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Cooling techniques for electronic equipment
07 Nov 1980-
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
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TL;DR: In this paper, the authors present results for three-dimensional laminar and standard K-e turbulent numerical simulations of natural convection cooling of 10 cubic aluminum blocks mounted on an insulated plate, facing a shrouding wall.
Abstract: Results are presented for three-dimensional laminar and standard K-e turbulent numerical simulations of natural convection cooling of 10 cubic aluminum blocks mounted on an insulated plate, facing a shrouding wall. This geometry is chosen so that comparison with experimental results is possible. The problem considered is of great practical importance because it simulates the case of heated electronic chips, mounted on printed board assemblies, which are frequently encountered in electronic industry applications. The problem is mathematically modeled by the three-dimensional conservation differential equations of mass, momentum, energy and turbulent kinetic energy, and dissipation (for the turbulent flow model). These equations are solved numerically by a finite volume method, and the laminar and turbulent results are compared with the experimental results obtained with similar parameters.
20 citations
20 citations
TL;DR: In this paper, the effects of the amplitude of heat flux variation, inlet velocity, and geometry, including the thickness of the heat sink, were investigated for straight rectangular microchannels affected by a time-dependent heat flux input.
20 citations
21 Oct 2010
TL;DR: In this paper, the synchronous machine is projected as a permanent magnet synchronous motor with outer rotor embedded into rear rim of a bus and the main target of the study is design of an air self-cooled hub-wheel PMSM from electromagnetic point of view and using finite element analysis of electromagnetic field and thermal distribution.
Abstract: The paper deals with a study of new synchronous machine for use in hybrid vehicle. The synchronous machine is projected as permanent magnet synchronous motor with outer rotor embedded into rear rim of a bus. The main target of the study is design of an air self-cooled hub-wheel PMSM from electromagnetic point of view and using finite element analysis of electromagnetic field and thermal distribution. The analysis of losses in permanent magnets is also mentioned.
19 citations
TL;DR: A new approach that combines a physics of failure (PoF) method and a copula Bayesian network to assess complex electronic systems is proposed and can guide the improvement of system reliability and system maintenance.
19 citations