Development of substrate integrated waveguide power dividers
04 May 2003-Vol. 3, pp 1921-1924
TL;DR: In this paper, two classes of substrate integrated waveguide (SIW) power divider are presented, namely, Y- and T-types, using arrays of via, the SIW power dividers and microstrip transitions are integrated on the same substrate.
Abstract: Two classes of substrate integrated waveguide (SIW) power divider are presented, namely, Y- and T-types. Using arrays of via, the SIW power dividers and microstrip transitions are integrated on the same substrate. Design models are presented respectively for the Y- and T-junctions. Experimental results over the Ka band are given for both structures. The Y-junction shows a bandwidth of 25.2% at -18.5 dB while the T-junction shows a bandwidth of 10.2% at -19.0 dB.
Citations
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17 Nov 2003
TL;DR: Current state-of-the-art of circuit design and implementation platforms based on this new concept are reviewed and discussed in detail and future research and development trends are discussed with reference to low-cost innovative design of millimeter-wave and optoelectronic integrated circuits.
Abstract: A new generation of high-frequency integrated circuits is presented, which is called substrate integrated circuits (SICs). Current state-of-the-art of circuit design and implementation platforms based on this new concept are reviewed and discussed in detail. Different possibilities and numerous advantages of the SICs are shown for microwave, millimeter-wave and optoelectronics applications. Practical examples are illustrated with theoretical and experimental results for substrate integrated waveguide (SIW), substrate integrated slab waveguide (SISW) and substrate integrated nonradiating dielectric (SINRD) guide circuits. Future research and development trends are also discussed with reference to low-cost innovative design of millimeter-wave and optoelectronic integrated circuits.
660 citations
TL;DR: In this article, an air-filled substrate integrated waveguide (SIW) made of a multilayer printed circuit board process is proposed for millimeter-wave applications that generally require low cost and low-loss performance and excellent power-handling capability.
Abstract: An air-filled substrate integrated waveguide (SIW) made of a multilayer printed circuit board process is proposed in this paper. It is of particular interest for millimeter-wave applications that generally require low cost and low-loss performance and excellent power-handling capability. This three-layered air-filled SIW allows for substantial loss reduction and power-handling capability enhancement. The top and bottom layers may make use of a low-cost standard substrate such as FR-4 on which baseband or digital circuits can be implemented so to obtain a very compact, high-performance, low-cost, and self-packaged millimeter-wave integrated system. Over Ka-band (U-band), it is shown that the air-filled SIW compared to its dielectric-filled counterparts based on Rogers substrates RT/Duroid 5880 and also 6002 reduces losses by a mean value of 0.068 dB/cm (0.098 dB/cm) and 0.104 dB/cm (0.152 dB/cm), increases average power-handling capability by 8 dB (6 dB) and 7.5 dB (5.7 dB), and quality factor by 2.7 (2.8) and 3.6 (3.8) times, respectively. The peak power-handling capability of the proposed structure is also studied. A wideband transition is presented to facilitate interconnects of the proposed air-filled SIW with dielectric-filled SIW. Design steps of this transition are detailed and its bandwidth limitation due to fabrication tolerances is theoretically examined and established. For validation purposes, a back-to-back transition operating over the Ka-band is fabricated. It achieves a return loss of better than 15 dB and an insertion loss of ${\hbox{0.6}} \pm {\hbox{0.2 dB}}$ ( ${\hbox{0.3}} \pm {\hbox{0.1}}~{\hbox{dB}}$ for the transition) from 27 to 40 GHz. Finally, two elementary circuits, namely, the T-junction and 90 $^{\circ}$ hybrid coupler based on the air-filled SIW, are also demonstrated.
223 citations
TL;DR: In this paper, three types of compact SIW-PS wide-band bandpass filters are proposed and investigated with simulation and experiment, with low insertion loss and sharp out-of-band characteristics observed from both simulated and measured results.
Abstract: It is known that the substrate integrated waveguide (SIW) features high-pass characteristics of the conventional waveguide, and a periodic structure (PS) generally presents bandstop characteristics. Therefore, a super-wide-band bandpass characteristic should be realized by combining some sort of PS into the SIW. In this paper, three types of compact SIW-PS wide-band bandpass filters are proposed and investigated with simulation and experiment. Performances of a super-wide bandpass, for instance, 8.5-16.5 GHz in this case study, with low insertion loss and sharp out-of-band characteristics are observed from both simulated and measured results.
202 citations
TL;DR: In this paper, a C-band elliptic filter with four folded MSIW cavities is simulated by using high frequency structure simulator software and fabricated with a two-layer printed circuit board process, measured results show good performance and in agreement with the simulated results.
Abstract: This letter presents the design and experiment of a novel elliptic filter based on the multilayered substrate integrated waveguide (MSIW) technique. A C-band elliptic filter with four folded MSIW cavities is simulated by using high frequency structure simulator software and fabricated with a two-layer printed circuit board process, the measured results show good performance and in agreement with the simulated results.
169 citations
Cites background from "Development of substrate integrated..."
...Power dividers are developed by Germain et al. in [ 5 ]....
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TL;DR: In this paper, a six-port junction based on the substrate integrated waveguide (SIW) technology is proposed and presented, in which an SIW power divider and SIW hybrid 3-dB coupler are designed as fundamental building blocks.
Abstract: A six-port junction based on the substrate integrated waveguide (SIW) technology is proposed and presented. In this design of such a junction, the SIW is first converted to an equivalent rectangular waveguide, then regular rectangular waveguide design techniques are used. In this structure, an SIW power divider and SIW hybrid 3-dB coupler are designed as fundamental building blocks. A six-port junction circuit operating at 24 GHz is fabricated and measured. Good agreement between simulated and measured results is found for the proposed six-port junction.
153 citations
References
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TL;DR: In this paper, a planar platform is developed in which the microstrip line and rectangular waveguide are fully integrated on the same substrate, and they are interconnected via a simple taper.
Abstract: Usually transitions from microstrip line to rectangular waveguide are made with three-dimensional complex mounting structures. In this paper, a new planar platform is developed in which the microstrip line and rectangular waveguide are fully integrated on the same substrate, and they are interconnected via a simple taper. Our experiments at 28 GHz show that an effective bandwidth of 12% at 20 dB return loss is obtained with an in-band insertion loss better than 0.3 dB. The new transition allows a complete integration of waveguide components on substrate with MICs and MMICs.
1,631 citations
TL;DR: In this article, a novel feed structure was proposed to excite a plane TEM wave in a parallel-plate waveguide, which is composed of densely arrayed posts on the same layer as the parallel plate.
Abstract: The authors propose a novel feed structure to excite a plane TEM wave in a parallel-plate waveguide. The feed waveguide is composed of densely arrayed posts on the same layer as the parallel plate. The posts can be easily fabricated at low cost by making metalized via holes in a grounded dielectric substrate. Such a procedure results in a quite simple fabrication of the antenna. The feed waveguide is designed to obtain a uniform division, which is confirmed by measurements on a 40-GHz band model.
568 citations
TL;DR: In this paper, a waveguide of new structure has been developed for millimeter-wave applications, which can be embedded in a substrate and is able to be wired in three dimensions, and its transmission characteristics are evaluated using a glass-ceramic substrate of dielectric constant, /spl epsiv/sub r/=5, and loss, tan /spl delta/=0.0008.
Abstract: A waveguide of new structure has been developed for millimeter-wave applications. The dielectric waveguide is constructed with sidewalls consisting of lined via-holes and edges of metallized planes. This structure can be manufactured by lamination techniques, so we refer to the waveguide as a "laminated waveguide". The laminated waveguide can be embedded in a substrate and is able to be wired in three dimensions. The transmission characteristics are evaluated using a glass-ceramic substrate of dielectric constant, /spl epsiv//sub r/=5, and loss, tan /spl delta/=0.0008. Insertion loss per unit length of the guide is estimated to be less than 0.5 dB/cm at 83 GHz. Furthermore, it was confirmed that the laminated waveguide is suitable to feeding lines for a small sized plane array antenna. By electromagnetic simulation, it has been confirmed that fundamental structures, such as bends, branches, power dividers, and interconnections between upper and lower layers can be realized with sufficient performances.
493 citations
01 Oct 2002
TL;DR: In this paper, a new design scheme and measurement results of circuit discontinuities on the basis of the recently proposed substrate integrated waveguide technology are presented, with respect to H-plane step, post resonator, 90° bend and 90° curvature, which are analyzed using an equivalent rectangular waveguide model.
Abstract: This paper presents a new design scheme and measurement results of circuit discontinuities on the basis of the recently proposed substrate integrated waveguide technology. Design considerations are discussed with respect to H-plane step, post resonator, 90° bend and 90° curvature, which are analyzed using an equivalent rectangular waveguide model. Results show a good agreement between design predictions and practical measurements. Loss properties of the discontinuities are also examined. It is demonstrated that the radiation loss of the new substrate integrated waveguide is smaller as compared to dielectric and conductor losses.
259 citations