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Cooling techniques for electronic equipment
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TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.Abstract:
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.read more
Citations
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Proceedings ArticleDOI
Numerical Investigation on Cooling of Small Form Factor Computer Cases
O¨mer Emre Orhan,I˙lker Tarı +1 more
TL;DR: In this study, cooling of small form factor computers is numerically investigated using a commercial finite volume computational fluid dynamics software package and computational results were found to be in good agreement with the experimental ones.
DissertationDOI
An analytical model for developing a canary device to predict solder joint fatigue failure under thermal cycling conditions
TL;DR: In this paper, a first principles model to estimate the strain in the solder interconnects has been developed, which is further calibrated based on the results of finite element analysis, and the calibrated model is validated by comparing its results with results of testing of test assemblies under different thermal cycling loading conditions.
Journal ArticleDOI
Enhancing heat transfer rates from closed-sided, open-topped heat exchangers, each having vertical rectangular fins extending upwards from a horizontal base
TL;DR: In this article, the authors measured the steady-state rates of heat loss from arrays of uniformly-spaced vertical rectangular fin, extending upwards in otherwise stagnant air from horizontal heated bases.
Electronics warning and optimization study subject to low temperature environments
K. Khalkhali,M. Gombosev +1 more
Book ChapterDOI
Unsteady Forced Convection in a Duct with and without Arrays of Block-Like Electronic Compoments
TL;DR: In this article, the thermal response in laminar flow within a parallel-plates channel, due to periodic time oscillations of inlet temperature, in terms of phase lags and amplitude decays with respect to the inlet condition, is studied.