Convective Immersion Cooling of Parallel Vertical Plates

doi:10.1109/TCHMT.1985.1136506

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Convective Immersion Cooling of Parallel Vertical Plates

Journal Article•DOI•

Convective Immersion Cooling of Parallel Vertical Plates

A. Bar-Cohen, H. Schweitzer¹•Institutions (1)

Ben-Gurion University of the Negev¹

01 Sep 1985-IEEE Transactions on Components, Hybrids, and Manufacturing Technology (IEEE)-Vol. 8, Iss: 3, pp 343-351

TL;DR: In this paper, the authors provide an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.

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Abstract: Complete immersion of electronic assemblies, in fluids of appropriately high dielectric strength and low dielectric constant, offers a most promising alternative to conventional thermal control measures. The present study is aimed at providing an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.

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Citations

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Journal Article•DOI•

Thermal management of electronic components with dielectric liquids

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Avram Bar-Cohen

15 Feb 1993-Jsme International Journal Series B-fluids and Thermal Engineering

148 citations

Patent•

Gas-liquid forced turbulence cooling

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Seymour R. Cray¹, Gregory J. Sherwood¹•Institutions (1)

Cray¹

08 Mar 1991

TL;DR: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation as mentioned in this paper.

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Abstract: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.

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121 citations

Proceedings Article•DOI•

Thermal management of on-chip hot spots and 3D chip stacks

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Avram Bar-Cohen¹•Institutions (1)

University of Maryland, College Park¹

01 Nov 2009

TL;DR: In this paper, the authors present a discussion of the research challenges associated with the commercial implementation of on-chip thermoelectric coolers and direct liquid cooling in dielectric liquids.

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Abstract: The rapid increase in on-chip heat fluxes and package heat density, accompanying the migration to nanoelectronics and 3D chip stacks, has placed thermal management squarely on the critical path for advanced product development. Innovative, cost-effective cooling techniques, combined in a synergetic way with more conventional approaches, must be developed if the benefits of the Moore's Law progression are to be realized. Following a brief discussion of the industry roadmap for IC packaging and review of chip package thermal management options, attention will turn to the application of solidstate thermoelectric refrigeration and the thermal characteristics of direct immersion cooling in dielectric liquids. The presentation will close with a discussion of the research challenges associated with the commercial implementation of on-chip thermoelectric coolers and direct liquid cooling.

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27 citations

Cites methods from "Convective Immersion Cooling of Par..."

...[8]A. Bar-Cohen, and H. Schweitzer, Convective immersion cooling of parallel vertical plates, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, CHMT-8(3), 343-351, 1985....
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...1) Natural Convection: Following the composite Nusselt number correlation derivations of Bar-Cohen and Rohsenow [7] and including the Prandtl number correction of Bar-Cohen and Schweitzer [8], Geisler [9] derived and validated a composite Nusselt number correlation for symmetrically-heated, vertical microchannels immersed in saturated FC-72 at atmospheric pressure, based on the use of the fully-developed and isolated plate asymptotes, as...
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...1) Natural Convection: Following the composite Nusselt number correlation derivations of Bar-Cohen and Rohsenow [7] and including the Prandtl number correction of Bar-Cohen and Schweitzer [8], Geisler [9] derived and validated a composite Nusselt number correlation for symmetrically-heated, vertical microchannels immersed in saturated FC-72 at atmospheric pressure, based on the use of the fully-developed and isolated plate asymptotes, as (1) where the Elenbass number, El, is defined as, (2) (2) ( ) kL TTgc L p L µ δβρδ 4 ambdie 2 4 4 RaEl − =≡ (2) Following Elenbaas [10], the heat transfer coefficient defined by equation (1) includes the fluid temperature rise in the channel and is, therefore, based on the temperature difference between the channel wall and the fluid at the channel inlet....
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Thermosyphon boiling in vertical channels

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Avram Bar-Cohen¹, H. Schweitzer¹•Institutions (1)

Ben-Gurion University of the Negev¹

01 Jan 1983

TL;DR: In this article, a model analytique et experimentale du transfert de chaleur par ebullition dans l'eau sur une paire de plaques plates, a flux thermiques egaux.

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Abstract: Etude analytique et experimentale du transfert de chaleur par ebullition dans l'eau sur une paire de plaques plates, a flux thermiques egaux. Resultats experimentaux pour la temperature de la paroi en fonction de la localisation axiale du flux thermique et de l'espacement des plaques. Modele theorique du debit liquide a travers le canal et correlation de la vitesse du transfert de chaleur des parois du canal

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25 citations

Journal Article•DOI•

Bibliography of Heat Transfer in Electronic Equipment

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V. Antonetti¹, R. Simons•Institutions (1)

IBM¹

01 Jun 1985-IEEE Transactions on Components, Hybrids, and Manufacturing Technology

TL;DR: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented in this paper, covering the period from 1970-1984, although a majority of the papers listed were published in the last three years.

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Abstract: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented. The papers are arranged in twelve categories, and cover the period from 1970-1984, although a majority of the papers listed were published in the last three years.

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17 citations

References

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Journal Article•DOI•

A general expression for the correlation of rates of transfer and other phenomena

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Stuart W. Churchill¹, R. Usagi¹•Institutions (1)

University of Pennsylvania¹

01 Nov 1972-Aiche Journal

TL;DR: The expression Y = (1 + Zn)1/n where Y and Z are expressed in terms of the solutions for asymptotically large and small values of the independent variable is shown to be remarkably successful in correlating rates of transfer for processes which vary uniformly between these limiting cases as discussed by the authors.

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Abstract: The expression Y = (1 + Zn)1/n where Y and Z are expressed in terms of the solutions for asymptotically large and small values of the independent variable is shown to be remarkably successful in correlating rates of transfer for processes which vary uniformly between these limiting cases. The arbitrary exponent n can be evaluated simply from plots of Y versus Z and Y/Z versus 1/Z. The expression is quite insensitive to the choice of n and the closest integral value can be chosen for simplicity. The process of correlation can be repeated for additional variables in series. Illustrative applications are presented only for flow, conduction, forced convection, and free convection, but the expression and procedure are applicable to any phenomenon which varies uniformly between known, limiting solutions.

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784 citations

"Convective Immersion Cooling of Par..." refers methods in this paper

...Intermediate values of Nu can be obtained from detailed experimental and/or numerical studies or by use of the correlating expression suggested by Churchill and Usagi [ 21 ] for smoothly varying transfer processes....
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...These relations combine available expressions for the fully developed flow and isolated plate limit in a manner proposed in [ 21 ] and use a correlating exponent of two as previously found for air [20]....
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...Following Churchill and Usagi’s [ 21 ] recommended procedure for deveioping composite relations for smoothly varying transfer processes, the Nu of interest can be expressed in the form...
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Journal Article•DOI•

Heat dissipation of parallel plates by free convection

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W. Elenbaas¹•Institutions (1)

Philips¹

01 Jan 1942-Physica D: Nonlinear Phenomena

TL;DR: In this article, the warmeabgabe bei freier Konvektion in Luft von vertikalen quadratischen parallelen Platten of h × h cm2 im gegenseitigen Abstand b wird gemessen.

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535 citations

"Convective Immersion Cooling of Par..." refers background in this paper

...Elenbaas [ 13 ] was the first to document a detailed study of natural convection heat transfer in two-dimensional channels formed by parallel plates....
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Thermally optimum spacing of vertical, natural convection cooled, parallel plates

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Avram Bar-Cohen¹, Warren M. Rohsenow²•Institutions (2)

Ben-Gurion University of the Negev¹, Massachusetts Institute of Technology²

01 Jan 1981

TL;DR: In this article, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.

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Abstract: While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

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481 citations

Journal Article•DOI•

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

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Avram Bar-Cohen¹, Warren M. Rohsenow²•Institutions (2)

Ben-Gurion University of the Negev¹, Massachusetts Institute of Technology²

01 Feb 1984-Journal of Heat Transfer-transactions of The Asme

TL;DR: In this paper, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.

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462 citations

Book•

Thermal Analysis and Control of Electronic Equipment

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Allan D. Kraus, Avram Bar-Cohen

01 Jan 1983

TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ

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Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی

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339 citations