Book•
Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
Citations
More filters
11 Aug 1994-Nuclear Instruments & Methods in Physics Research Section A-accelerators Spectrometers Detectors and Associated Equipment
TL;DR: The Center for Advanced Microstructures and Devices (CAMD) was established by Louisiana State University to pioneer development of microfabrication while supporting research in basic science.
Abstract: Many recently constructed storage rings are catering to the needs of industrial applications in addition to providing the traditional services required for synchrotron radiation research. The Center for Advanced Microstructures and Devices (CAMD) was established by Louisiana State University to pioneer development of microfabrication while supporting research in basic science. Maxwell Laboratories designed, built, and successfully commissioned the 1.2 GeV, 400 mA light source for CAMD. Maxwell Laboratories has completed one X-ray lithography beamline at CAMD, and two more are now being manufactured. The completed beamline system, designed for thin resists, delivers photons up to 2 keV. The two beamlines currently under construction deliver photons up to 6 keV for thick (> 50 μm) resists, which play a role in the fabrication of 3-D nanostructures. One of the thick-resist beamlines includes an aspheric mirror that collimates the synchrotron-radiation beam in the horizontal plane while focusing it in the vertical direction - creating a sharp, uniform line image at the workpiece. The other thick-resist beamline has conventional planar optics. Beam position monitors (BPMs) developed for the CAMD beamlines provide a precise vertical profile of the beam by measuring differential photocurrents generated in the BPM probes. Beam power measurements are accomplished with a fixed-aperture calorimeter. Since each calorimeter is precisely calibrated before shipment, its thermal response in the beam is an accurate means to determine beam power for setting lithography exposure times or for computing beamline energy balance.
1 citations
01 Jan 2013
TL;DR: In this article, the authors focus on single phase liquid cooling as a starting point for obtaining the significant heat transfer benefits of liquid cooling, and demonstrate a sample spreadsheet is introduced and compared to computational fluid dynamics analyses, as well as empirical results.
Abstract: High power/performance electronic modules are challenging the ability of air cooling to successfully remove the generated heat. Single phase liquid cooling is a proven approach for effective cooling of large amounts of heat, and has been deployed on defense platforms. Determining the thermal performance of liquid cooled cold plates can be done with basic spreadsheet calculations. These calculations can be sufficiently accurate for first order thermal analyses of design options, which enables rapid trade-off studies. To demonstrate this, a sample spreadsheet is introduced and compared to computational fluid dynamics (CFD) analyses, as well as empirical results. INTRODUCTION Liquid cooling of military electronics is an established approach for transferring relatively large amounts of heat in relatively small spaces, by virtue of the properties of the various preferred liquids compared to air. There are many different implementations of liquid cooling encompassing single phase cooling at the module and enclosure levels, and phase change (liquid to vapor) cooling at the module and enclosure levels. This paper will focus on single phase cooling as a starting point for obtaining the significant heat transfer benefits of liquid cooling. Single phase liquid cooling has been implemented at both the module level and the enclosure level (and beyond, for example in base plates). At the module level, the typical implementation is known as liquid flow through or LFT, and this approach has been shown to be very effective at cooling several hundreds of Watts. For example, Curtiss-Wright and Parker-Hannifin demonstrated the ability to cool 650W total on a 0.85” pitch, 6U module, including four 150W sources representing very high power processors [1] (see Fig. 1). Today’s rugged COTS modules are not at those power/heat levels yet, but the trend continues to move in that direction. Figure 1: Liquid Flow Through (LFT) module. Current high power/performance COTS modules are in the range of 100-200W, and standard cooling approaches employing air in either the enclosure or at the module level are at or beyond their limits. Some systems are already using liquid in enclosure sidewalls to cool rugged COTS conduction modules. Such approaches are being enhanced to cool next generation conduction modules beyond 200W. This paper will show how these high performance modules can be cooled with single phase liquid cooling by employing straightforward spreadsheet calculators. The spreadsheet calculator has been validated against CFD (computational fluid dynamics) tools as well as test data, and shows the ease with which single phase liquid cooling can be analyzed. This contrasts with phase change liquid cooling, which is notoriously difficult when it comes to predicting cooling. Proceedings of the 2013 Ground Vehicle Systems Engineering and Technology Symposium (GVSETS) Liquid Cooling for Next Generation Rugged COTS Modules Page 2 of 6 LIQUID COOLED COLD PLATE DESIGN The liquid cooled cold plate shown in Figure 1 consists of a combination of liquid connectors, liquid manifolds, flexible microchannel coolers (for high power areas), and low power cooling areas. This highly engineered design is suitable for very high power electronic modules (e.g. 400600W+), but engenders significant weight and cost penalties, which can be avoided for lower power modules (e.g. 200400W). A much simpler design, which can serve as a starting point for a low SWaP-C (size, weight, power and cost) liquid cooled cold plate, is depicted in Figure 2. This design will serve as the basis for heat transfer and pressure drop calculations that will determine its cooling effectiveness.
1 citations
Cites background or methods from "Cooling techniques for electronic e..."
...Equation 3 is used for this purpose [2]....
[...]
...The following equation is used to perform the calculation [2]:...
[...]
1 citations
01 Sep 2012
TL;DR: Martinezhev et al. as discussed by the authors analyzed the conjugate convectiveradiative heat transfer in an enclosure with a local energy source and showed that the convection-surface radiation coupling in a rectilinear cavity improves the performance of convection.
Abstract: [1] Incropera F. P., Liquid cooling of electronic devices by single-phase convection, Wiley, San Francisco, 1999, 304 pp. [2] Steinberg D. S., Cooling techniques for electronic equipment, Wiley, San Francisco, 1991, 512 pp. [3] Dul’nev G. N., Parfenov V. G., Sigalov A.V., Metody rascheta teplovykh rezhimov priborov (Computing method of devices thermal conditions), Radio y Sviaz’, Moscow, 1990, 312 pp. [4] Kalyakin S.G., Dzhusov Yu.P., Shtein Yu.Yu., Klimanova Yu.V., “Features of natural convection in circuits of complex form”, Izv. Vyssh. Uchebn. Zaved. Yadern. Energ., 2008, no. 1, 95–104 [5] Polezhaev V. I., Bessonov O.A., Nikitin N.V., Nikitin S. A., “Convective interaction and instabilities in GaAs Czochralski model”, Journal of Crystal Growth, 230:1–2 (2001), 40–47 ads [6] Berdnikov V. S., Antonov P.V., “Form effect of bowls bottom on the conjugate heat transfer in Bridgman method”, Izv. Vyssh. Uchebn. Zaved. Mat. Elektr. Tekhn., 2011, no. 4, 21–28 [7] Yucel A., Acharya S., Williams M.L., “Natural convection and radiation in a square enclosure”, Numerical Heat Transfer Part A, 15 (1989), 261–278 ads [8] Akiyama M., Chong Q.P., “Numerical analysis of natural convection with surface radiation in a square enclosure”, Numerical Heat Transfer Part A, 31 (1997), 419– 433 ads [9] Wang H., Xin S., Le Quere P., “Numerical study of natural convection-surface radiation coupling in air-filled square cavities”, C.R. Mecanique, 334 (2006), 48–57 Zentralblatt MATH ads [10] Sheremet M.A., Sopryazhennye zadachi estestvennoi konvektsii. Zamknutye oblasti s lokal’nymi istochnikami teplovydeleniya (Conjugate natural convection problems. Enclosures with local heat sources), Lambert Academic Publishing, Berlin, 2011, 176 pp. [11] Martyushev S.G., Sheremet M.A., “Numerical analysis of conjugate convectiveradiative heat transfer in enclosure”, Vestn. Tomsk. Univ. Mat. Mekh., 2010, no. 9, 96–106 Math-Net.Ru [12] Martyushev S. G., Sheremet M. A., “Characteristics of Rosseland and P − 1 approximations in modeling nonstationary conditions of convection-radiation heat transfer in an enclosure with a local energy source”, Journal of Engineering Thermophysics, 21:2 (2012), 111–118 [13] Kim D. M., Viskanta R., “Effect of wall conduction and radiation on natural convection in a rectangular cavity”, Numerical Heat Transfer, 7 (1984), 449–470
1 citations
24 Aug 2009
TL;DR: In this paper, a new method for the computational analysis of the dynamic behavior of bodies involved in calorific transfer processes is presented, based on Laplace direct transform application in order to solve the differential equations that characterizes one-way heat conduction.
Abstract: In this paper a new method for the computational analysis of the dynamic behavior of bodies involved in calorific transfer processes is presented. This technique facilitates the thermal studies carried out in the engineering and science fields. The solution presented is based on Laplace direct transform application in order to solve the differential equations that characterizes one‐way heat conduction. In this way, fast and precise results of the dynamic process are obtained, without the need of applying finite differences methods which result in high computational loads.
1 citations