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Cooling techniques for electronic equipment

07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
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Journal ArticleDOI
01 Aug 1999
TL;DR: In this article, an independent study has been carried out to assess the extent to which the physics-of-failure (PoF) technique can help in reliability enhancement and assessment of electronic assemblies.
Abstract: An independent study has been carried out to assess the extent to which the physics-of-failure (PoF) technique can help in reliability enhancement and assessment of electronic assemblies. In particular, a specific case study has been conducted on a real, digital electronic board assembly with known failure modes. Results from the study include the simulation of substrate and component temperatures based on the knowledge of component power dissipation, board assembly materials and cooling methods of the board assembly. The fundamental frequencies and dynamic displacements of the board were computed from the vibration models. The thermal and vibration results were then used to model the damage accumulation at solder joints of the components to accurately predict failure trends and failure sites. These results are compared with field failure data and results from other computer aided engineering (CAE) tools.

3 citations

Journal ArticleDOI
TL;DR: In this article, the thermal and fluid flow characteristics of a micro-channeled water-block with pass variations in 8 samples were studied and the results of a numerical analysis using ANSYS CFX-11 were compared with the result of experiments.
Abstract: Thermal and fluid flow characteristics of a micro-channeled water-block with pass variations in 8 samples were studied. The results of a numerical analysis using ANSYS CFX-11 were compared with the results of experiments. The numerical analysis and experiments were conducted under an input power of 150 W, inlet temperature of 35°C and mass flow rates of 0.7 ∼ 2.0 kg/min. The numerical results showed reasonably good agreement, within 3–5%, with the experimental results. Also, the numerical results showed that 2-pass samples give better performance than 1-pass samples in terms of heat transfer. However, the pressure drop for 2-pass samples was relatively higher.

3 citations


Cites background from "Cooling techniques for electronic e..."

  • ...It is noted, however, that the effects of the passes and the paths on heat transfer in a water-block have not been investigated extensively [11]....

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Proceedings ArticleDOI
A. Estrada1
26 Sep 2005
TL;DR: In this article, the authors discuss the effect of card placement, card placement and card placement on the cooling of a given card in a large-scale test system, such as VXI, VME, or compact PCI.
Abstract: As in any test system, cooling of the electronics is a major concern. In larger rack systems individual components are often separate 19" units (e.g., a signal generator, oscilloscopes, spectrum analyzers, etc.). These modules tend to have low-density electronics with separate cooling systems. Vendors usually do a good job of ensuring that their boxes do not overheat. Density increases at a high rate as test stations are required to do more in smaller spaces (this trend is the same for almost all electronics). However, when the density increases (such as with VXI, VME, or compact PCI), the manufacturer cannot always control the cooling of their card. Heating from other cards, card placement, airflow in the cabinet, use of adapters, etc., all affect the cooling for a given card. The vendor, however, can only supply guidelines to the end user. It is up to the user to understand the cooling needs of the system as a whole. Proper cooling is extremely important and is not just a function of airflow to a given card. In fact, for dense electronics (conductive or convective), air cooling may not even be the primary mechanism for heat removal

3 citations

Proceedings ArticleDOI
15 Feb 1998
TL;DR: In this paper, a new packaging scheme was proposed to improve the thermal capability of sealed power electronic apparatus and systems subjected to high ambient temperatures and corrosive environments, where the power circuit components are mounted to a heat sink that transfers the heat generated by these components to the outside atmosphere.
Abstract: This paper presents a new packaging scheme that improves the thermal capability of sealed power electronic apparatus and systems subjected to high ambient temperatures and corrosive environments. The proposed packaging scheme consists of two enclosed compartments that are sealed off from the outside ambient atmosphere and from each other. Heat generating power circuit components, such as switching devices, transformers and inductors, are housed within one of the compartments, and lower power dissipation control circuitry, such as control ICs, are housed within the other compartment. The power circuit components are mounted to a heat sink that transfers the heat generated by these components to the outside atmosphere. An open compartment is formed between the two sealed compartments where sealed electronic components, such as electrolytic capacitors, can be mounted, thus enhancing their thermal performance.

2 citations