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Cooling techniques for electronic equipment

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TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.

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Natural Convection Heat Transfer of Non-Newtonian Power-Law Fluids from a Pair of Two Attached Horizontal Cylinders

TL;DR: In this paper, the heat transfer of unconfined Power-law fluids from two attached horizontal cylinders has been investigated numerically to elucidate the non-Newtonian behavior of the fluid over a wide range of pertinent kinetics: Grashof number, 10 to 1e5, Prandtl number, 0.71 to 100, and Power law index; 0.2 to 1.8.