Book•
Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
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01 Jan 2003
TL;DR: In this article, a simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments, and a fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established.
Abstract: A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic solder on both top and bottom of the ball. Failure of the solder joint occurs at the eutectic solder. A closed-form solution with the equilibrium of displacements of electronic package assembly was first developed to calculate the solder joint strains during the temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution in the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials, which used elastic-plastic properties. A fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established. CBGA test results, obtained from Motorola, combined with the derived solder strains were used to calibrate the proposed life prediction model. In the model calibration process, the 255- and 304-pin CBGA test results, which were cycled between 0°C and 100°C or −40°C and 125°C, were reasonably well correlated to the calculated values of solder strains. In addition, this calibrated model is remarkably simple compared to the model used in an evaluation by finite element analysis. Therefore, this model could be used and is recommended to serve as an effective tool to preliminarily estimate the CBGA solder joint thermal fatigue life.Copyright © 2003 by ASME
Cites background from "Cooling techniques for electronic e..."
...The equilibrium equation shown in Steinberg (1991) is presented in equation (1) to describe...
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...A detailed description of this calculation can be found in Steinberg (2001). The shear strains for the eutectic and 90Pb/10Sn solders can be obtained as:...
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Dissertation•
01 Jul 2017
TL;DR: In this paper, the authors investigate the ability of forced circulated air inside a system of stackable electronic devices in transferring heat generated from four identical Intel J1900 10W computer processor unit (CPU).
Abstract: The purpose of this study is to investigate the ability of forced circulated air inside a system of stackable electronic devices in transferring heat generated from four identical Intel J1900 10W computer processor unit (CPU). Each CPU was isolated from each other by locating it inside four separated electronic devices which are stacked on each other and sandwiched between cool air supply chamber at bottom and exhaust chamber at top. Validation of numerical model against a benchmark forced convection problem was performed and compared results are in good agreement. Effect of viscous heating, buoyancy, cooling fan speed and device stacking level were numerically analyzed by commercially available computational fluid dynamics (CFD) software ANSYS Fluent version 16. Navier-Stokes equations were solved in simulation of conjugate heat transfer where conduction occurs from CPUs into heatsink and mini-ITX motherboard and subsequently via forced convection of circulated air into environment. Results show that cooling fan speed of 1.0 m/s for prevention of CPU failure during operation is the minimum allowable speed and selected enclosure material should be able to withstand at least 76 °C of near wall temperature.
10 Aug 2020
TL;DR: In this article, a direct current (DC) evaporative cooling system was incorporated with photovoltaic (PV) system formed from "PV panels, solar charger, converter, batteries" and insert to innermost of refrigerator by peltier.
Abstract: The research shows employing sundog cells for cooling process by design, progress of "evaporative cooling system ". All this to offer inexpensive method, devours more virtue as well as few energies in contrast with ordinary "evaporative cooling system". Consequently, this paper focuses "in the design and creation " direct current (DC) evaporative cooling system" incorporated with "photovoltaic (PV) system" formed from "PV panels, solar charger, converter, batteries" and insert to innermost of refrigerator by peltier . "Evaporative cooling system" depend on stellar also work in free areas. Also, solar energy is charge effectual, renewable, no environmental pollution. So finally fantastic method. ARTICLE INFO
01 Jan 2014
TL;DR: In this article, a heat sink for Electronic Unit (EU) of an Air Vehicle (AV) has been designed using the empirical heat transfer correl ations by considering natural convection and radiation heat t ransfer modes for given heat load.
Abstract: Thermal design and thermal analysis is necessary to effectively and efficiently cool electronic compon ents for its best operation. This cooling method is know n as electronic cooling. In the present work a finn ed heat sink for Electronic Unit (EU) of an Air Vehicle (AV) has bee n designed using the empirical heat transfer correl ations by considering natural convection and radiation heat t ransfer modes[1] for given heat load. The prelimina ry calculations indicated that plane surface was inade quate to dissipate the heat, thus necessitating fin s to augment the heat dissipation to the ambient. Heat transfer calc ulations were carried out for finned surface to fin d out the maximum surface temperature, which is well below the maximum permissible temperature. Further fin space optimization has been made by using empirical corre lation for given heat sink to bring down the surfac e temperature further below.3D modelling of all the parts of the electronic unit was carried out in SolidWorks2012.U sing Flo.EFD software the CFD model is generated and analysed to obtain the total thermal mapping of the above elec tronic unit. The CFD results were used to validate the results o btained through the excel spread sheet program deve loped based on the empirical correlations available in the lite rature.