Comparative study of various release methods for gold surface micromachining
Citations
14 citations
Cites methods from "Comparative study of various releas..."
...The final step of the fabrication process is the removal of sacrificial layer using critical point dryer (CPD).(16) During the implementation of fabrication processes, two major issues are encountered; unwanted flakes and poor adhesion of gold....
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13 citations
Cites methods or result from "Comparative study of various releas..."
...However, a thin structural layer of the gold switch curled up due to stress [13]–[15], which results in a deviation from the simulated results....
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...These molds are filled with 2-μm-thick electroplating followed by the removal of photoresist and etching of the seed layer [13]....
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11 citations
Cites methods from "Comparative study of various releas..."
...6) The final step of the process is wet released using a critical point dryer (CPD) method as described in [11]....
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11 citations
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References
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Additional excerpts
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