Convective Immersion Cooling of Parallel Vertical Plates

Gas-liquid forced turbulence cooling

Abstract: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.

Thermal management of on-chip hot spots and 3D chip stacks

Abstract: The rapid increase in on-chip heat fluxes and package heat density, accompanying the migration to nanoelectronics and 3D chip stacks, has placed thermal management squarely on the critical path for advanced product development. Innovative, cost-effective cooling techniques, combined in a synergetic way with more conventional approaches, must be developed if the benefits of the Moore's Law progression are to be realized. Following a brief discussion of the industry roadmap for IC packaging and review of chip package thermal management options, attention will turn to the application of solidstate thermoelectric refrigeration and the thermal characteristics of direct immersion cooling in dielectric liquids. The presentation will close with a discussion of the research challenges associated with the commercial implementation of on-chip thermoelectric coolers and direct liquid cooling.

Thermosyphon boiling in vertical channels

Abstract: Etude analytique et experimentale du transfert de chaleur par ebullition dans l'eau sur une paire de plaques plates, a flux thermiques egaux. Resultats experimentaux pour la temperature de la paroi en fonction de la localisation axiale du flux thermique et de l'espacement des plaques. Modele theorique du debit liquide a travers le canal et correlation de la vitesse du transfert de chaleur des parois du canal

Bibliography of Heat Transfer in Electronic Equipment

Abstract: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented. The papers are arranged in twelve categories, and cover the period from 1970-1984, although a majority of the papers listed were published in the last three years.

A general expression for the correlation of rates of transfer and other phenomena

Abstract: The expression Y = (1 + Zn)1/n where Y and Z are expressed in terms of the solutions for asymptotically large and small values of the independent variable is shown to be remarkably successful in correlating rates of transfer for processes which vary uniformly between these limiting cases. The arbitrary exponent n can be evaluated simply from plots of Y versus Z and Y/Z versus 1/Z. The expression is quite insensitive to the choice of n and the closest integral value can be chosen for simplicity. The process of correlation can be repeated for additional variables in series. Illustrative applications are presented only for flow, conduction, forced convection, and free convection, but the expression and procedure are applicable to any phenomenon which varies uniformly between known, limiting solutions.

Heat dissipation of parallel plates by free convection

Abstract: Zusammenfassung Die Warmeabgabe bei freier Konvektion in Luft von vertikalen quadratischen parallelen Platten von h × h cm2 im gegenseitigen Abstand b wird gemessen. Die Warmeabgabe wird berechnet fur den Fall, dass die Platten in horizontaler Richtung unendlich ausgedehnt sind (Gl. 39). Die Ubereinstimmung ist gut, wenn eine Korrektion angebracht wird, welche berucksichtigt dass die Messungen an quadratischen anstatt an unendlich langen Platten ausgefuhrt sind. Wenn die Platten uber einen Winkel γ aus der vertikalen Lage gedreht werden, ist fur nicht zu grosse Werte von γ, g in (39) durch g cos γ zu ersetzen. Bei gegebener Hohe h der Platten und Ubertemperatur θw wird der gegenseitige Abstand bm berechnet, welcher die grosste Warmeabgabe je Langeneinheit liefert (Gl. 53). Wird h variiert und der Plattenabstand jeweils gleich dem zu jeder Hohe gehorenden gunstigsten Wert bm gewahlt, so nimmt bei Vernachlassigung der Plattendicke die Warmeabgabe je Langeneinheit wie h zu.

Thermally optimum spacing of vertical, natural convection cooled, parallel plates

Abstract: While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

Abstract: While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

Thermal Analysis and Control of Electronic Equipment

Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی