Design and analysis of MEMS piezoresistive rectangular paddle microcantilever based wind speed sensor
13 Oct 2018-Integrated Ferroelectrics (Taylor & Francis)-Vol. 193, Iss: 1, pp 43-58
TL;DR: In this article, a wind speed sensor based on MEMS piezoresistive microcantilever is presented, which is based on the drag force of the wind flow on any...
Abstract: This paper presents design, simulation and finite element analysis of a wind speed sensor based on MEMS piezoresistive microcantilever. The design is based on the drag force of the wind flow on any...
01 Jan 2020
TL;DR: In this paper , a compact optical Fabry-Pérot (FP) pressure sensor for wind pressure measurement was developed by MEMS technology, which consists of a MEMS sensing chip, a vertical-cavity surface-emitting laser (Vcsel), and a photodiode (PD).
Abstract: Pressure sensors have important prospects in wind pressure monitoring of transmission line towers. Optical pressure sensors are more suitable for transmission line towers due to its anti-electromagnetic interference. However, the fiber pressure sensor is not a suitable choice due to expensive and bulky. In this paper, a compact optical Fabry–Pérot (FP) pressure sensor for wind pressure measurement was developed by MEMS technology. The pressure sensor consists of a MEMS sensing chip, a vertical-cavity surface-emitting laser (Vcsel), and a photodiode (PD). The sensing chip is combined with an FP cavity and a pressure sensing diaphragm which adopts the square film and is fabricated by Silicon on Insulator (SOI) wafer. To calibrate the pressure sensor, the experimental platform which consists of a digital pressure gauge, a pressure loading machine, a digital multimeter, and a laser driver was set up. The experimental results show that the sensitivity of the diaphragm is 117.5 nm/kPa. The measurement range and sensitivity of the pressure sensor are 0–700 Pa and 115 nA/kPa, respectively. The nonlinearity, repeatability, and hysteresis of the pressure sensor are 1.48%FS, 2.23%FS, and 1.59%FS, respectively, which lead to the pressure accuracy of 3.12%FS.
TL;DR: In this paper, shape modification of microcantilever to enhance the sensitivity and reliability of a MEMS-based wind speed sensor is described, and the experimental results have been compared to evaluate the performance of the fabricated sensor.
Abstract: This paper describes shape modification of microcantilever to enhance the sensitivity and reliability of a MEMS based wind speed sensor. Finite element analysis simulations with COMSOL and the experimental results have been compared to evaluate the performance of the fabricated sensor. The sensitivity is increased with modified structure to 108.46 μV/V-ms–1. Use of full cut stress concentration regions results in substantial increase of nearly four times the sensitivity of a simple rectangular paddle microcantilever. Introducing fillets at the paddle-cantilever junction resulted in improved reliability.
•01 Jan 1997
TL;DR: The second edition of the Fundamentals of Microfabrication as discussed by the authors provides an in-depth coverage of the science of miniaturization, its methods, and materials, from the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering.
Abstract: MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world.A bestseller in its first edition, Fundamentals of Microfabrication, Second Edition reflects the many developments in methods, materials, and applications that have emerged recently. Renowned author Marc Madou has added exercise sets to each chapter, thus answering the need for a textbook in this field.Fundamentals of Microfabrication, Second Edition offers unique, in-depth coverage of the science of miniaturization, its methods, and materials. From the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering, it provides the background, tools, and directions you need to confidently choose fabrication methods and materials for a particular miniaturization problem.New in the Second EditionRevised chapters that reflect the many recent advances in the fieldUpdated and enhanced discussions of topics including DNA arrays, microfluidics, micromolding techniques, and nanotechnology In-depth coverage of bio-MEMs, RF-MEMs, high-temperature, and optical MEMs.Many more links to the WebProblem sets in each chapter
01 Jan 2002
TL;DR: In this paper, a comparison of top-down and bottom-up manufacturing methods for micro-manufacturing is presented, with a focus on the use of micro-processors.
Abstract: LITHOGRAPHY Introduction Historical Note: Lithography's Origins Photolithography Overview Critical Dimension, Overall Resolution, Line-Width Lithographic Sensitivity and Intrinsic Resist Sensitivity (Photochemical Quantum Efficiency) Resist Profiles Contrast and Experimental Determination of Lithographic Sensitivity Resolution in Photolithography Photolithography Resolution Enhancement Technology Beyond Moore's Law Next Generation Lithographies Emerging Lithography Technologies PATTERN TRANSFER WITH DRY ETCHING TECHNIQUES Introduction Dry Etching: Definitions and Jargon Plasmas or Discharges Physical Etching: Ion Etching or Sputtering and Ion-Beam Milling Plasma Etching (Radical Etching) Physical/Chemical Etching PATTERN TRANSFER WITH ADDITIVE TECHNIQUES Introduction Silicon Growth Doping of Si Oxidation of Silicon Physical Vapor Deposition Chemical Vapor Deposition Silk-Screening or Screen-Printing Sol-Gel Deposition Technique Doctors' Blade or Tape Casting Plasma Spraying Deposition and Arraying Methods of Organic Layers in BIOMEMS Thin versus Thick Film Deposition Selection Criteria for Deposition Method WET BULK MICROMACHINING Introduction Historical Note Silicon Crystallography Silicon As Substrate Silicon As A Mechanical Element In MEMS Wet Isotropic And Anisotropic Etching Alignment Patterns Chemical Etching Models Etching With Bias And/Or Illumination Of The Semiconductor Etch-Stop Techniques Problems With Wet Bulk Micromachining SURFACE MICROMACHINING Introduction Historical Note Mechanical Properties of Thin Films Surface Micromachining Processes Poly-Si Surface Micromachining Modifications Non-Poly-Si Surface Micromachining Modifications Materials Case Studies LIGA AND MICROMOLDING Introduction LIGA-Background LIGA and LIGA-Like Process Steps A COMPARISON OF MINIATURIZATION TECHNIQUES: TOP-DOWN AND BOTTOM-UP MANUFACTURING Introduction Absolute and Relative Tolerance in Manufacturing Historical Note: Human Manufacturing Section I: Top-Down Manufacturing Methods Section II: Bottom-Up Approaches MODELING, BRAINS, PACKAGING, SAMPLE PREPARATION AND NEW MEMS MATERIALS Introduction Modeling Brains In Miniaturization Packaging Substrate Choice SCALING, ACTUATORS, AND POWER IN MINIATURIZED SYSTEMS Introduction Scaling Actuators Fluidics Scaling In Analytical Separation Equipment Other Actuators Integrated Power MINIATURIZATION APPLICATIONS Introduction Definitions and Classification Method Decision Three OVERALL MARKET For MICROMACHINES Introduction Why Use Miniaturization Technology ? From Perception to Realization Overall MEMS Market Size MEMS Market Character MEMS Based on Si Non-Silicon MEMS MEMS versus Traditional Precision Engineering The Times are a'Changing APPENDICES Metrology Techniques WWW Linkpage Etch Rate for Si, SiO2 Summary of Top-Down Miniaturization Tools Listing of names of 20 amino acids & their chemical formulas Genetic code Summary of Materials and Their Properties for Microfabrication References for Detailed Market Information on Miniature Devices MEMS Companies Update Suggested Further Reading Glossary Symbols used in Text INDEX Each chapter also contains sections of examples and problems
"Design and analysis of MEMS piezore..." refers background in this paper
...Figure 2 illustrates MEMS cantilever deflection working principle ....
TL;DR: A review of the research and development of micromachined flow sensors which have been done in the last few years by international academic and industrial institutions can be found in this article, which covers the need of low-cost, accurate and reliable sensors for industrial and consumer product applications.
Abstract: Micromachining technology has been developed very rapidly in recent years. This technology takes advantage of the benefits of semiconductor technology to address the manufacturing and performance requirements of the sensors industry. The compatibility of micromachining and microelectronics makes the integration of electronics and mechanical elements possible. This covers the need of low-cost, accurate and reliable sensors for industrial and consumer product applications. An important product of micromachining technology is the micro-mass flow sensor which has a history of over 20 yrs. This paper presents a review of the research and development of micromachined flow sensors which have been done in the last few years by international academic and industrial institutions.
TL;DR: In this article, the authors report the development of micromachined, distributed flow sensors based on a biological inspiration, the fish lateral line sensors, and design and fabrication processes for realizing individual lateral line sensor nodes are discussed.
Abstract: Underwater flow sensing is important for many robotics and military applications, including underwater robots and vessels. We report the development of micromachined, distributed flow sensors based on a biological inspiration, the fish lateral line sensors. Design and fabrication processes for realizing individual lateral line sensor nodes are discussed in this paper, along with preliminary characterization results.
TL;DR: In this paper, changes in the resonance frequency of microcantilevers due to adsorption of analyte vapor on exposed surfaces is shown to provide a novel means for detection of the analyte.
Abstract: Changes in the resonance frequency of microcantilevers due to adsorption of analyte vapor on exposed surfaces is shown to provide a novel means for detection of the analyte. Frequency changes can be due to mass loading or adsorption-induced changes in cantilever spring constant. Sensitization to water vapor is demonstrated by coating cantilever surfaces with hygroscopic materials, such as phosphoric acid. Cantilevers coated with a thin gelatin film exhibit high sensitivity and a linear response with changes in relative humidity, apparently due to changes in the spring constant of the coated cantilever. In addition to frequency response, static cantilever deflection also changes with vapor adsorption. Both phenomena can be used to detect adsorbed vapors with picogram mass resolution. 19 refs., 2 figs.
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