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Journal ArticleDOI

Development of a "laminated waveguide"

01 Dec 1998-IEEE Transactions on Microwave Theory and Techniques (IEEE)-Vol. 46, Iss: 12, pp 2438-2443
TL;DR: In this paper, a waveguide of new structure has been developed for millimeter-wave applications, which can be embedded in a substrate and is able to be wired in three dimensions, and its transmission characteristics are evaluated using a glass-ceramic substrate of dielectric constant, /spl epsiv/sub r/=5, and loss, tan /spl delta/=0.0008.
Abstract: A waveguide of new structure has been developed for millimeter-wave applications. The dielectric waveguide is constructed with sidewalls consisting of lined via-holes and edges of metallized planes. This structure can be manufactured by lamination techniques, so we refer to the waveguide as a "laminated waveguide". The laminated waveguide can be embedded in a substrate and is able to be wired in three dimensions. The transmission characteristics are evaluated using a glass-ceramic substrate of dielectric constant, /spl epsiv//sub r/=5, and loss, tan /spl delta/=0.0008. Insertion loss per unit length of the guide is estimated to be less than 0.5 dB/cm at 83 GHz. Furthermore, it was confirmed that the laminated waveguide is suitable to feeding lines for a small sized plane array antenna. By electromagnetic simulation, it has been confirmed that fundamental structures, such as bends, branches, power dividers, and interconnections between upper and lower layers can be realized with sufficient performances.
Citations
More filters
Journal ArticleDOI
TL;DR: In this article, the authors provide an overview of the recent advances in the modelling, design and technological implementation of SIW structures and components, as well as their application in the development of circuits and components operating in the microwave and millimetre wave region.
Abstract: Substrate-integrated waveguide (SIW) technology represents an emerging and very promising candidate for the development of circuits and components operating in the microwave and millimetre-wave region. SIW structures are generally fabricated by using two rows of conducting cylinders or slots embedded in a dielectric substrate that connects two parallel metal plates, and permit the implementation of classical rectangular waveguide components in planar form, along with printed circuitry, active devices and antennas. This study aims to provide an overview of the recent advances in the modelling, design and technological implementation of SIW structures and components.

1,129 citations

Book ChapterDOI
15 Apr 2005
TL;DR: Linearly and circularly polarized conformal strip-fed dielectric resonator antennas (DRAs) are studied in this article, where a parasitic patch is used to excite a nearly degenerate mode.
Abstract: Linearly and circularly polarized conformal strip-fed dielectric resonator antennas (DRAs) are studied in this article. In the latter case, a parasitic patch is used to excite a nearly degenerate mode. The hemispherical DRA, excited in its fundamental broadside TE111 mode, is used for the demonstration. In the analysis, the mode-matching method is used to obtain the Green's functions, whereas the method of moments is used to solve for the unknown strip currents. In order to solve the singularity problem of the Green's functions, a recurrence technique is used to evaluate the impedance integrals. This greatly increases the numerical efficiency. Measurements were carried out to verify the calculations, with good results. Keywords: circularly polarized antenna; dielectric antennas; mode-matching methods; moment methods; parasitic antennas; resonance

898 citations

Journal ArticleDOI
TL;DR: In this article, the authors present new concepts that allow for the complete integration of planar circuits and waveguide filters synthesized on a single substrate by means of metallized post (or via-hole) arrays.
Abstract: The integrated planar technique has been considered as a reliable candidate for low-cost mass production of millimeter-wave circuits and systems. This paper presents new concepts that allow for a complete integration of planar circuits and waveguide filters synthesized on a single substrate by means of metallized post (or via-hole) arrays. Analysis of the synthesized integrated waveguide and design criteria are presented for the post pitch and diameter. A filter design method derived from a synthesis technique using inductive post is presented. An experimental three-pole Chebyshev filter having 1-dB insertion loss and return loss better than 17 dB is demonstrated. Integrating such planar and nonplanar circuits on a substrate can significantly reduce size, weight, and cost, and greatly enhance manufacturing repeatability and reliability.

868 citations


Cites methods from "Development of a "laminated wavegui..."

  • ...A number of components using the post-wall waveguide technique combined with a metallic layer were analyzed and simulated previously in [ 9 ]....

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Journal ArticleDOI
TL;DR: By etching longitudinal slots on the top metallic surface of the substrate integrated waveguide (SIW), an integrated slot-array antenna is proposed in this article, which takes the advantage of small size, low profile, and low cost, etc.
Abstract: By etching longitudinal slots on the top metallic surface of the substrate integrated waveguide (SIW), an integrated slot-array antenna is proposed in this letter. The whole antenna and feeding system are fabricated on a single substrate, which takes the advantage of small size, low profile, and low cost, etc. The design process and experimental results of a four-by-four SIW slot array antenna at X-band are presented.

498 citations


Cites background from "Development of a "laminated wavegui..."

  • ...Recently, the substrate integrated waveguide (SIW) and substrate integrated nonradiative dielectric waveguide (SINRD) [7]–[11] have provided an useful technology for the design of microwave and millimeter-wave circuits such as filters [12], and feeding lines for antennas [ 8 ], [9], etc....

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Journal ArticleDOI
TL;DR: In this paper, a low profile cavity backed planar slot antenna has been described, which is completely constructed at a single substrate by using substrate integrated waveguide technique and grounded coplanar waveguide.
Abstract: A novel design method of low profile cavity backed planar slot antenna has been described in this paper. The whole antenna including backed cavity and feeding element is completely constructed at a single substrate by using substrate integrated waveguide technique and grounded coplanar waveguide. An example with 1.7% bandwidth has been presented, which has 5.4 dBi gain, 16.1 dB front-to-back ratio and -19 dB maximum cross polarized radiation level with its total thickness less than lambda0/50. The proposed antenna keeps good radiation performance of conventional cavity backed antenna and has advantages of conventional planar antenna including low profile, light weight, easy fabrication with low cost and convenient integration with planar circuit.

402 citations

References
More filters
Book
01 Apr 1988
TL;DR: In this paper, Pramanick and Bhartia presented an approach for impedance transformation techniques in RF MEMS devices and circuit applications, which can be found in the Appendix A: Units and Symbols. Appendix B: Physical constants and other data.
Abstract: Preface. Introduction (P. Pramanick & P. Bhartia). Transmission Lines and Lumped Elements (I. Bahl). Resonators (A. Sharma & A. Khanna). Impedance Transformation Techniques (P. Shastry). Hybrids and Couplers (P. Bhartia & P. Pramanick). Filters (E. Griffin & I. Bahl). Active Devices (R. Trew). Passive Devices (R. Trew). Oscillators (A. Khanna). Amplifiers (I. Bahl & E. Griffin). Detectors and Mixers (R. Harrison). Microwave Control Circuits (K. Gupta). Frequency Multipliers and Dividers (R. Harrison). RF MEMS Devices and Circuit Applications (R. Ramadoss & K. Gupta). Circuit Fabrication Technologies (I. Bahl). Appendix A: Units and Symbols. Appendix B: Physical Constants and Other Data. Appendix C: ABCD and S-Parameters. Appendix D: Transfer Function Responses. Index.

653 citations

Journal ArticleDOI
01 Sep 1960
TL;DR: In this article, a method of calculation, which should be adequate for strip-lines of small spacing, is proposed for the evaluation of the radiation of line-above-ground configurations, and it is shown that an open-circuit is appreciably worse, from the point of view of radiation loss, than shortcircuit with a rightangle corner at an intermediate level.
Abstract: A method of calculation, which should be adequate for strip-lines of small spacing, is proposed for the evaluation of the radiation of line-above-ground configurations. It is shown that an open-circuit is appreciably worse, from the point of view of radiation loss, than short-circuit with a right-angle corner at an intermediate level. The radiation from a matched post is slightly worse than from the short-circuit, but it should be capable of considerable improvement by the use of a terminating frame antenna. Formulae are also given for the effects of reactive posts, with applications to a simple resonator.

95 citations

Proceedings ArticleDOI
16 May 1995
TL;DR: In this article, the difference between flip chip and wire bond technology is demonstrated, and the influence of a metallic lid on a coplanar waveguide structure is examined, where the flip chip version has a lower insertion loss of the flip-chip interconnections and the higher flexibility of mounting the MMICs directly on the back structure of the planar patch antenna, leading to reduced losses of the feedline.
Abstract: In this paper the difference between flip chip and wire bond technology is demonstrated. Test assemblies with coplanar waveguides have been attached in flip chip and wire bond technology and measured up to 75 GHz. Further, the influence of a metallic lid on a coplanar waveguide structure is examined. To compare flip chip and wire bond interconnections, 51 GHz frontends with GaAs devices in coplanar waveguide technology have been realized. In one frontend the low noise amplifier (LNA) is connected to a planar patch antenna by wire bonding and in a second one by flip chip attachment. RF evaluations show the clear advantage of the flip chip version due to the lower insertion loss of the flip chip interconnections and the higher flexibility of mounting the MMICs directly on the back structure of the planar patch antenna, leading to reduced losses of the feedline. >

52 citations


"Development of a "laminated wavegui..." refers methods in this paper

  • ...Combining the circuit board or a package with antenna, we can get a small and high-performance device system [ 1 ]‐[3]....

    [...]

Journal ArticleDOI
TL;DR: In this paper, the authors present a technique for suppressing the parallel-plate mode in a slot-coupled microstrip antenna with a triplate line feed, where the parallel plate mode is excited by the slot, resulting in a decrease of radiation efficiency.
Abstract: In a slot-coupled microstrip antenna with a triplate line feed, the parallel-plate mode is excited by the slot, resulting in a decrease of radiation efficiency. The authors present a technique for suppressing the parallel-plate mode in this type of the antenna. Measured results confirm the effective performance of the proposed method.

17 citations


"Development of a "laminated wavegui..." refers background in this paper

  • ...Several studies have been conducted on restraining the phenomenon [ 5 ], [6]....

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