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Journal ArticleDOI

Cooling of mobile electronic devices using phase change materials

01 Feb 2004-Applied Thermal Engineering (Pergamon)-Vol. 24, Iss: 2, pp 159-169
TL;DR: In this paper, an experimental study was conducted on the cooling of mobile electronic devices, such as personal digital assistants (PDAs) and wearable computers, using a heat storage unit (HSU) filled with the phase change material (PCM) of n-eicosane inside the device.
About: This article is published in Applied Thermal Engineering.The article was published on 2004-02-01. It has received 313 citations till now. The article focuses on the topics: Phase-change material & Electronics cooling.
Citations
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Journal ArticleDOI
TL;DR: In this article, the state of the art of phase change materials for thermal energy storage applications is reviewed and an insight into recent efforts to develop new phase change material with enhanced performance and safety.

1,399 citations

Journal ArticleDOI
TL;DR: The use of a latent heat storage system using Phase Change Materials (PCM) is an effective way of storing thermal energy (solar energy, off-peak electricity, industrial waste heat) and has the advantages of high storage density and the isothermal nature of the storage process as discussed by the authors.
Abstract: The use of a latent heat storage system using Phase Change Materials (PCM) is an effective way of storing thermal energy (solar energy, off-peak electricity, industrial waste heat) and has the advantages of high storage density and the isothermal nature of the storage process. It has been demonstrated that, for the development of a latent heat storage system, choice of the PCM plays an important role in addition to heat transfer mechanism. The information on the latent heat storage materials and systems is enormous and published widely in the literatures. In this paper, we make an effort to gather the information from the previous works on PCMs and latent heat storage systems. This review will help to find a suitable PCM for various purposes a suitable heat exchanger with ways to enhance the heat transfer, and it will also help to provide a variety of designs to store the heat using PCMs for different applications, i.e. space heating & cooling, solar cooking, greenhouses, solar water heating and waste heat recovery systems. Measurement techniques of thermophysical properties, studies on thermal cycles for long term stability, corrosion of the PCMs and enhancement of heat transfer in PCM are discussed. New PCM innovations are also included for the awareness of new applications. This paper contains a list of about 250 PCMs and more than 250 references.

638 citations


Cites background from "Cooling of mobile electronic device..."

  • ...Tan et al. (2004) conducted an experimental study on the cooling of mobile electronic devices, such as personal digital assistants (PDAs) and wearable computers, using a heat storage unit (HSU) filled with the phase change material (PCM) of n-eicosane inside the device....

    [...]

Journal ArticleDOI
TL;DR: In this paper, a review of organic phase change materials (PCMs) is presented, focusing on three aspects: the materials, encapsulation and applications of organic PCMs, and providing an insight on the recent developments in applications of these materials.

579 citations

Journal ArticleDOI
TL;DR: In this article, a detailed review is reported for thermal stability of different groups of phase change materials (PCMs) used in the latent heat energy storage system, including organic (paraffins and non-paraffin), inorganic (salt hydrates and metallics) and eutectics (organic eutectorics and inorganic eUTectics).
Abstract: Successful utilization of the latent heat energy storage system depends considerably on the thermal reliability and stability of the phase change materials (PCMs) used. Thermal stability of phase change material can be established by measuring the thermo-physical properties of the PCM after a number of repeated thermal cycles. A comprehensive knowledge of thermal stability of the PCMs as functions of number of repeated thermal cycles is essential to ensure the long-term performance and economic feasibility of the latent heat storage systems. In this paper, a detailed review is reported for thermal stability of different groups of PCMs. The PCMs are categorized as organic (paraffins and non-paraffins), inorganic (salt hydrates and metallics) and eutectics (organic eutectics and inorganic eutectics). Further, a broad database of different PCMs is developed for which thermal cycling tests were carried out by different researchers and reported in the literature. Some conclusions are derived after critical evaluation of thermal stability of different groups of PCMs. This review will assist to identify the most reliable PCM to be used for a particular application of latent heat energy storage system.

550 citations

Journal ArticleDOI
TL;DR: In this article, a detailed review of effect of phase change material (PCM) encapsulation on the performance of a thermal energy storage system (TESS) is presented, where the key encapsulation parameters, namely, encapsulation size, shell thickness, shell material and encapsulation geometry have been investigated thoroughly.
Abstract: This paper presents a detailed review of effect of phase change material (PCM) encapsulation on the performance of a thermal energy storage system (TESS). The key encapsulation parameters, namely, encapsulation size, shell thickness, shell material and encapsulation geometry have been investigated thoroughly. It was observed that the core-to-coating ratio plays an important role in deciding the thermal and structural stability of the encapsulated PCM. An increased core-to-coating ratio results in a weak encapsulation, whereas, the amount of PCM and hence the heat storage capacity decreases with a decreased core-to-coating ratio. Thermal conductivity of shell material found to have a significant influence on the heat exchange between the PCM and heat transfer fluid (HTF). This paper also reviews the solidification and melting characteristics of the PCM and the effect of various encapsulation parameters on the phase change behavior. It was observed that a higher thermal conductivity of shell material, a lower shell size and high temperature of HTF results in rapid melting of the encapsulated PCM. Conduction and natural convection found to be dominant during solidification and melt processes, respectively. A significant enhancement in heat transfer was observed with microencapsulated phase change slurry (MPCS) due to direct surface contact between the encapsulated PCM and the HTF. It was reported that the pressure drop and viscosity increases substantially with increase in volumetric concentration of the microcapsules.

484 citations

References
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Book
01 Jan 2001
TL;DR: This chapter discussesfundamentals of Microsystems Design for the Environment, as well as the role of Packaging in Microelectronics, and how to design for Reliability.
Abstract: Chapter 1: Introduction to Microsystems Packaging. Chapter 2: The Role of Packaging in Microelectronics Chapter 3: The Role of Packaging in Microsystems. Chapter 4: Fundamentals of Electrical Package Design. Chapter 5: Fundamentals of Design for Reliability. Chapter 6: Fundamentals of Thermal Management. Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.

734 citations

Journal ArticleDOI
04 May 1994
TL;DR: The evolution of the interdisciplinary design of the Navigator wearable computer is presented, with particular emphasis placed upon the role of the thermal design group in the overall design process and the particular challenges associated with the concurrent thermal management of wearable computer systems.
Abstract: This paper describes the concurrent design of a wearable computer, called the Navigator, developed and built at Carnegie Mellon University in a multidesigner, multidomain environment. The design effort for the Navigator involved nineteen designers, representing the disciplines of electrical engineering, industrial design, mechanical engineering, software engineering, and human-computer interaction. The concurrent design framework developed by the Navigator design team is outlined and the parallel activities within each design phase are described, including the synchronization and interactions among all design disciplines at the phase boundaries. The evolution of the interdisciplinary design of the Navigator wearable computer is presented, with particular emphasis placed upon the role of the thermal design group in the overall design process. Furthermore, the particular challenges associated with the concurrent thermal management of wearable computer systems are outlined. >

23 citations

Journal ArticleDOI
TL;DR: A heat dissipation model of a forearm‐mounted wearable computer is developed, and the model is verified experimentally and provided tools and novel suggestions for heat Dissipation that may influence the design of a wearable computer.
Abstract: Wearable computers and PDA's are physically close to, or are in contact with, the user during most of the day. This proximity would seemingly limit the amount of heat such a device may generate, conflicting with user demands for increasing processor speeds and wireless capabilities. However, this paper explores significantly increasing the heat dissipation capability per unit surface area of a mobile computer by thermally coupling it to the user. In particular, a heat dissipation model of a forearm-mounted wearable computer is developed, and the model is verified experimentally. In the process, this paper also provides tools and novel suggestions for heat dissipation that may influence the design of a wearable computer.

16 citations

Book ChapterDOI
01 Jan 1997
TL;DR: In this paper, a transient three-dimensional computational study is performed for passive thermal control of plastic quad flat packages (PQFP) using organic phase change material (PCM) placed in a heat sink under the printed wiring board (PWB).
Abstract: A transient three-dimensional computational study is performed for passive thermal control of plastic quad flat packages (PQFP) using organic phase change material (PCM) placed in a heat sink under the printed wiring board (PWB). Governing conservation equations for mass, momentum and energy are solved using a finite volume technique. The effects of phase change are handled by a single-domain enthalpy method. It is found that the use of organic PCMs can stabilize the package temperature for transient periods, without substantial weight penalty. The effect of horizontal and vertical package orientations on the thermal response is studied. It is found that the vertical orientation results in convection dominated melting of the PCM, and a slightly improved thermal performance. For the horizontal orientation, melting is conduction dominated. It is found that incorporation of fins in the PCM results in a slight improvement in thermal performance. Results are presented as time-wise variations of maximum package and substrate temperatures, heat transfer histories, velocity vectors, isotherms and melt shapes.

1 citations