Open AccessBook
Cooling techniques for electronic equipment
Reads0
Chats0
TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.Abstract:
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.read more
Citations
More filters
Proceedings ArticleDOI
CFD Analyses of Heat Sinks for CPU Cooling With Fluent
Emre O¨ztu¨rk,I˙lker Tarı +1 more
TL;DR: In this article, forced cooling of heat sinks mounted on CPUs was investigated and the best heat sink geometry was selected and it was modified in order to have lower maximum temperature distribution in the heat sink.
Journal ArticleDOI
Characteristics of Natural Convection Heat Transfer in an Array of Discrete Heat Sources
TL;DR: In this article, the authors investigated the influence of the Rayleigh number on the velocity and thermal fields inside a closed cavity with three different vertical locations, located at the middle of each of the three heaters.
Patent
Placement structure of an integrated motherboard for small form factor computer
TL;DR: In this paper, an integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard, and a memory module is located next to the south bridge/north bridge chipset towards the front of the motherboard.
Journal ArticleDOI
Systematic strategy for modeling and optimization of thermal systems with design uncertainties
TL;DR: In this article, a systematic strategy of modeling and optimizing of the thermal systems with the considerations of the design uncertainties is proposed, which can be applied to either experiments or simulations of other thermal systems to quantitatively represent the performances, improve their productivity, maintain the quality control, and reduce the probability of system failure.
Journal ArticleDOI
Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices
TL;DR: Three-dimensional finite element analysis has been applied for determining time-dependent solder joint response of leaded surface mount components under thermal cycling, resulting in a generic approach for nonlinear creep analysis using commercial FEA software on a high performance workstation.