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Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
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TL;DR: In this article, a microelectromechanical system (MEMS) device comprised of an active cooling substrate (ACS) designed and fabricated to add fluidic cooling functionality to printed wiring boards (PWB) is enhanced through the additional heat convection mode.
Abstract: Heat removal in printed wiring boards (PWB) is primarily accomplished through conduction. This work presents a microelectromechanical system (MEMS) device comprised of an active cooling substrate (ACS) designed and fabricated to add fluidic cooling functionality to the PWB. Thermal management is enhanced through the additional heat convection mode. Synthetic jet technology makes the compact, but easily integrated, MEMS cooling device possible. The fluid control unit, a synthetic jet, has been implemented in an epoxy-glass printed wiring board by multilayer lamination. An air reservoir is drilled through the core of printed wiring board. A flexible polymeric diaphragm and a low profile electromagnetic driver create an active pumping system to produce vibrating air jets downstream of microfluidic channels which transports heat generated by hot microelectronic components. Test heater chips have been directly die attached to the substrate. The integrated packaging system has been characterized mechanically, electrically, and thermally. Peak jet velocities of 14 m/s and average jet velocities of approximately 3 m/s have been achieved at actuator powers of 60 mW. This integrated active cooling substrate has the potential for broad applications in thermal management at the system packaging level.
26 citations
25 citations
TL;DR: In this paper, the effects of the power-law and Bingham plastic viscosity on the flow and heat transfer characteristics of laminar forced convection through non-circular ducts of a range of cross-sections have been investigated numerically over the wide ranges of Peclet number, 10 ⩽ ( Pe = Re · Pr )⩽ 10 4, power-Law index, 0.2 ⩻ n ⩾ 2 and Bingingham number, 0 ⩩� Bn ⎽ 15, two different thermal boundary
24 citations
TL;DR: In this article, the authors investigated the forced convection heat transfer from two square cylinders in tandem arrangement to power-law and Newtonian fluids, and the results reported in this paper encompass wide ranges of the pertinent dimensionless parameters, namely, Prandtl number, 0.71⩽-Pr⊽-100, Reynolds number and 0.1-Reynolds number.
24 citations
TL;DR: In this paper, the effects of effusion perforation diameter and its position on flow structure, temperature contours, heat transfer, and friction coefficient for different jet-to-cross Reynolds number ratios (ReR) were investigated numerically using RNG k-ɛ turbulence model.
23 citations