Book•
Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
Citations
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01 Jul 1995
TL;DR: In this paper , a thermal-hydraulic study for Quad Small Form Factor Pluggable Double Density (QSFP-DD) is presented, where the experimental data are used to validate computational fluid dynamics (CFD) models.
Abstract: Abstract Quad Small Form-factor Pluggable-Double Density (QSFP-DD) is the smallest high-speed (>14 Tb/s) interconnect system and is widely used in cloud computing and 5G network. However, the high-speed feature comes at the cost of large power dissipation. The QSFP-DD system contributes 400 to 960 W per rack unit, which necessitates its thermal management. The authors, having identified a knowledge gap in the existing literature, humbly hope to pioneer a thermal-hydraulic study for QSFP-DD. The study starts with experiments in a wind tunnel wherein temperature, power, fan speed, and pressure are measured. The experimental data are used to validate computational fluid dynamics (CFD) models. Both lumped fan and multiple reference frame fan models have been studied with comparisons versus experimental data. Subsequently, the focus of CFD study is shifted to the QSFP-DD system’s thermal-hydraulic structures, including variation in fins’ height, quantity, and the grille free area ratio. Finally, the CFD results are processed into an empirical Nusselt number correlation for thermal performance prediction. The study reveals that optimum thermal performance could be achieved by balancing heat sink fin area and pressure drop of the system.
Journal Article•
TL;DR: In this article, a midplane packaging that is suitable for multi interface implementation was developed in order to reduce the number of signal layers for redundant signalpath in a backplane, thus, the connection reliability is greatly improved.
Abstract: A mid-plane packaging that is suitable for multi interface implementation was developed in this work. It separates the common function blocks and incidental function blocks into separate blocks. This packaging design reduces the number of signal layers for redundant signal-path in a backplane, thus, the connection reliability is greatly improved. This paper illustrates a general idea of the mid-plane packaging and provides fundamental technical issues, such as cooling performance, signal transmission capability for a through-type collectors and a cable support structure for applying this packaging to the telecommunication systems.
Dissertation•
12 Mar 1993
TL;DR: Park et al. as mentioned in this paper solved the natural convection liquid cooling from three uniformly heated protruding elements, simulating evenly spaced, vertical, plate-mounted electronic components facing an opposing unheated plate within an enclosure maintained at constant temperature.
Abstract: approved Natural convection liquid cooling from three uniformly heated protruding elements, simulating evenly spaced, vertical, plate-mounted electronic components facing an opposing unheated plate within an enclosure maintained at constant temperature, was numerically investigated. Twodimensional coupled conduction and natural convection governing equations were solved, based upon finite control volumes for a wide range of Rayleigh numbers. Dielectric liquids, including distilled water, FC-75, and ethylene glycol, were employed as coolants for a Prandtl number range from 5.9 to 103. Modified channel Rayleigh numbers and channel Rayleigh numbers from 104 to 1010, based on five channel spacing to vertical plate height ratios (b /h), respectively, 0.2, 0.267, 0.333, 0.4, and 0.5, were analyzed. Redacted for Privacy Protruding surface temperatures of the uniformly heated elements were lowest for water, followed by ethylene glycol, and were highest for FC-75. Three distinct flow patterns were observed for the protruding heated channels: reversed flows due to the effect of circulation at the top portion of the enclosure, relatively high velocity flows at the front of the heated elements, and relatively weak flows adjacent to the unheated shrouding plate. Optimum channel spacing to height ratios were analyzed to determine effective temperature reductions for the protruding heated surfaces. For water, FC-75, and ethylene glycol, subject to varied heat input levels, optimal ratios were, respectively, 0.333, 0.4, and greater than 0.4. The most favorable correlations of protruding vertical channels for all cooling liquids combined were and Nub = 1.6539 [(b)Rab* 10.1371 Nub = 1.4902 [(=b )Itab n with standard deviations of 9.75% and 9.76%, respectively, for 5.9 -:_< Pr 103, 0.2 :_< blh :<_ 0.5, and 1.03 -E R1 9.8, where R1 is the solid heating element to liquid thermal conductivity ratio. Numerical Analysis of Liquid Cooling by Natural Convection for Heated Protrusions Simulating Vertical Plate-Mounted Electronic Components Facing an Opposing Plate by Sung-Kwan Park A THESIS submitted to Oregon State University in partial fulfillment of the requirements for the degree of Doctor of Philosophy Completed March 12, 1993 Commencement June 1993
Patent•
22 Jun 2009
TL;DR: In this paper, the authors proposed a heat sink (400, 500, 600) for a throttle or a transformer, which can be used to achieve a desired decoupling of the cooling of the immediate vicinity of the throttle or of the transformer.
Abstract: The present invention relates to a heat sink (400, 500, 600) for a throttle (105) or a transformer, wherein the heat sink (400, 500, 600) includes a coolant-contact side (410) for thermal coupling to a core (120) of the throttle (105 has) or the transformer and a choke (105) and a transformer with such a heat sink (400, 500, 600). To such a heat sink (400, 500, 600) provide, can be used to achieve a desired decoupling of the cooling of the immediate vicinity of the throttle (105) or of the transformer and a good power dissipation and heat removal from the reactor (105) and when it is used over a conventional liquid cooling lower power losses occur is proposed that the heat sink (400, 500, 600) to be provided on the coolant-contact side (410) with at least one recess (415) and / or a barrier region (420) having a comprises material whose electrical conductivity is lower than that of the heat sink material outside the stop band (420).