with plastic molded power modules

6 citations


Cites background from "Challenges of power electronic pack..."

  • ...However, as the requirement of power density keeps growing, it is quite challenging to use conventional two dimension wire bonding or planar structures to make continued improvements [5]....

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Proceedings ArticleDOI
13 Jun 2016
TL;DR: In this paper, the authors demonstrate how multiphysics simulation works in power module development, including the simulation of the fringing effects to estimate the difference between practical and theoretical parasitic capacitance values of double-side metallized ultra-thin ceramic.
Abstract: Power electronics packaging is required by almost all areas of power electronics applications, such as consumer electronics, automotive, aircraft, and military applications. Due to the significant heat dissipation from the switching behavior of power semiconductor devices, the interactions between thermal, electrical and mechanical aspects become very important to not only power electronics packaging design, but also long-term reliability of power modules. The interactions become more and more significant as the development of wideband gap power semiconductor devices has pushed the power modules to be able to operate at higher voltage levels, higher ambient temperature and higher switching frequencies. Power module development relies more and more on Finite Element Method (FEM) based multiphysics simulations, reducing design cycles, to couple the electrical, thermal and mechanical fields in simulations of different processes such as power module assembly, operations and reliability assessments. In this paper, several cases were introduced to demonstrate how multiphysics simulation worked in power module development. The first case was the simulation of the fringing effects to estimate the difference between practical parasitic capacitance value and theoretical parasitic capacitance value of double-side metallized ultra-thin ceramic. The second case was the pre-stress analysis of power module substrate made of a specific ultra-thin ceramic. The third case was the study of electrical field distribution and temperature distribution in a high voltage and high temperature Silicon Carbide power module. The last case was parasitics extraction of a PCB busbar for 50 kW Electric Vehicle Motor Drive Applications.

5 citations


Cites methods from "Challenges of power electronic pack..."

  • ...Thus, power electronics packaging is more dependent on the rigorous use of the proven finite element methods based multiphysics simulations, as multiphysics simulation can effectively save design time and reduce design cycles [5-7]....

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References
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Journal ArticleDOI
TL;DR: A brief review of the current trends and future vehicle strategies and the function of power electronic subsystems are described and the requirements of power electronics components and electric motor drives for the successful development of these vehicles are presented.
Abstract: With the requirements for reducing emissions and improving fuel economy, automotive companies are developing electric, hybrid electric, and plug-in hybrid electric vehicles. Power electronics is an enabling technology for the development of these environmentally friendlier vehicles and implementing the advanced electrical architectures to meet the demands for increased electric loads. In this paper, a brief review of the current trends and future vehicle strategies and the function of power electronic subsystems are described. The requirements of power electronic components and electric motor drives for the successful development of these vehicles are also presented.

1,222 citations

Book
15 Jun 1994
TL;DR: This book provides an introduction and comprehensive reference to modeling and simulation techniques using computers and emphasizes applications in economics and the environmental sciences and contains a disk with simulation software (SIMPAS) and 50 system models.
Abstract: From the Publisher: This book provides an introduction and comprehensive reference to modeling and simulation techniques using computers. It emphasizes applications in economics and the environmental sciences and contains a disk with simulation software (SIMPAS) and 50 system models.

1,029 citations

Journal ArticleDOI
TL;DR: In this paper, the authors provide details on the current approach to multi-scale modeling and simulation of advanced materials for structural applications, including high-performance polymers, composites, and nanotube-reinforced polymers.

231 citations

Journal ArticleDOI
30 Apr 2007
TL;DR: The system requirement and latest development of power semiconductor devices including IGBTs, freewheeling diodes, and advanced power module technology in relating to electric vehicle applications are reviewed.
Abstract: Power semiconductor devices are key components in all power electronic systems, particularly in hybrid, electric, and fuel cell vehicles. This paper reviews the system requirement and latest development of power semiconductor devices including IGBTs, freewheeling diodes, and advanced power module technology in relating to electric vehicle applications. State-of-the-art silicon device technologies, their future trends, and theoretical limits are discussed. Emerging wide bandgap semiconductor devices such as SiC devices and their potential applications in electric vehicles are also reviewed

90 citations