Journal ArticleDOI
Design and fabrication aspects of an S-shaped film actuator based DC to RF MEMS switch
Joachim Oberhammer,Göran Stemme +1 more
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TLDR
In this paper, a flexible S-shaped film with the switching contact, rolling between a top and a bottom electrode in electrostatic touch-mode actuation, is presented for switching dc and RF signals.Abstract:
This paper reports on design and fabrication aspects of a new microelectromechanical series switch for switching dc and RF signals. The switch consists of a flexible S-shaped film with the switching contact, rolling between a top and a bottom electrode in electrostatic touch-mode actuation. This design allows a low actuation voltage independent of the contact distance in the off-state. With a large contact distance, large overlapping switching contact areas are possible by obtaining a high off-state isolation. The RF transmission line and the MEMS part of the switch are fabricated on separate wafers, allowing an implementation of the switch with different RF substrates. The final assembly is done on device level for the first prototypes, even though the design provides the possibility of an assembly by full wafer bonding, leading to a near-hermetic package integrated switch. The measured prototype actuation voltages are 12 V to open and 15.8 V to close the contacts, with a resistance of 275 m/spl Omega/ of each contact at an estimated contact force of 102 /spl mu/N. The measured RF isolation with a contact distance of 14.2 /spl mu/m is better than -45 dB up to 2 GHz and -30 dB at 15 GHz, at a large nominal switching contact area of 3500 /spl mu/m/sup 2/.read more
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Journal ArticleDOI
Adhesive wafer bonding
TL;DR: A review of the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications can be found in this paper, where the main advantages of this technique include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers.
Journal ArticleDOI
Electrostatic pull-in instability in MEMS/NEMS: A review
TL;DR: In this paper, a review of the pull-in phenomenon in electrostatically actuated MEMS and NEMS devices is presented, along with physical principles that have enabled fundamental insights into the pullin instability as well as pullin induced failures.
Journal ArticleDOI
Design, fabrication and RF performances of two different types of piezoelectrically actuated Ohmic MEMS switches
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Journal ArticleDOI
Miniature MEMS Switches for RF Applications
TL;DR: In this article, a new way to design MEMS (microelectromechanical system) metal contact switches for RF applications using miniature MEMS cantilevers was presented, and a single 25 × 25 μm switch was first demonstrated with a Au-to-Ru contact, Cu = 5 fF and Ron = 7 Ω at an actuation voltage of 55 V. The measured switching time is 2.2 μs and the release time is <;1 μs.
Journal ArticleDOI
A Ruthenium-Based Multimetal-Contact RF MEMS Switch With a Corrugated Diaphragm
TL;DR: In this paper, a ruthenium metal-contact RF microelectromechanical system switch based on a corrugated silicon oxide/silicon nitride diaphragm is presented.
References
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Journal ArticleDOI
RF MEMS switches and switch circuits
TL;DR: In this paper, the authors concentrate on electrostatic switches at 0.1-100 GHz with high reliability (100 million to 10 billion cycles) and wafer-scale manufacturing techniques.
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RF-MEMS switches for reconfigurable integrated circuits
TL;DR: In this article, the electrostatic microswitch is used in a number of existing circuits and systems, including radio front-ends, capacitor banks, and time-delay networks, for quasi-optical beam steering and electrically reconfigurable antennas.
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RF MEMS from a device perspective
TL;DR: The recent progress in MEMS for radio frequency (RF) applications from a device perspective is reviewed in this article, where switches and relays, tunable capacitors, integrated inductors, mechanical resonators and filters, and some representative microwave and millimetre-wave components are discussed.
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Micromachined low-loss microwave switches
TL;DR: In this paper, the design and fabrication of a micromechanical capacitive membrane microwave switching device is described, which consists of a thin metallic membrane, which has two states, actuated or unactuated, depending on the applied bias.
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Micromechanical membrane switches on silicon
TL;DR: In this paper, the authors describe the design, fabrication, operating behavior, and potential applications of voltage-controlled, micromechanical switches, which are basically extremely small, electrostatically controlled mechanical relays, typically less than 100 µm long.