Convective Immersion Cooling of Parallel Vertical Plates

doi:10.1109/TCHMT.1985.1136506

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Convective Immersion Cooling of Parallel Vertical Plates

Journal Article•DOI•

Convective Immersion Cooling of Parallel Vertical Plates

A. Bar-Cohen, H. Schweitzer¹•Institutions (1)

Ben-Gurion University of the Negev¹

01 Sep 1985-IEEE Transactions on Components, Hybrids, and Manufacturing Technology (IEEE)-Vol. 8, Iss: 3, pp 343-351

TL;DR: In this paper, the authors provide an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.

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Abstract: Complete immersion of electronic assemblies, in fluids of appropriately high dielectric strength and low dielectric constant, offers a most promising alternative to conventional thermal control measures. The present study is aimed at providing an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.

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Citations

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Proceedings Article•DOI•

Direct liquid thermal management of 3D chip stacks

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Avram Bar-Cohen¹, Karl J. L. Geisler², E. Rahim¹•Institutions (2)

University of Maryland, College Park¹, General Dynamics Advanced Information Systems²

01 Dec 2009

TL;DR: In this article, passive immersion cooling of 3D chip stacks using deionized water is shown to provide an order of magnitude improvement in heat dissipation relative to the available dielectric fluids.

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Abstract: Chip stacks are a crucial building block in advanced 3D microsystem architectures and can accommodate shorter interconnect distances between devices, reduced power dissipation, and improved electrical performance. Although enhanced conduction can serve to transfer the dissipated heat to the top and sides of the package and/or down to the underlying PCB, effective thermal management of stacked chips remains a most difficult challenge. Immersion cooling techniques, which provide convective and/or ebullient heat transfer, along with buoyant fluid flow, in the narrow gaps separating adjacent chips, are a most promising alternative to conduction cooling of three-dimensional chip stacks. Application of the available theories, correlations, and experimental data are shown to reveal that passive immersion cooling-relying on natural convection and/or pool boiling — could provide the requisite thermal management capability for 3D chip stacks anticipated for use in much of the portable equipment category. Alternatively, pumped flow of dielectric liquids through the microgaps in 3D stacks, providing single phase and/or flow boiling heat absorption, could meet many of the most extreme thermal management requirements for highperformance 3D microsystems. Use of deionized water is shown to provide an order of magnitude improvement in heat dissipation relative to the available dielectric fluids.

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5 citations

Cites methods from "Convective Immersion Cooling of Par..."

...Following the composite Nusselt number correlation derivations of Bar-Cohen and Rohsenow [7] and including the Prandtl number correction of Bar-Cohen and Schweitzer [8], Geisler [9] derived and validated a composite Nusselt number correlation for symmetrically-heated, vertical microchannels immersed in saturated FC-72 at atmospheric pressure, based on the use of the fully-developed and isolated plate asymptotes, as...
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...Following the composite Nusselt number correlation derivations of Bar-Cohen and Rohsenow [7] and including the Prandtl number correction of Bar-Cohen and Schweitzer [8], Geisler [9] derived and validated a composite Nusselt number correlation for symmetrically-heated, vertical microchannels immersed in saturated FC-72 at atmospheric pressure, based on the use of the fully-developed and isolated plate asymptotes, as 21 22 El 705.0 El 24Nu − − ⎥ ⎥ ⎦ ⎤ ⎢ ⎢ ⎣ ⎡ +⎟ ⎠ ⎞ ⎜ ⎝ ⎛=≡ k hδ δ (1) where the Elenbass number, El, is defined as, ( ) kL TTgc L p L μ δβρδ 4ambdie 2 4 4 RaEl − =≡ (2) Following Elenbaas [10], the heat transfer coefficient defined by equation (1) includes the fluid temperature rise in the channel and is, therefore, based on the temperature difference between the channel wall and the fluid at the channel inlet....
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Proceedings Article•DOI•

Passive Immersion Cooling of 3-D Stacked Dies

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Karl J. L. Geisler¹, Avram Bar-Cohen²•Institutions (2)

University of Minnesota¹, University of Maryland, College Park²

01 Jan 2007

TL;DR: In this article, a methodology for the optimization of immersion cooled 3-D stacked dies is presented, including the effects of confinement on natural convection and channel boiling, and the optimal die spacings for both single and two phase cooling with saturated FC-72 are found.

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Abstract: Three-dimensional die stacking increases integrated circuit (IC) density, providing increased capabilities and improved electrical performance on a smaller printed circuit board (PCB) footprint area. However, these advantages come at the expense of higher volumetric heat generation rates and decreased thermal and mechanical access to the die areas. Passive immersion cooling, allowing for buoyancy-driven fluid flow between stacked dies, can provide high heat transfer coefficients directly on the die surfaces, can easily accommodate a wide variety of interconnect schemes, and is scalable to any number of dies. A methodology for the optimization of immersion cooled 3-D stacked dies is presented, including the effects of confinement on natural convection and channel boiling. Optimum die spacings for both single and two phase cooling with saturated FC-72 are found to be on the order of 0.5mm for typical microelectronics geometries and to yield heat densities of 10–50 W/cm3 in natural convection and 100–500 W/cm3 in channel boiling.Copyright © 2007 by ASME

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2 citations

Cites background or methods from "Convective Immersion Cooling of Par..."

...Bar-Cohen and Schweitzer [21] reinterpreted McAdams’ results to provide the following Prandtl number correction to accommodate other fluids:...
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...Likewise, Bar-Cohen and Schweitzer [21] employed values of 0.60 and 0.69 for water when and , respectively....
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...Likewise, Bar-Cohen and Schweitzer [21] employed values of 0....
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...Bar-Cohen and Schweitzer [21] reinterpreted McAdams’ results to provide the following Prandtl number correction to accommodate other fluids: (6) Note that for saturated FC-72 at atmospheric pressure, yielding ....
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Book Chapter•DOI•

Thermal Performance Mapping of Direct Liquid Cooled 3d Chip Stacks

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Karl J. L. Geisler, Avram Bar-Cohen

01 Jan 2015

1 citations

Dissertation•

Study of natural convection heat transfer from vertical triangular fin arrays

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S.M. Akhlaque-E-Rasul

01 Jun 1997

TL;DR: In this article, an experimental investigation of natural convection heat transfer from vertical triangular fin arrays, namely an array of four fin, seven fin, and thirteen fin arrays were carried out.

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Abstract: Experimental investigations of natural convection heat transfer from vertical triangular fin arrays, namely an array of four fins, an array of seven fins and an array of thirteen fins were carried out. All the fin arrays were prepared by sand casting. The fin dimensions in the arrays were: Length = 0.215m, Base thickness = 0.0 Im and Height = 0.04m. The experimental regime parameters of this investigation wcre: 0.15 w/m2 < Heat Flux < 180 w/m2; 0.1°C

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References

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Journal Article•DOI•

A general expression for the correlation of rates of transfer and other phenomena

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Stuart W. Churchill¹, R. Usagi¹•Institutions (1)

University of Pennsylvania¹

01 Nov 1972-Aiche Journal

TL;DR: The expression Y = (1 + Zn)1/n where Y and Z are expressed in terms of the solutions for asymptotically large and small values of the independent variable is shown to be remarkably successful in correlating rates of transfer for processes which vary uniformly between these limiting cases as discussed by the authors.

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Abstract: The expression Y = (1 + Zn)1/n where Y and Z are expressed in terms of the solutions for asymptotically large and small values of the independent variable is shown to be remarkably successful in correlating rates of transfer for processes which vary uniformly between these limiting cases. The arbitrary exponent n can be evaluated simply from plots of Y versus Z and Y/Z versus 1/Z. The expression is quite insensitive to the choice of n and the closest integral value can be chosen for simplicity. The process of correlation can be repeated for additional variables in series. Illustrative applications are presented only for flow, conduction, forced convection, and free convection, but the expression and procedure are applicable to any phenomenon which varies uniformly between known, limiting solutions.

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784 citations

"Convective Immersion Cooling of Par..." refers methods in this paper

...Intermediate values of Nu can be obtained from detailed experimental and/or numerical studies or by use of the correlating expression suggested by Churchill and Usagi [ 21 ] for smoothly varying transfer processes....
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...These relations combine available expressions for the fully developed flow and isolated plate limit in a manner proposed in [ 21 ] and use a correlating exponent of two as previously found for air [20]....
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...Following Churchill and Usagi’s [ 21 ] recommended procedure for deveioping composite relations for smoothly varying transfer processes, the Nu of interest can be expressed in the form...
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Journal Article•DOI•

Heat dissipation of parallel plates by free convection

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W. Elenbaas¹•Institutions (1)

Philips¹

01 Jan 1942-Physica D: Nonlinear Phenomena

TL;DR: In this article, the warmeabgabe bei freier Konvektion in Luft von vertikalen quadratischen parallelen Platten of h × h cm2 im gegenseitigen Abstand b wird gemessen.

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535 citations

"Convective Immersion Cooling of Par..." refers background in this paper

...Elenbaas [ 13 ] was the first to document a detailed study of natural convection heat transfer in two-dimensional channels formed by parallel plates....
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Thermally optimum spacing of vertical, natural convection cooled, parallel plates

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Avram Bar-Cohen¹, Warren M. Rohsenow²•Institutions (2)

Ben-Gurion University of the Negev¹, Massachusetts Institute of Technology²

01 Jan 1981

TL;DR: In this article, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.

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Abstract: While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

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481 citations

Journal Article•DOI•

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

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Avram Bar-Cohen¹, Warren M. Rohsenow²•Institutions (2)

Ben-Gurion University of the Negev¹, Massachusetts Institute of Technology²

01 Feb 1984-Journal of Heat Transfer-transactions of The Asme

TL;DR: In this paper, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.

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462 citations

Book•

Thermal Analysis and Control of Electronic Equipment

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Allan D. Kraus, Avram Bar-Cohen

01 Jan 1983

TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ

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Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی

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339 citations