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Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
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TL;DR: In this paper, the authors present some of the constraints that affect system performance, reliability, materials selection, and assembly of the product, including chip crossing delay, fan out, DC voltage drop, the number of simultaneously switched line drives and reflections of signal waves from discontinuities in transmission line networks.
Abstract: Manufacturing electronic systems is a multicomponent, multichip, hybrid design process which spans the life of the product. The design constraint list is not limitless, but if incomplete, can lead to economic loss for the product. Details of some of the constraints that affect system performance, reliability, materials selection, and the assembly of the product are presented. The electronic constraints include chip crossing delay, fan out (number of receivers on a driven net), crosstalk (unwanted electromagnetic coupling between independent signal lines and power supplies), DC voltage drop, the number of simultaneously switched line drives and reflections of signal waves from discontinuities in transmission line networks. The power dissipation constraints include maximum junction temperature, ambient temperature and pressure drop conditions, and component-to-component temperature variation. The cost constraints include materials, fabrication, and assembly. Some of the mathematical constraints are defined, along with the coupling between them and optimum solutions are shown graphically. The ability to resolve the system manufacturing constraints through optimization will determine the final success of a product. >
29 citations
TL;DR: In this article, a pair of vertically aligned heated cylinders has been studied numerically over the following ranges of conditions: Prandtl number ( 0.72 ⩽ Pr ⊽ 10 2 ), Grashof number ( 10 ⩾ Gr ⌽ 10 4 ), power-law index (0.3 ⌈ n ⌾ 1.5 ) and the center-to-center gap between the two cylinders was varied over the range ( 2 ⌲ (S/D ) ⌵ 20 ).
28 citations
TL;DR: In order to have a prospective future towards commercialization of TEPG systems, the existing prototypes in the literature are still subjected to many enhancements in their design aspects, while further improvements are needed to be achieved independently in TEMs’ development.
28 citations
TL;DR: The thermal performance of plate fin, round pin-fin, and offset strip-fin heat sinks with a duct-flow type fan arrangement was analytically evaluated in this article.
Abstract: The thermal performance of plate fin, round pin-fin, and offset strip-fin heat sinks with a duct-flow type fan arrangement was analytically evaluated. Heat sinks of 65mmtimes60 mm plan areatimes50 mm height with a 4300-RPM dc fan (60mmtimes15mm) were chosen for the performance comparison. A constant temperature, 6-mm thick heat sink base plate is assumed so that thermal spreading resistance is not involved. The operating point on the fan curve is based on the flow pressure drop impedance curve through a heat sink using the friction factor correlation for the chosen heat sink. The loss coefficients at both the entrance and the exit of the heat sink are included in the flow impedance curve. The operating point is defined by the balance point of the flow impedance curve and the fan performance curve. After determining the operating air velocity, the convective thermal resistance of heat sinks is evaluated from the Nusselt number correlation for the chosen heat sink. Results obtained show that optimized round pin-fin heat sinks provide 32.8%-46.4% higher convective thermal resistance compared to an optimized plate-fin heat sink. The optimized offset strip-fin heat sink shows a slightly lower convective thermal resistance than the plate-fin heat sink. As the offset strip length decreases, however, thermal performance seriously deteriorates
27 citations
Cites background from "Cooling techniques for electronic e..."
...I N MODERN sophisticated electronic devices, maintaining chip junction temperature below a tolerable limit by using well-designed heat sinks is crucial [1]....
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TL;DR: In this article, an experimental study of natural convection heat transfer from a heat source module of finite thickness, mounted on a vertical or horizontal surface, is carried out, where temperature distributions in the flow and along the surface are measured.
26 citations