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Design and analysis of heat sinks
01 Jan 1995-
TL;DR: In this article, the authors present an algorithm for Finned array assembly, which is based on linear transformations with singular fins and spines and single elements, and a general array method with reciprocity and node analysis.
Abstract: Linear Transformations. Elements of the Linear Transformations. Singular Fins and Spines and Single Elements. Algorithms for Finned Array Assembly. Examples of Finned Array Analysis. Reciprocity and Node Analysis. A General Array Method. Convective Optimizations. Heat Transfer-Parallel Plate Heat Sinks. References. Appendices. Indexes.
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TL;DR: In this paper, the authors present an overview of various cooling methods that can be employed for photovoltaic cells, including linear concentrators, single-cell arrangements, and densely packed photovolastic cells.
678 citations
TL;DR: In this article, the authors compared the performance of LEDs and blue laser diode (LD) for future solid-state lighting (SSL) systems and compared their current state-of-the-art input-power-density-dependent power-conversion efficiencies and potential improvements both in their peak powerconversion efficiency and in the input power densities at which those efficiencies peak.
Abstract: Solid-state lighting (SSL) is now the most efficient source of high color quality white light ever created. Nevertheless, the blue InGaN light-emitting diodes (LEDs) that are the light engine of SSL still have significant performance limitations. Foremost among these is the decrease in efficiency at high input current densities widely known as “efficiency droop.” Efficiency droop limits input power densities, contrary to the desire to produce more photons per unit LED chip area and to make SSL more affordable. Pending a solution to efficiency droop, an alternative device could be a blue laser diode (LD). LDs, operated in stimulated emission, can have high efficiencies at much higher input power densities than LEDs can. In this article, LEDs and LDs for future SSL are explored by comparing: their current state-of-the-art input-power-density-dependent power-conversion efficiencies; potential improvements both in their peak power-conversion efficiencies and in the input power densities at which those efficiencies peak; and their economics for practical SSL.
434 citations
Cites background from "Design and analysis of heat sinks"
...The parameter γ ∼ 15 is a factor by which the surface area of the heat sink is assumed to be increased due to fins or other area enhancements [145, 146]....
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01 Jan 2000
TL;DR: In this paper, the authors highlight design and technology challenges encountered in mobile computers, desktops, and servers with respect to thermal design for a microprocessor and highlight the concurrent development and packaging of all these elements to ensure that a viable thermal design solution space exists.
Abstract: The demand for high-performance microprocessors has resulted in an escalation of power dissipation as well as heat flux at the silicon level. At the same time, the desire for smaller form-factor chassis and lower silicon operating temperatures is compounding the thermal challenge. Thermal design for a microprocessor can no longer be treated in isolation. Power and performance trade offs and smart circuit-design techniques are required to conserve power consumption. Materials and process improvements in packaging and heat-sink technology are required to minimize thermal resistance. The concurrent development and packaging of all these elements is critical to ensure that from a cost and availability perspective a viable thermal design solution space exists. This paper attempts to address this multidimensional problem, highlighting design and technology challenges encountered in mobile computers, desktops, and servers.
430 citations
Cites background from "Design and analysis of heat sinks"
...A good discussion on heat-sink designs can be found in [3]....
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TL;DR: In this paper, a thermoelectric module composed of TEGs and a cooling system is developed to improve the efficiency of an IC engine, and two potential positions on an automobile are chosen to apply this module, e.g. exhaust pipe and radiator, to examine the feasibility.
323 citations
26 Jan 2004
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Abstract: Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards general illumination. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the developments of LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 lumens/W, this is approximately 6 times the efficiency of a conventional incandescent tungsten bulb. Thermal management for the solid-state lighting applications is a key design parameter for both package and system level. Package and system level thermal management is discussed in separate sections. Effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips. The higher thermal conductivity of the SiC chip provided about 2 times better thermal performance than the latter, while the under-filled Sapphire chip package can only catch the SiC chip performance. Later, system level thermal management was studied based on established numerical models for a conceptual solid-state lighting system. A conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
247 citations
Cites methods from "Design and analysis of heat sinks"
...Although designing a heat sink methodology is well outlined in many publications [Kraus and Bar-Cohen, 1995], implementing a heat sink into a particular design needs careful attention....
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