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Journal ArticleDOI

Control of reactive sputtering processes

W. D. Sproul, +2 more
- 22 Nov 2005 - 
- Vol. 491, Iss: 1, pp 1-17
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TLDR
In this paper, both pulsed dc and mid-frequency ac power was used to prevent arcing during reactive sputtering of insulating films. But the results showed that the results were not optimal.
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This article is published in Thin Solid Films.The article was published on 2005-11-22. It has received 337 citations till now. The article focuses on the topics: Sputter deposition & Sputtering.

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Citations
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Journal ArticleDOI

High power impulse magnetron sputtering discharge

TL;DR: The high power impulse magnetron sputtering (HiPIMS) discharge is a recent addition to plasma-based sputtering technology as mentioned in this paper, where high power is applied to the magnetron target in unipolar pulse.
Journal ArticleDOI

Biaxial alignment in sputter deposited thin films

TL;DR: In this paper, an extended structure zone model is proposed for the in-plane alignment of biaxially aligned thin films, which can only be obtained when an overgrowth mechanism drives the microstructural evolution of the thin film.
Journal ArticleDOI

Tutorial: Reactive high power impulse magnetron sputtering (R-HiPIMS)

TL;DR: In this paper, a step-by-step approach is described for reactive high power impulsive magnetron sputtering (R-HiPIMS), which is a coating technology for high and low sputter yield materials, respectively.
Journal ArticleDOI

Review Article: Tracing the recorded history of thin-film sputter deposition: From the 1800s to 2017

TL;DR: In this article, the authors describe the history of thin-film growth by sputter deposition, which required the development of vacuum pumps and electrification of the electrical system to deal with the problem.
References
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Journal ArticleDOI

A 2dvEv- bit distributed algorithm for the directed Euler trail problem

TL;DR: The algorithm can be used as a building block for solving other distributed graph problems, and can be slightly modified to run on a strongly-connected diagraph for generating the existent Euler trail or to report that no Euler trails exist.
Journal ArticleDOI

A novel pulsed magnetron sputter technique utilizing very high target power densities

TL;DR: In this paper, the potential for high-aspect-ratio trench filling applications by high power pulsed magnetron sputtering is demonstrated by deposition in via-structures.
Journal ArticleDOI

Recent aspects concerning DC reactive magnetron sputtering of thin films: a review

TL;DR: In this article, the authors have discussed the hysteresis effect and the instability in the reactive gas pressure, differential poisoning of magnetron cathode, as well as the methods which are used to control the process.
Book

Handbook of Thin Film Process Technology: 98/1 Reactive Sputtering

TL;DR: In this article, the authors present a review of the state-of-the-art in the field of chemical vapor deposition and its application in semiconductor wafers, including the following:
Book

Handbook of sputter deposition technology

Kiyotaka Wasa, +1 more
TL;DR: A comprehensive overview of sputter deposition technology, a key technology for materials research in the next decade, can be found in this paper, where the authors present an overview of the main applications of sputtering in the microelectronics industry.
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