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Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
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TL;DR: In this paper, the role of thermal buoyancy on boundary layer separation over a two-dimensional triangular surface was investigated and the critical heating parameters for which the separated boundary layer on the triangular object can be suppressed and the influence of the object orientation on the thermally induced suppression phenomena.
7 citations
23 May 2000
TL;DR: In this article, the design of semiconductor packages having integrated air cooled heatsinks for use in high power electronic systems is discussed, and simple models of the heat transfer from the heatsink fins, which are based on empirical correlations, may be used in combination with either simple analytical models or two dimensional finite difference (FD) models of heat conduction from the semiconductor die through the multilayer package structure to the base of the fins.
Abstract: This paper will discuss the design of semiconductor packages having integrated air cooled heatsinks for use in high power electronic systems. It will demonstrate how simple models of the heat transfer from the heatsink fins, which are based on empirical correlations, may be utilised in combination with either simple analytical models or two dimensional finite difference (FD) models of the heat conduction from the semiconductor die through the multilayer package structure to the base of the fins. These models allow the rapid evaluation of performance under both steady state and transient overload conditions, and can be used to rapidly explore a wide range of design options before selecting candidate layouts for more detailed evaluation using, for example, 3D FD analysis. Wind tunnel experiments, which will also be reported, have been carried out to verify the modelling results for different semiconductor device layouts. These trials demonstrate excellent agreement between the models and experimental results.
7 citations
TL;DR: In this article, a three-dimensional (3D) heat flow structure for power electronics gate drive circuit thermal management is described, which is intended for seamless integration based on power electronics packaging space constraints, while maintaining required electrical isolation.
Abstract:
Design optimization of a three-dimensional (3D) heat flow structure for power electronics gate drive circuit thermal management is described. Optimization methods are described in the creation of several structural concepts targeted toward simultaneous temperature reduction of multiple gate drive integrated circuit (IC) devices. Each heat flow path concept is intended for seamless integration based on power electronics packaging space constraints, while maintaining required electrical isolation. The design synthesis and fabrication of a select concept prototype is presented along with the development of an experimental test bench for thermal performance characterization. Experimental results indicate a significant 45 ∘C maximum temperature reduction for the gate drive IC devices in a laboratory environment, which translates to an estimated 41 °C maximum temperature reduction under high temperature (∼100 °C) ambient conditions. The technical approach and design strategy are applicable to future wide band-gap (WBG) electronics packaging applications, where enhanced 3D thermal routing is expected to be critical to maximizing volumetric power density.
7 citations
TL;DR: In this paper, a pinnate leaf-like network embedded in the matrix (i.e., electronic device) is used to cool the matrix by conduction and developed a method to construct the optimal network.
7 citations
12 Aug 2019
TL;DR: Wavy microchannels have been shown to possess improved heat transfer capabilities because of greater fluid mixing and boundary layer thinning as discussed by the authors, and fluid flow and heat transfer characteri ci...
Abstract: Wavy microchannels have been shown to possess improved heat transfer capabilities because of greater fluid mixing and boundary layer thinning. In this study, fluid flow and heat transfer characteri...
6 citations
Cites methods from "Cooling techniques for electronic e..."
...To overcome this difficulty, several other cooling technologies were suggested.(3,4) Among those, liquid cooling technology(5,6) Proc IMechE Part E:...
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