Proceedings ArticleDOI
Copper Coin Over Thermal VIA in PCB for Thermal Management of 12W
Marcus Miguel V. Vicedo,Febus Reidj G. Cruz,Ramon G. Garcia +2 more
- pp 169-172
Reads0
Chats0
TLDR
In this article, a copper (Cu) coin structure embedded on a printed circuit board (PCB) was developed to dissipate a 12 W peak power out of the device system working at less than 60 °C.Abstract:
This work developed a copper (Cu) coin structure embedded on a printed circuit board (PCB) to dissipate a 12 W peak power out of the device system working at less than 60 °C. The designed Cu coin was based on the manufacturing limitations and allowed the thermal setup to be mounted on the bottom side of the board for automated test equipment (ATE) applications of the device. Thermal simulations through computational fluid dynamics (CFD) were analyzed and presented both for Cu coin and thermal vertical interconnect access (VIA), to quantify the thermal performances and compare the thermal benefits. Size variations on the designed Cu coin were investigated and quantified setting a thermal decay rate per change in dimension. The actual thermal measurement for the fabricated Cu coin design was presented on the experimental results, matching the simulation values and proving the viability of thermal Cu coin.read more
Citations
More filters
Proceedings ArticleDOI
Large, High Conductivity Direct-Fill Copper Thermal Vias for High Power Devices
Alfred A. Zinn,Alexander Capanzana,Nhi Ngo,Hannah T. Zinn,Khanh Nguyen,Randall M. Stoltenberg +5 more
TL;DR: ActiveCopper as mentioned in this paper is a thermal via technology that allows the direct formation and integration of large mm-size thermal vias into printed circuit boards (PCBs), ceramic and glass substrates, thus maximizing heat dissipation.
Proceedings ArticleDOI
Next-generation Packaging Enabled by an Engineered Copper Nanomaterial
Randall M. Stoltenberg,Alex Capanzana,Agustin Vega,Nhi Ngo,Reynaldo Joven,Li Zhenggang,Chee Lip Gan,Yeng Ming Lam,Alfred A. Zinn +8 more
TL;DR: ActiveCopper as discussed by the authors enables the formation of bulk copper joints at typical soldering temperatures, yet the resulting interconnects are stable up to 500°C or more, and has been developed for a number of applications including die attach, thermal vias, and a replacement for WCu heat spreaders.
References
More filters
Proceedings ArticleDOI
Component size and effective thermal conductivity of printed circuit boards
TL;DR: In this paper, numerical solutions of the three-dimensional heat conduction equation were used to study variation of the effective thermal conductivity of printed circuit boards (PCBs) with component size.
Journal ArticleDOI
Advanced Thermal Management Solutions on PCBs for High Power Applications
TL;DR: In this article, the authors consider the thermal performance of high-power components, particularly in the field of high power components, and propose an efficient thermal management on the circuit carrier.
Proceedings ArticleDOI
Investigation of effects of heat sinks on thermal performance of microelectronic package
TL;DR: In this paper, the effect of change in heat sink geometry on thermal performance of aluminium and copper heat sinks in microelectronics was investigated using steady state thermal conduction analysis, and the authors concluded that aluminium heat sink recorded the lowest minimum temperatures in both investigations and is recommended as optimal thermal management material for heat sink production.
Proceedings ArticleDOI
A comparison of thermal vias patterns used for thermal management in power converter
TL;DR: In this article, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of power electronics devices is presented based on the results from available literature and practical manufacturing guidelines, four different via patterns for single power devices are selected.
Proceedings ArticleDOI
Investigation of thermal conductivity of PCB
TL;DR: In this article, the thermal conductivity of PCB structures variations according to the position of the metal layers as a function of the local copper contents and distribution is studied, using the corresponding electrical analogs of parallel and serial resistive systems.