Open AccessBook
Circuits, interconnections, and packaging for VLSI
Reads0
Chats0
About:
The article was published on 1990-01-01 and is currently open access. It has received 1840 citations till now. The article focuses on the topics: Very-large-scale integration.read more
Citations
More filters
Journal ArticleDOI
Low-power CMOS digital design
TL;DR: In this paper, techniques for low power operation are presented which use the lowest possible supply voltage coupled with architectural, logic style, circuit, and technology optimizations to reduce power consumption in CMOS digital circuits while maintaining computational throughput.
Book
Fundamentals of Modern VLSI Devices
Yuan Taur,Tak H. Ning +1 more
TL;DR: In this article, the authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices.
Book
Parallel Computer Architecture: A Hardware/Software Approach
TL;DR: This book explains the forces behind this convergence of shared-memory, message-passing, data parallel, and data-driven computing architectures and provides comprehensive discussions of parallel programming for high performance and of workload-driven evaluation, based on understanding hardware-software interactions.
Journal ArticleDOI
The future of wires
R. Ho,Ken Mai,Mark Horowitz +2 more
TL;DR: Wires that shorten in length as technologies scale have delays that either track gate delays or grow slowly relative to gate delays, which is good news since these "local" wires dominate chip wiring.
Journal ArticleDOI
Rationale and challenges for optical interconnects to electronic chips
TL;DR: Optical interconnects to silicon CMOS chips are discussed in this paper, where various arguments for introducing optical interconnections to silicon chips are summarized, and the challenges for optical, optoelectronic, and integration technologies are discussed.