Book•
Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
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Dissertation•
01 Jan 2012
TL;DR: In this article, the authors examined possible concepts in order to find the optimal solution fulfilling the criteria above, i.e., find a mechanically robust solution for an enclosure with good cooling capability and good noise reduction.
Abstract: Modern drilling equipment is normally driven by a dedicated hydraulic power unit, sometimes mounted on the machine and sometimes a stand alone unit. The power unit is the most important noise source when drilling using rotary methods. The power unit is normally equipped with an encapsulation in order to protect the components within the unit from surrounding environment and to protect operator and close-by workers from hazards like rotating components and noise. Such an enclosure has to be mechanically robust with high noise insulation and sufficient cooling capacity. The purpose of this study was to examine possible concepts in order to find the optimal solution fulfilling the criteria above, i.e. find a mechanically robust solution for an enclosure with good cooling capability and good noise reduction. The study consists of three parts. The first part has a general description of the noise insulation capability of the power unit. This part explains measurements that were done on complete power pack and on its components. In the second part building of computer models of separate enclosure components using Finite Element Analysis (FEA) and Statistical Energy Analysis (SEA) technique is explained. Also, the validation of the modeling results was done using the results from measurements. The concept presented in the second part of the study also takes effect of airflow into account. Third part: refined modeling on critical parts like air inand outlets using acoustical FEA was done. Based on the FEA modeling, an improved prototype baffled panel was built. The computer models developed were then validated using results from measurements. Sound reduction properties of the improved enclosure were estimated. Results described in this thesis show that acoustical computer model of the power
2 citations
Cites background or methods from "Cooling techniques for electronic e..."
...Usually, a loss of one velocity head is the result of expansion [Ste 91]....
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...The losses were judged to be equal to one velocity head [Ste 91]....
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...This model and described procedures were based on the example described in [Ste 91]....
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...Since the cool air exhausts from the enclosure, it will expand suddenly, so it will lose its velocity completely [Ste 91]....
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01 Jan 1994
TL;DR: In this paper, an experimental investigation of laminar fluid flow and heat transfer in a two-dimensional electronic system model, a channel with grooves, is presented, where the plane wall of the channel was maintained at ambient temperature whereas the grooved wall was heated and maintained at a uniform temperature.
Abstract: An experimental investigation of laminar fluid flow and heat transfer in a two-dimensional electronic system model, a channel with grooves, is presented. The plane wall of the channel was maintained at ambient temperature whereas the grooved wall was heated and maintained at a uniform temperature. Results were obtained for Reynolds numbers in the range from 620 to 1937. One possibility to improve the heat transfer in this physical situation is to induce fluiddynamic instabilities in the channel flow. The influence of fluiddynamic instabilities on the temperature fields and the heat transfer in communicating channels was investigated. The unsteady temperature fields were analysed and heat transfer and pressure drop data presented for a wide range of Reynolds numbers. The measurements were performed using the technique of holographic interferometry. In the paper, the potential of visualization techniques which allow heat transfer measurements in complex two and three dimensional situations, such as electronic cooling applications, are discussed.
2 citations
Dissertation•
01 Jan 2007
2 citations
TL;DR: In this paper, the authors investigated the flow reversal in the side branch of a T-channel for the flow of power-law fluids under the conditions of equal exit pressure (EEP) and specified flow split (SFS).
2 citations
TL;DR: In this article, the structural and thermal analysis including a thermo-elastic analysis for verifying structural safety on the soldered part of chips have been performed, and the safety margin of the chips on the PCB obtained from the conventional analytical method has been compared to the results from the FEM analysis.
Abstract: On-board IR calibration device has been developed for calibration of spaceborne image sensor. It is composed of a blackbody to provide two different radiance temperatures, tilt mirror with a function of stow and deploy to view the blackbody during the calibration and on-board calibration control unit to control the function of the blackbody and tilt mirror. In this paper, to guarantee the structural safety of the unit, the structural and thermal analysis including a thermo-elastic analysis for verifying structural safety on the soldered part of chips have been performed. In addition, safety margin of the chips on the PCB obtained from the conventional analytical method has been compared to the results from the FEM analysis. 초 록 우주용 영상센서의 비균일 출력특성 교정을 통한 영상품질향상을 목적으로 하는 탑재교정장치는 균일한 온도정보 제공을 위한 흑체, 교정임무 수행 중 흑체 지향을 위해 전개 및 수납 기능을 갖는 교정용 구동미러 그리고 상기 구성품의 제어를 담당하는 탑재교정장치 제어용 전장유닛으로 구성된다. 탑재교정장치 제어용 전장품의 발사 및 궤도환경에서의 구조건전성 확보를 위해 소자 납땜부에 대한 열탄성 해석과 피로파괴 이론에 기초한 구조·열해석을 실시하였으며, 이를 통하여 전장품의 구조 건전성을 평가하였다. 본 논문에서는 전자기판에 장착된 소자별 안전성 검토를 위해 일반적으로 적용되는 해석적 방법과 FEM으로부터 도출된 결과를 비교 및 검토하여 피로파괴 이론에 기초한 구조 건전성 예측이 유용함을 입증하였다. KeyWords:On-Board Calibration Device(탑재교정장치), PCB(전자기판), Fatigue Failure Theory(피로파괴 이론), Finite Element Method(유한요소법)
2 citations