Open AccessBook
Cooling techniques for electronic equipment
Reads0
Chats0
TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.Abstract:
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.read more
Citations
More filters
Proceedings ArticleDOI
A new packaging scheme for high current sealed power supplies
TL;DR: In this paper, a new packaging scheme was proposed to improve the thermal capability of sealed power electronic apparatus and systems subjected to high ambient temperatures and corrosive environments, where the power circuit components are mounted to a heat sink that transfers the heat generated by these components to the outside atmosphere.
Journal ArticleDOI
Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates
Journal ArticleDOI
The cooling of electrical and electronic equipment in sealed enclosures
TL;DR: The one aim of cooling electrical and electronic equipment is to maintain the temperature of sensitive elements below the maximum specified service temperature, which places particular constraints on the cooling techniques used as discussed by the authors.
Packaging Electronic Systems
TL;DR: Staszak et al. as mentioned in this paper proposed a hybrid assembly process based on thin-filtering and surface-mounting technology for printed wiring boards, which can be used for hybrid applications.
Proceedings ArticleDOI
Package with high thermal conductivity of graphite attached onto die surface to solve hot spot issue
TL;DR: Wang et al. as mentioned in this paper proposed a new method that to attach a thin heat spreader onto die surface during assembly process, which can reduce hot spot issue and balance die surface temperature directly.