Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution
TL;DR: In this paper, a reduced order thermo-fluidic model is developed to predict the effect of both heat flux and liquid charge on the overall device thermal performance, which is validated against experimental results from a prototype device to agree within ±25%.
About: This article is published in International Journal of Heat and Mass Transfer.The article was published on 2020-05-01 and is currently open access. It has received 25 citations till now. The article focuses on the topics: Heat flux & Thermal conductivity.
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01 Jan 1993
TL;DR: In this paper, the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers was investigated using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed.
Abstract: An experimental investigation was conducted to determine the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers. Two types of micro heat pipe arrays were evaluated, one that utilized machined rectangular channels and the other that used an anisotropic etching process to produce triangular channels. Once fabricated, a clear pyrex cover plate was bonded to the top surface of each wafer using an ultraviolet bonding technique to form the micro heat pipe array. These micro heat pipe arrays were then evacuated and charged with a predetermined amount of methanol. Using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed. The experimental results were compared with those obtained for a plain silicon wafer
146 citations
TL;DR: In this article, the design and optimization of capillary-fed, thin-film evaporation devices through a heat and mass transfer lens is presented, which can guide future research into materials innovations, fabrication of novel architectures, and systems design/optimization for next generation, high-performance wick-based evaporators.
Abstract: Evaporation plays a critical role in a range of technologies that power and sustain our society. Wicks are widely used as passive, capillary-fed evaporators, attracting much interest since these devices are highly efficient, compact, and thermally stable. While wick-based evaporators can be further improved with advanced materials and fabrication techniques, modeling of heat and mass transport at the device level is vital for guiding these innovations. In this perspective, we present the design and optimization of capillary-fed, thin film evaporation devices through a heat and mass transfer lens. This modeling framework can guide future research into materials innovations, fabrication of novel architectures, and systems design/optimization for next generation, high-performance wick-based evaporators. Furthermore, we describe specific challenges and opportunities for the fundamental understanding of evaporation physics. Finally, we apply our modeling framework to the analysis of two important applications—solar vapor generation and electronics cooling devices.
42 citations
TL;DR: In this article, the fundamental understanding of the inherent mechanisms of evaporator wicks, optimization strategies of macro/micro-scale structures, as well as fabrication technologies and their characteristics are discussed.
23 citations
29 Oct 2021
TL;DR: In this paper, the state-of-the-art in electronic cooling, classified into direct and indirect cooling, are reviewed and discussed in detail, along with the pros and cons of these thermal management methods.
Abstract: The cooling or thermal management issues are facing critical challenges with the continuous miniaturization and rapid increase of heat flux of electronic devices. Significant efforts have been made to develop high-efficient cooling and flexible thermal management solutions and corresponding design tools. This article reviews the latest progress and the state-of-the-art in electronic cooling, which could help inspire future research. The commonly used methods in electronic cooling, classified into direct and indirect cooling, are reviewed and discussed in detail. Direct cooling consists of air cooling, spray and jet impingement cooling, immersion cooling, and droplet electrowetting. As for indirect cooling, the most popular and hot topics of using microchannel, heat pipe, vapour chamber, thermoelectric, and PCM are overviewed. The effectiveness of the thermal management methods for different-level requirements of electronic cooling and the ways how heat transfer capability can be improved are also introduced in detail. Meanwhile, the pros and cons of these thermal management methods are discussed based on their inherent heat transfer performances/characteristics, optimisation methods, and relevant applications. In addition, the current challenges of electronic cooling and thermal management technologies are explored, along with the outlook of possible future advances.
17 citations
TL;DR: In this paper, the authors discuss recent research progress on structured surface-enhanced flow boiling and focus on the challenges remaining, including the need for better understanding of the mechanisms governing surface-structureenhanced Flow Boiling and their effect on heat transfer coefficient, critical heat flux, pressure drop, and flow stability.
Abstract: High-vapor-quality flow boiling on structured surfaces has the potential to enhance heat transfer performance and reduce temperature/pressure instability compared to conventional lower quality flow boiling on smooth surfaces. In this article, we discuss recent research progress on structured surface-enhanced flow boiling. We discuss lessons learned and focus on the challenges remaining. Although some degree of mechanistic understanding of the effect of surface structures on the flow boiling process has been gained, many important challenges remain to enable real utilization. Primarily, a need exists for a greater fundamental understanding of the processes if design tools are to be developed capable of guiding engineers to select and implement enhancements. The challenges discussed stem from a community-wide workshop focusing on high-exit-quality flow boiling, held in June 2020. Four key challenges were identified: 1) the need for better understanding of the mechanisms governing surface-structure-enhanced flow boiling and their effect on heat transfer coefficient, critical heat flux, pressure drop, and flow stability; 2) the need for rigorous quantification of surface durability and manufacturing scalability; 3) the need to understand effects of using working fluids other than water including refrigerants, supercritical fluids, and other dielectric fluids; and 4) the need to establish thermal resistance limits dependent on liquid film thickness. We end this article by providing conclusions detailing where we believe that the community should direct both fundamental and applied efforts in order to solve the identified challenges, which limits the implementation of high-vapor-quality flow boiling on surface structures.
17 citations
References
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Book•
01 Mar 1995
TL;DR: In this article, the authors present a detailed analysis of non-conventional heat pipe properties, including variable conductance heat pipes, and their properties in terms of heat transfer and mass transfer.
Abstract: Preface Nomenclature 1.Introduction 2.Solid-Liquid-Vapor Phenomena, Driving Forces and Interfacial Heat and Mass Transfer 3.Steady Hydrodynamic and Thermal Characteristics 4.Heat Transfer Limitations 5.Continuum Transient and Frozen Startup Behavior of Heat Pipes 6.Two-Phase Closed Thermosyphons 7.Rotating and Revolving Heat Pipes 8.Variable Conductance Heat Pipes 9.Capillary Pumped Loop and Loop Heat Pipe Systems 10.Micro/Miniature Heat Pipe Characteristics and Operating Limitations 11.Heat Pipe Heat Exchangers 12.Analysis of Nonconventional Heat Pipes 13.Special Effects on Heat Pipes 14.Heat Pipe Fabrication, Processing, and Testing Appendix A:Thermophysical Properties Appedix B:Experimental Heat Pipe Results Index
1,516 citations
1,130 citations
25 Sep 2006
TL;DR: The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use and merits and demerits of using nanoparticles and nanotubes for TIM applications.
Abstract: With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very beneficial
785 citations
Book•
01 Jan 2008
TL;DR: In this article, a nanoscale view of the liquid-vapor interfacial region is presented, and a macroscopic treatment of the interfacial interface is proposed to evaluate the effect of liquid surface tension on contact angle.
Abstract: Pt. 1. Thermodynamic and mechanical aspects of interfacial phenomena and phase transitions -- 1. Liquid-vapor interfacial region - A nanoscale perspective -- 1.1. Molecular perspective on liquid-vapor transitions -- 1.2. Interfacial region - Molecular theories of capillarity -- 1.3. Nanoscale features of the interfacial region -- 1.4. Molecular dynamics simulation studies of interfacial region thermophysics -- 2. Liquid-vapor interface - a macroscopic treatment -- 2.1. Thermodynamic analysis of interfacial tension effects -- 2.2. Determination of interface shapes at equilibrium -- 2.3. Temperature and surfactant effects on interfacial tension -- 2.4. Surface tension in mixtures -- 2.5. Near critical point behavior -- 2.6. Effects of interfacial tension gradients -- 3. Wetting phenomena and contact angles -- 3.1. Equilibrium contact angles on smooth surfaces -- 3.2. Wettability, cohesion, and adhesion -- 3.3. Effect of liquid surface tension on contact angle -- 3.4. Adsorption --^
625 citations