scispace - formally typeset
Open AccessBook

Cooling techniques for electronic equipment

Dave S. Steinberg
Reads0
Chats0
TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: 
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.

read more

Citations
More filters
Journal ArticleDOI

Genetic Algorithm-Based Optimal Design of Plate Fins Following Minimum Entropy Generation Considerations

R.K. Jha, +1 more
TL;DR: The optimization is achieved by minimizing the entropy generation rate using genetic algorithm-based evolutionary computing techniques and the optimal dimensions of arrays of plate fins cooled by forced convection are estimated.
Proceedings ArticleDOI

Thermal modeling of the module integrated DC-DC converter for thin-film PV modules

Milos Acanski, +2 more
TL;DR: In this paper, the thermal behavior of a DC-DC converter integrated on the back side of a thin-film photovoltaic (PV) module is investigated and analytical thermal models of the converter and the PV module are made.
Journal Article

Optimizing the integration of an electronics system into an existing enclosure using CFD modeling techniques

D. Lober
- 01 Jan 1999 - 
TL;DR: In this paper, a thermal model of the computer system was created using Computational Fluid Dynamics (CFD) thermal analysis software, which was used to optimize the enclosure's cooling capacity.
Proceedings ArticleDOI

Modeling and analysis of a robust thermal control system based on forced convection thermal switches

Andrew D. Williams, +1 more
TL;DR: In this article, a robust thermal control system utilizing forced convection thermal switches was investigated in two separate stages, the first focusing on the overall design of the bus and the second stage focused on the overarching bus architecture and the design impacts of employing a thermal switch based TCS design.
Proceedings ArticleDOI

Research progress on Physics-of-Failure based fatigue stress-damage model of solder joints in electronic packing

Jiang Shao, +2 more
TL;DR: The recent developments in POF based stress-damage model on thermal fatigue and vibration fatigue of solder joints were summarized and some suggestions for future investigations were made.