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Cooling techniques for electronic equipment
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TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.Abstract:
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.read more
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Journal ArticleDOI
Analytical solutions for hydromagnetic natural convection flow of a particulate suspension through isoflux–isothermal channels in the presence of a heat source or sink
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Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging
TL;DR: Transactions of the ASME, Journal of Electronic Packaging (ISSN 1043-7398) is published quarterly (March, June, Sept., Dec.) by The American Society of Mechanical Engineers, Three Park Avenue, New York, NY 10016.
Proceedings ArticleDOI
Modified highly accelerated life test for aerospace electronics
TL;DR: In this paper, the authors proposed a modified HALT test using the same traditional chamber used by most aerospace electronics manufacturers and performs at a level of 80% or more of the traditional HALT.
Journal ArticleDOI
Mixed Convection in Power-Law Fluids from a Heated Semicircular Cylinder: Effect of Aiding Buoyancy
Anurag Kumar Tiwari,R.P. Chhabra +1 more
TL;DR: In this paper, the Laminar aiding-buoyancy mixed-convection heat transfer in power-law fluids from a heated semicircular cylinder with its flat base facing the oncoming flow was studied.
Journal ArticleDOI
A model for the convective cooling of electronic components with application to optimal placement
TL;DR: The model is used, in conjunction with the annealing algorithm, to find the optimal placement of electronic devices on a board in such a way as to decrease the maximum temperature of the system.